Search results

A common method for understanding the thermal performance of epoxy laminate materials is to analyze the glass transition temperature using instruments such as differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA) and thermomechanical analysis (TMA). In order to characterize the long‐term performance of a finished printed circuit board, more advanced reliable test methods have been developed. This paper will discuss interconnect stress testing (IST), an accelerated fatigue test used for evaluating the failure modes of a printed circuit board (PCB) interconnect. IST utilizes a DC current to heat the PCB to the recommended temperatures within the interconnect. The plated through hole integrity and the post‐interconnect integrity can be monitored simultaneously. The test matrix compares the performance of various AlliedSignal epoxy laminate materials as a function of glass transition temperature (Tg) and board design.

This purpose of this paper is to provide an overview of the steps and processes behind successfully adapting novel materials, namely virgin glass and recycled glass, to three‐dimensional printing (3DP).

The transition from 3DP ceramic systems to glass systems will be examined in detail, including the necessary modifications to binder systems and printing parameters. The authors present preliminary engineering data on shrinkage, porosity, and density as functions of peak firing temperature, and provide a brief introduction to the complexities faced in realizing an adequate and repeatable firing method for 3D printed glass.

Shrinkage behavior for the 3D printed recycled glass showed significant anisotropy, especially beyond peak firing temperatures of 730°C. The average shrinkage ratios for the slow‐ and fast‐axes to the Z‐axis were 1:1.37 and 1:2.74, respectively. These extreme differences can be attributed to the layer‐by‐layer production method and binder burn‐off. At 760°C, the apparent porosity reached a minimum of 0.36 percent, indicative of asymptotic behavior that approaches a fully dense 3DP glass specimen. At low firing temperatures, the bulk density was similar to water, but increased to a maximum of 2.41 g/cm³. This indicates that 3DP recycled glass can behave similarly to common glass with accepted published bulk densities ranging from 2.4‐2.8 g/cm³.

Heating schedule analysis and optimization may reduce geometric variations, therefore, the firing method should be investigated in greater depth.

This paper provides a guide to successfully adopting glass to commercially available 3DP hardware. This research has also enabled rapid prototyping of recycled glass, a monumental step towards a sustainable future for 3DP.

The fashion in car colours changes with almost as much rapidity as do the fashions for the ‘modern miss’. Metallics, so popular for the last decade, are now losing ground to more solid colours, except for imported German cars, and the once popular duo‐tone finish is hardly ever seen.

This paper aims to present a phenomenological and quantitative model to study the constitutive relations and working mechanism for shape/temperature memory effect in polypyrrole (PPy)-based shape memory polymers (SMPs).

In this paper, the origin of relaxation law was used to theoretically predict the relationships between relaxation time and internal energy and temperature based on the thermodynamics of polymers.

A phenomenological model was proposed to quantitatively identify the factors that influence the stored mechanical energy, shape memory effect (SME) and temperature memory effect (TME) in PPy. Both structural relaxation law and Tool-Narayanaswamy (TN) model were used to couple the constitutive relations of stress and transition temperature as a function of relaxation frequency, respectively. Furthermore, the simulation of the phenomenological model was compared with experimental results reported in relevant literature for purpose of verification.

Exploration of the working mechanism underpinning the experimental (or phenomenal) results and significant enhancement of the understanding of relevant experimental features reported previously.

The outcome of this study will provide a powerful phenomenological and quantitative tool for studies on SME and TME in SMPs.

To meet the hybrid industry's growing need for low‐cost, high‐reliability, high‐density multilayer circuitry, the authors' company has developed a non‐warp, hermetic, non‐battery effect, crystallising dielectric for use with gold (Au) and silver (Ag) ‐based conductors. The crystallising nature of the dielectric, together with the use of glasses which do not contain highly mobile ions, ensures high dielectric Ag‐migration resistance. The crystalline structure of the dielectric also has the advantage of ensuring excellent solderability and bondability of top conductors. This paper will deal with the most important theoretical considerations when developing such a dielectric, together with its main properties and advantages. The results are supported by graphs and diagrams showing the properties of this new material.

As part of a manufacturing system, rapid prototyping (RP) should be integrated with other manufacturing technologies. To ensure that this integration is successful and intelligent, it is necessary to understand and incorporate the properties of RP components. Selective laser sintering (SLS) is an important RP method because of its wide range of materials which can be used. The properties of different SLS powders influence the fabrication parameters in the process and these fabrication parameters in turn affect the mechanical properties of the resultant component. SLS components generally require post‐processing which can also affect the mechanical properties. To obtain optimum quality output, knowledge of the effects of sintering and post‐processing must be incorporated into design and process planning.

