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This paper aims to reproduce the electrical connector intermittent fault behaviours with step-up vibration stress while maintaining the integrity of the product.

A dynamic model of an electrical connector under vibration is established for contact resistance analysis. Next, the dynamic characteristics of contact resistance are analysed, and cumulative damage theory is used to calculate the damage under different stresses during the intermittent fault reproduction test. To reduce damage and improve efficiency, the step-up stress is used for the reproduction test.

The proposed method can reproduce the intermittent fault behaviour, and the step-up stress test is more efficient than the constant stress test.

Step-up stress is used for intermittent fault reproduction, and the quantitative relationships between intermittent fault and product damage can be further studied.

It is expected that the proposed methodology can help engineers to reproduce the intermittent fault behaviours to facilitate the detection and diagnosis of intermittent fault and to improve equipment safety.

The mechanism of electrical connector reproduction is analysed and the step-up stress test is used for intermittent fault reproduction.

Numerical techniques and experimental methods for the electrical characterisation and design of large multilayer thick film circuit boards are discussed. The numerical techniques investigated here include the boundary element and finite element methods for the estimation of capacitance and inductance and the method of normal modes for the analysis of voltage crosstalk between coupled transmission lines. Three‐dimensional capacitance and inductance calculations are included for typical thick film signal line and power and ground grid plane configurations. Numerical results are compared with measured data obtained from carefully constructed test coupons. Electrical characteristics of several popular high speed logic families and their compatibility with multilayer thick film interconnects are discussed and guidelines for the design of large thick film circuit boards for high speed digital applications are presented.

Your computer may talk to other computers with light, over a glass data highway — fibre optic cabling. Since more and more personal computers and terminals are being connected to larger computer networks with light‐carrying fibre optics, you should know some of the do's and don'ts on how to use them and take care of them. Once you determine that your workstation uses pulses of light to communicate, you can do something to ensure that the light doesn't go out.

TO say that the Twenty‐fourth S.B.A.C. Show was an unqualified success is perhaps to gild the lily. True there were disappointments— the delay which kept the TSR‐2 on the ground until well after the Show being one—but on the whole the British industry was well pleased with Farnborough week and if future sales could be related to the number of visitors then the order books would be full for many years to come. The total attendance at the Show was well over 400,000—this figure including just under 300,000 members of the public who paid to enter on the last three days of the Show. Those who argued in favour of allowing a two‐year interval between the 1962 Show and this one seem to be fully vindicated, for these attendance figures are an all‐time record. This augurs well for the future for it would appear that potential customers from overseas are still anxious to attend the Farnborough Show, while the public attendance figures indicate that Britain is still air‐minded to a very healthy degree. It is difficult to pick out any one feature or even one aircraft as being really outstanding at Farnborough, but certainly the range of rear‐engined civil jets (HS. 125, BAC One‐Eleven, Trident and VCIQ) served as a re‐minder that British aeronautical engineering prowess is without parallel, while the number of rotorcraft to be seen in the flying display empha‐sized the growing importance of the helicopter in both civil and military operations. As far as the value of Farnborough is concerned, it is certainly a most useful shop window for British aerospace products, and if few new orders are actually received at Farnborough, a very large number are announced— as our ’Orders and Contracts' column on page 332 bears witness. It is not possible to cover every exhibit displayed at the Farnborough Show but the following report describes a wide cross‐section beginning with the exhibits of the major airframe and engine companies.

Details of Electrical and Electronic Apparatus with Applications in the Maintenance and Operation of Aircraft, Missiles and Space Vehicles. A new addition to Jermyn Products Division's range of printed circuit board dual‐in‐line sockets is now available from stock. The A23/2028 accepts integrated circuits, relays and other electronic devices housed within ‘plug in’ packages having 14 leads on 0·1 in. centres, with row spacing of 0·3 in.

This paper aims to present the results of physical analysis that was conducted on Toyota's electronic engine control system including accelerator pedal position sensors (APPSs). The paper overviews the analyses and focuses on the discovery of tin whiskers found in the accelerator pedal assembly, which are an electrical failure concern.

Analytical techniques such as X‐ray fluorescence spectroscopy, scanning electron microscopy and energy dispersive spectroscopy are utilized to present a construction analysis of the APPS.

The use of a tin finish in the APPS is a cause for concern. Tin finishes are known to produce metal whiskers that are conductive and capable of creating unintended current leakage paths. In the analysis, a significant number of tin whiskers were found.

The methodology discussed in this paper can be implemented to inspect for tin whiskers in the APPSs.

The paper begins a construction analysis of different parts of the Toyota engine control module and APPSs and then moves on to highlight electronics design issues that can comprise the engine control system and cause unintended consequences.

The electronics industry has grown over the past 50 years, mostly in developed countries, contributing to their economic progress. Particularly in the Baja California State located in the northwest of Mexico, these companies have prospered in the industrial parks of Mexicali considered as an arid zone and Ensenada, a port and city on the Pacific Ocean considered as a marine region. In both environments, during winter and summer, the climate impacts on indoor conditions, affecting humidity and temperature, and generating corrosion which decreases the yields of the electronic devices and industrial machines. The purpose of this paper is to investigate the effects of corrosion on electronic devices in these arid and marine environments.

The paper determines the corrosivity levels inside industrial plants of desertic and coast regions in Mexico, to evaluate the deterioration of electronic metals.

Relative humidity, temperature, time of wetness, are recorded and related to the corrosion process in arid and marine environments.

Some missing information about air pollution in Ensenada from some Environmental Monitoring Stations was a limitation, and the need to use complex atmospheric techniques.

The paper shows that it is very important to control metallic corrosion generated by climate factors and air pollution in indoor industrial plants: the corrosion of electronic devices and equipments depletes their yield and can lead to loss‐making failures.

In this issue of the Journal we continue with our series on National and International Committees by examining the work carried out by Panel J of the Radio and Electronic Components Manufacturers Federation (RECMF). Note: Readers who are associated with, or are members of committees dealing with printed circuits or applied techniques are invited to contact the Editor with a view to preparing an article on their behalf for publication in this series. This invitation is extended to readers on a world wide basis.

Explains the raison d’être of the Sprite aerial robot and describes the system engineering, including a description of a range of interchangeable payloads to suit various mission applications. Outlines the performance and control of the robot, and discusses its special characteristics, showing its adaptability for a number of roles, military and civilian. Identifies further applications of the system, which has been trialled in a number of applications worldwide. Finally, explains its current status and indicates the first costs of the system.