A Test Substrate for Thermal Analysis of Hybrid Circuits
G. De Mey
(Laboratory of Electronics, Ghent State University, Ghent, Belgium)
S. Demolder
(Laboratory of Electronics, Ghent State University, Ghent, Belgium)
19
Abstract
This paper describes a simple test configuration which allows an analytical solution for thermal analysis. Comparison with experimental measurements has been undertaken and complete agreement has been found.
Citation
De Mey, G. and Demolder, S. (1987), "A Test Substrate for Thermal Analysis of Hybrid Circuits", Microelectronics International, Vol. 4 No. 1, pp. 43-45. https://doi.org/10.1108/eb044260
Publisher
:MCB UP Ltd
Copyright © 1987, MCB UP Limited