An important disadvantage of conducting adhesives is their inferior heat conductivity when compared with soft solder such as Sn60Pb40. Thermal simulations, however, show that, by using thinner layers of adhesive than of solder, the module's thermal resistance does not increase greatly. Test modules with four different silver filled epoxy adhesives and tin/lead solder were manufactured. These test modules contained power diodes, 30 A, 1000 V, die bonded onto Ag/Pt thick film conductors on alumina. The die bond adhesive layer thicknesses were typically 30 or 40 μm. For die bond solder layers the thickness was 90 μm. The alumina substrates were connected to 3 mm thick copper plates with filled epoxy or silicone adhesive. The thickness of these layers was 150 μm or 50 μm, respectively. Thermal resistance of the structures was measured. The results showed that good adhesion between joined surfaces is essential for optimised heat flow. The heat conductivity of an adhesive was only a secondary factor affecting the structure's thermal resistance. When the adhesive joint is of good quality, the replacement of solder with conductive adhesives does not increase the module's thermal resistance any more than as shown by the simulations. It should, however, be remembered that the printing of thin (< 20 μm) uniform layers is not always possible.

Polymethyl methacrylate (PMMA) is a remarkable biocompatible material for bone cement and regeneration. It is also considered 3D printable but requires in-depth process–structure–properties studies. This study aims to elucidate the mechanistic effects of processing parameters and sterilization on PMMA-based implants.

The approach comprised manufacturing samples with different raster angle orientations to capitalize on the influence of the filament alignment with the loading direction. One sample set was sterilized using an autoclave, while another was kept as a reference. The samples underwent a comprehensive characterization regimen of mechanical tension, compression and flexural testing. Thermal and microscale mechanical properties were also analyzed to explore the extent of the appreciated modifications as a function of processing conditions.

Thermal and microscale mechanical properties remained almost unaltered, whereas the mesoscale mechanical behavior varied from the as-printed to the after-autoclaving specimens. Although the mechanical behavior reported a pronounced dependence on the printing orientation, sterilization had minimal effects on the properties of 3D printed PMMA structures. Nonetheless, notable changes in appearance were attributed, and heat reversed as a response to thermally driven conformational rearrangements of the molecules.

This research further deepens the viability of 3D printed PMMA for biomedical applications, contributing to the overall comprehension of the polymer and the thermal processes associated with its implementation in biomedical applications, including personalized implants.

Telecom equipment is subject to thermal cycles caused by both variations in temperature between day and night and variations in the telephone traffic. To simulate such thermal excursions, accelerated thermal cycle testing between — 10°C and 100°C has been established as a standard method within Ericsson Telecom. Thermal cycle tests have been carried out for frequencies ranging from one cycle per day to 30 cycles per hour in order to cover the different thermal excursions that occur in telecom equipment. It has been found that the life of a surface mounted PWB assembly can be predicted from the accelerated testing results using a frequency modified Coffin‐Manson relation. Factors which influence the fatigue life of solder joints such as solder material, compliant leads, compliant surface layers and mismatch between package and board are discussed. Based on results from accelerated testing it is suggested that the optimal PWB design for leadless ceramic chip carriers should be a moderate TCE matching combined with a compliant surface layer.

The purpose of this study is to investigate the thermoforming process of 3D-printed parts made from polylactic acid (PLA) and explore its application in producing wrist-hand orthoses. These orthoses were 3D printed flat, heated and molded to fit the patient’s hand. The advantages of such an approach include reduced production time and cost.

The study used both experimental and numerical methods to analyze the thermoforming process of PLA parts. Thermal and mechanical characteristics were determined at different temperatures and infill densities. An equivalent material model that considers infill within a print is proposed. Its practical use was proven using a coupled finite-element analysis model. The simulation strategy enabled a comparative analysis of the thermoforming behavior of orthoses with two designs by considering the combined impact of natural convection cooling and imposed structural loads.

The experimental results indicated that at 27°C and 35°C, the tensile specimens exhibited brittle failure irrespective of the infill density, whereas ductile behavior was observed at 45°C, 50°C and 55°C. The thermal conductivity of the material was found to be linearly related to the temperature of the specimen. Orthoses with circular open pockets required more time to complete the thermoforming process than those with hexagonal pockets. Hexagonal cutouts have a lower peak stress owing to the reduced reaction forces, resulting in a smoother thermoforming process.

This study contributes to the existing literature by specifically focusing on the thermoforming process of 3D-printed parts made from PLA. Experimental tests were conducted to gather thermal and mechanical data on specimens with two infill densities, and a finite-element model was developed to address the thermoforming process. These findings were applied to a comparative analysis of 3D-printed thermoformed wrist-hand orthoses that included open pockets with different designs, demonstrating the practical implications of this study’s outcomes.