Thermal Analysis in CAD of Hybrid Circuits
G. De Mey
(Laboratory of Electronics, Ghent State University, Ghent, Belgium)
19
Abstract
In this contribution a short review is given on thermal analysis of hybrid circuits using 2‐D, 3‐D and time‐dependent models. It will be shown which models are necessary to be included in a CAD system for hybrid circuit design.
Citation
De Mey, G. (1990), "Thermal Analysis in CAD of Hybrid Circuits", Microelectronics International, Vol. 7 No. 2, pp. 16-17. https://doi.org/10.1108/eb044409
Publisher
:MCB UP Ltd
Copyright © 1990, MCB UP Limited