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Presents an integrated approach to assembly planning for manufacturing printed circuit boards (PCBs). The integrated manufacturing assembly planning system (IMAPS) is a system that incorporates knowledge‐based techniques to assist process engineers with the development of assembly plans for building PCBs. IMAPS has been developed in a two‐year project with a multinational telecommunications manufacturer and the Alberta Research Council of Canada. The scope of IMAPS is to develop an integrated environment that takes full advantage of electronic information for assembly planning of PCBs. Several functions in the company can be integrated with IMAPS, including product design, detailed assembly planning, line balancing and generation of shop floor drawings. Information stored in the manufacturing and design databases of the corporation, about a PCB to be assembled, is employed by a knowledge‐based module to generate assembly plans to build the PCB. A line balancing procedure is employed to select the most adequate assembly plan of those generated by the knowledge‐based module. The final assembly plan is then presented to the operators as a diagram with instructions for the assembly of the PCB. IMAPS has increased the speed to generate assembly plans from 120 hours to four hours. The final computer‐aided assembly planning system implemented in the company has taken the concepts developed in IMAPS; they have been implemented in C and C++. Lessons and experiences learned while developing and implementing IMAPS are presented.

Electronic sub‐assemblies are now a common feature of many products. The final output of production in areas such as computers, consumer goods, instrumentation and telecommunications equipment contain one or more electronic sub‐assemblies. Electronic sub‐assemblies are complex components built from smaller components such as Integrated Circuits (ICs) assembled on to Printed Circuit Boards (PCBs). Testing is an important but non‐productive part of the process of electronic sub‐assembly. However, it is a means of cost avoidance and ultimately a requirement for staying in business.

In electronics assembly, the losses of electronic components throughout the surface‐mounting process (including kitting and setup) are hard to trace. This affects accurate material planning and manufacturing costing. This paper aims to investigate this issue and to generate a suitable mixture of strategies for the relevant causes.

The project is executed by an undergraduate manufacturing engineering student and several company engineers over a period of ten weeks. Define, measure, analyze, improve, and control (DMAIC) approach delineates the project stages. The solutions devised must be in agreement with lean philosophies and practices currently upheld in the company.

Component losses stem from multiple sources and are complicated by inherent information inaccuracies. A right mixture of strategies is envisaged on analysis on these sources. An average 18 percent of decrement in component losses in monetary value is achieved in the initial 16 weeks of the improvement phase.

The DMAIC approach induces a focused, systematic and thorough study on the selected area. For the limitations, this study is based on a single industrial case. The evidence may be anecdotal and idiosyncratic to the electronics assembly industry. The final solutions which emerged need to factor in the organization current maturities in Lean and Six Sigma concepts.

Component loss is a common problem faced by electronics assembly industries. In this paper, the nature of the problem and the related investigation are extensively illustrated in the context of the case study. As many electronics assembly industries have embarked on Lean or Lean Six Sigma journeys, the savings and data accuracy improvement achieved in this case study provide valuable benchmarks.

The issues related to electronic component losses have not been reported in established literature to date. This is also the first reported success case study of applying DMAIC to address these issues in a lean company.

Presents some experimental and theoretical results from research exploring the design rules and relevant process parameters in the assembly of electronic components using anisotropic conductive adhesive materials. The experimental configurations studies have geometries representative of flip‐chip and micro ball grid array chip scale packaging. Evaluates a range of materials combinations, including (random filled) adhesive materials based on both thermoplastic and thermo‐setting resin systems, combined with both glass reinforced polymer printed circuit board and silver palladium thick film on ceramic substrate materials. Also presents a summary of assembly experiments which have been conducted using a specially developed instrumented assembly system. This test rig allows the measurement of the process temperatures and pressures and their relationship with the consequent bondline thickness reduction and conductivity development. Finally summarizes the capabilities of models which have been developed of the assembly process and of the final joint properties.

The purpose of the present study was to review the thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the review include challenges in modelling of the reflow soldering process, optimization and the future challenges in the reflow soldering process. Besides, the numerical approach of lead-free solder reliability is also discussed.

Lead-free reflow soldering is one of the most significant processes in the development of surface mount technology, especially toward the miniaturization of the advanced SMCs package. The challenges lead to more complex thermal responses when the PCB assembly passes through the reflow oven. The virtual modelling tools facilitate the modelling and simulation of the lead-free reflow process, which provide more data and clear visualization on the particular process.

