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Article
Publication date: 1 February 1990

G. De Mey

In this contribution a short review is given on thermal analysis of hybrid circuits using 2‐D, 3‐D and time‐dependent models. It will be shown which models are necessary to be…

Abstract

In this contribution a short review is given on thermal analysis of hybrid circuits using 2‐D, 3‐D and time‐dependent models. It will be shown which models are necessary to be included in a CAD system for hybrid circuit design.

Details

Microelectronics International, vol. 7 no. 2
Type: Research Article
ISSN: 1356-5362

Article
Publication date: 1 March 1988

G. De Mey, L. Rottiers, M. Driscart, E. Boone and L. Van Schoor

In this paper the temperature distribution in hybrid circuits will be studied in two different ways. First of all the results of numerical simulations obtained with the programs…

Abstract

In this paper the temperature distribution in hybrid circuits will be studied in two different ways. First of all the results of numerical simulations obtained with the programs PROMETHEE and HYBRITHERM will be shown. Secondly, experimental temperature plots obtained with infra‐red thermography will be compared with the theoretical results. The influence of the substrate material (epoxy, glass, Al2O3, AlN and BeO) on the temperature distribution will be demonstrated. Various ways of cooling will also be considered. It will be shown that using high quality substrates such as AlN or BeO is not always useful from a thermal point of view.

Details

Microelectronics International, vol. 5 no. 3
Type: Research Article
ISSN: 1356-5362

Article
Publication date: 1 January 1988

G. De Mey and L. Van Schoor

In this contribution a linear thermal model for hybrid circuits is presented. Both the heat dissipated in screen printed resistors and in mounted components such as transistors…

Abstract

In this contribution a linear thermal model for hybrid circuits is presented. Both the heat dissipated in screen printed resistors and in mounted components such as transistors and integrated circuits is taken into account.

Details

Microelectronics International, vol. 5 no. 1
Type: Research Article
ISSN: 1356-5362

Article
Publication date: 1 March 1990

G. De Mey, E. Boone, G. Nachtergaele, S. Demolder and L. Rottiers

A review is given of the several heat transfer phenomena occurring in hybrid circuits. Most attention is devoted to the non‐linear properties. Some theoretical simulations and…

Abstract

A review is given of the several heat transfer phenomena occurring in hybrid circuits. Most attention is devoted to the non‐linear properties. Some theoretical simulations and experimental results are discussed.

Details

Microelectronics International, vol. 7 no. 3
Type: Research Article
ISSN: 1356-5362

Article
Publication date: 1 March 1991

G. De Mey

Computer algebra or symbolic manipulation is nothing else than performing analytical calculations with the help of a computer. This offers the advantage that lengthy and…

Abstract

Computer algebra or symbolic manipulation is nothing else than performing analytical calculations with the help of a computer. This offers the advantage that lengthy and complicated calculations can be carried out without errors in a very short time. Computer algebra techniques have also been applied to solve electrical networks. This offers particular advantages for hybrid circuit design, as will be outlined extensively in this paper.

Details

Microelectronics International, vol. 8 no. 3
Type: Research Article
ISSN: 1356-5362

Article
Publication date: 1 April 1987

G. DE MEY

An analytical theory based on a perturbation approach is presented to model planar resistors with a stochastic edge. The theoretical analysis is confirmed by Monte Carlo…

Abstract

An analytical theory based on a perturbation approach is presented to model planar resistors with a stochastic edge. The theoretical analysis is confirmed by Monte Carlo simulations.

Details

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, vol. 6 no. 4
Type: Research Article
ISSN: 0332-1649

Article
Publication date: 26 September 2018

Sheilla Atieno Odhiambo, Piotr Fiszer, Gilbert De Mey, Carla Hertleer, Ida Nuramdhani, Lieva Van Langenhove and Andrzej Napieralski

The purpose of this paper is to develop a capacitor fully integrated into a wearable textile fabric for the application on smart clothing.

Abstract

Purpose

The purpose of this paper is to develop a capacitor fully integrated into a wearable textile fabric for the application on smart clothing.

Design/methodology/approach

A small capacitor with stainless steel yarns as the electrodes and poly-(3,4–ethylenedioxythiophene): polystryrene sulphonate (PEDOT:PSS) as the dielectric material has been made, integrated into a textile fabric. The electric performance of the capacitor was analyzed and compared with other kinds of electric capacitors.

Findings

The fabricated small, PEDOT:PSS capacitor could finally power a calculator for 37 s with the energy stored in it.

Originality/value

This finding is of an important significance for a further development on the capacitor with a better performance.

Details

International Journal of Clothing Science and Technology, vol. 30 no. 6
Type: Research Article
ISSN: 0955-6222

Keywords

Article
Publication date: 1 April 1985

G. Casselman and G. De Mey

A finite difference method is presented to calculate the potential distribution in a trimmed resistor. The numerical results are used to study the influence of trimming on the…

Abstract

A finite difference method is presented to calculate the potential distribution in a trimmed resistor. The numerical results are used to study the influence of trimming on the power density distribution and the noise performance.

Details

Microelectronics International, vol. 2 no. 4
Type: Research Article
ISSN: 1356-5362

Article
Publication date: 1 January 1987

G. De Mey and S. Demolder

This paper describes a simple test configuration which allows an analytical solution for thermal analysis. Comparison with experimental measurements has been undertaken and…

Abstract

This paper describes a simple test configuration which allows an analytical solution for thermal analysis. Comparison with experimental measurements has been undertaken and complete agreement has been found.

Details

Microelectronics International, vol. 4 no. 1
Type: Research Article
ISSN: 1356-5362

Article
Publication date: 1 February 1986

G. Casselman and G. De Mey

The present paper describes a relaxation technique to calculate the two dimensional temperature distribution of a hybrid circuit made on a ceramic substrate. The method calculates…

Abstract

The present paper describes a relaxation technique to calculate the two dimensional temperature distribution of a hybrid circuit made on a ceramic substrate. The method calculates the potential and power density distribution in the resistors before the temperature is evaluated so that special effects due to trimming cuts can be analysed.

Details

Microelectronics International, vol. 3 no. 2
Type: Research Article
ISSN: 1356-5362

1 – 10 of 252