With the growing trend of computer power and software capability, the multidisciplinary simulation, such as the temperature and thermal stress of lead-free SMCs, under the influenced of a specific process atmosphere can be provided. A simulation modelling technique for the thermal response and flow field prediction of a reflow process is cost-effective and has greatly helped the engineer to eliminate guesswork. Besides, simulated-based optimization methods of the reflow process have gained popularity because of them being economical and have reduced time-consumption, and these provide more information compared to the experimental hardware. The advantages and disadvantages of the simulation modelling in the reflow soldering process are also briefly discussed.

This literature review provides the engineers and researchers with a profound understanding of the thermo-mechanical challenges of reflowed lead-free solder joints in SMCs and the challenges of simulation modelling in the reflow process.

The unique challenges in solder joint reliability, and direction of future research in reflow process were identified to clarify the solutions to solve lead-free reliability issues in the electronics manufacturing industry.

This paper aims to design a novel jaw gripper with human-sized anthropomorphic features to be suitable for precise in-hand posture transitions, such as twisting and re-positioning. The growing demand from traditional high-mix low-volume and new massive customized manufacturing industry requires the robot with configurability and flexibility. In the electronic manufacturing industry particularly, the design of the robotic hand with sufficient dexterity and configuration is important for the robot to accomplish the assembly task reliably and robustly. It is important for the robot to be able to grasp and manipulate a large number of assembly parts or tools.

In this research, a novel jaw-like gripper with human-sized anthropomorphic features is designed for online in-hand precise positioning and twisting. It retains the simplicity feature of traditional industrial grippers and dexterity features of dexterous robotic hands.

The gripper is able to apply suitable gripping force on assembly parts and performs reliable twisting movement within limited time to meet the industrial requirements. Manipulating several cylindrical assembly parts by robot, as an experimental case in this paper, is studied to evaluate its performance. The effectiveness of proposed gripper design and mechanical analysis is proved by the simulation and experimental results.

The main originality of this research is that a novel jaw gripper with human-sized anthropomorphic features is designed to be suitable for precise in-hand posture transitions, such as twisting and re-positioning. With this gripper, the robotic system will be sufficiently flexible to deal with various assembly tasks.

The purpose of this paper is to determine the dependence of mechanical strength of solder joints on printed circuit boards from the soldering process parameters and operating conditions of the electronic device.

The research was performed using the Taguchi method of planning of experiments. Evaluation of the quality of solder joints was made on the basis of microscopic observations, X-ray analysis and measurements of shear force of solder joints.

The carried out research has shown the influence of the individual parameters of the soldering process on the mechanical strength of solder joints and the mechanism of damage of solder joints under the influence of shear force.

The authors present results of their research using advanced techniques of experimental design and analysis of results. In this study, original approach was used to simulate the operational conditions of electronic devices including thermal imaging technology.

The purpose of this paper is to focus on the assembly quality of copier products, specifically, concentrating on the prediction of the operator‐induced assembly defect.

Based on the Shibata model, the design‐based assembly complexity is redesigned. And the Sony Standard Time is replaced by the Fuji Xerox Standard Time in the calculation of the process‐based assembly complexity. Furthermore, different correlation functions are attempted and comparatively studied in the regression analysis. Thereby, a new defect rate prediction model is proposed and validated with three copier assembly cases.

The new proposed model is much more accurate and stable in the human‐induced assembly defect prediction in copier production.

The proposed model can be used to ensure the assembly quality by removing potential defects at the structure and process design stages. Meanwhile, with this model, the interactions between the engineers and designers can be more effective.

This paper presents a novel assembly defect rate prediction model for copier assembly quality management.

The potentially highly automated process of surface mounting electronic components directly onto a substrate or printed circuit board possesses a very weak link. Component movement subsequent to placement and before or during solder reflow leads to defect conditions such as tombstoning or rotational misalignment. This work investigates the feasibility of replacing this ‘weak’ assembly step(s) with ultrasonics. The selection and modification of suitable ultrasonic equipment is described as in the bonding of chip components onto PCBs. Reliability analysis of the resultant bonds along with bond quality in terms of shear strength and appearance under scanning electron microscope and optical microscope is studied. The results show that, with certain preferred directions of ultrasonic weld, weld preload and weld time bond strengths obtained compare very favourably with those achieved with the present surface mount technology reflow process, hence establishing the feasibility of ultrasonics for this application.