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The purpose of this study is to provide a micro-nano chip automatic alignment system. Used for micron and nanometer channel alignment of microfluidic chip.

In this paper, combined with the reconstructed micro–nanoscale Hough transform theory, a “clamp–adsorb–rotate” chip alignment method is proposed. The designed alignment system includes a microscopic identification device, a clamping device and a suction device. After assembly, the straightness of the linear slide rail in the horizontal and vertical directions was tested, respectively. The results show that in the horizontal and vertical directions, the linearity error of the linear slide is +0.29 and 0.30 µm, respectively, which meets the requirement of chip alignment accuracy of 15 µm. In the direction of rotation, the angular error between the microchannel and the nanochannel is ±0.5°. In addition, an alignment flow experiment of the chip is designed. The results demonstrate that the closer the angle between the microchannel and the nanochannel is to 90°, the fluid fills the entire channel. Compared with the conventional method, the method and the assembly system realize fully automatic double-layer chip alignment.

A mechanical device designed by Hough transform theory can realize microfluidic chip alignment at nanometer and micron level.

The automatic alignment device adopts Hough transform principle and can be used for microfluidic chip alignment.

With the development of electronic devices, including the desires of integration, miniaturization, high performance and the output power, cooling requirement of chips have been increased gradually. Water-cooled minichannel is an effective cooling technology for cooling of heat sinks. The minichannel flow geometry offers large surface area for heat transfer and a high convective heat transfer coefficient with only a moderate pressure loss. The purpose of this paper is to analyze a minichannel heat sink having the bottom size of 35 mm×35 mm numerically. Two kinds of chip arrangement are investigated: diagonal arrangement and parallel arrangement.

Computational fluid dynamics (CFD) technique is used to investigate the flow and thermal fields in forced convection in a three-dimensional minichannels heat sink with different chip arrangements. The standard k-e turbulence model is applied for the turbulence simulations on the minichannel heat sink.

The results show that the bottom surface of the heat sink with various chip arrangements will have different temperature distribution and thermal resistance. A suitable chip arrangement will achieve a good cooling performance for electronic devices.

The fluid is incompressible and the thermophysical properties are constant.

New and additional data will be helpful as guidelines in the design of heat sinks to achieve a good thermal performance and a long lifetime in operation.

In real engineering situations, chips are always placed in various manners according to design conditions and constraints. In this case the assumption of uniform heat flux is acceptable for the surfaces of the chips rather than for the entire bottom surface of the heat sink.

This paper aims to use nano-silver paste to design a new bonding method for super-large-area direct-bonded-aluminum (DBA) plates. It compared several frequently used bonding methods and proved the feasibility of an optimized low-pressure-assisted double-layer-printed silver sintering technology for large-area bonding to increase the thermal conductivity of power electronic modules with high junction temperature, higher power density and higher reliability.

The bonding profile was optimized by using transparent glasses as substrates. Thus, the bonding qualities could be directly characterized by optical observation. After sintering, the bonded DBA samples were characterized by nondestructive X-ray computed tomography system, scanning electron microscopy equipped with an energy dispersive spectrometer. Finally, bonding stress evolution was characterized by shear tests.

Low-pressure-assisted large-area double-layer-printed bonding process consisting of six-step was successfully developed to bond DBA substrates with the size of 50.8 × 25.4 mm. The thickness of the sintered-silver bond-line was between 33  and 74 µm with the average porosity of 12.5 per cent. The distribution of shear strength along the length of DBA/DBA bonded sample was from 9.7  to 18.8 MPa, with average shear strength of 15.5 MPa. The typical fracture primarily propagated in the sintered-silver layer and partially along the Ni layer.

The bonding stress needs to be further improved. Meanwhile, the thermal and electrical properties are encouraged to test further.

If nano-silver paste can be used as thermal interfacial material for super-large-area bonding, the thermal performance will be improved.

The paper accelerated the use of nano-silver paste for super-large-area DBA bonding.

The proposed bonding method greatly decreased the bonding pressure.

The characteristics of fluid motions in micro-channel are strong fluid-wall surface interactions, high surface to volume ratio, extremely low Reynolds number laminar flow, surface roughness and wall surface or zeta potential. Due to zeta potential, an electrical double layer (EDL) is formed in the vicinity of the wall surface, namely, the stern layer (layer of immobile ions) and diffuse layer (layer of mobile ions). Hence, its competent designs demand more efficient micro-scale mixing mechanisms. This paper aims to therefore carry out numerical investigations of electro osmotic flow and mixing in a constricted microchannel by modifying the existing immersed boundary method.

The numerical solution of electro-osmotic flow is obtained by linking Navier–Stokes equation with Poisson and Nernst–Planck equation for electric field and transportation of ion, respectively. Fluids with different concentrations enter the microchannel and its mixing along its way is simulated by solving the governing equation specified for the concentration field. Both the electro-osmotic effects and channel constriction constitute a hybrid mixing technique, a combination of passive and active methods. In microchannels, the chief factors affecting the mixing efficiency were studied efficiently from results obtained numerically.

The results indicate that the mixing efficiency is influenced with a change in zeta potential (ζ), number of triangular obstacles, EDL thickness (λ). Mixing efficiency decreases with an increment in external electric field strength (Ex), Peclet number (Pe) and Reynolds number (Re). Mixing efficiency is increased from 28.2 to 50.2% with an increase in the number of triangular obstacles from 1 to 5. As the value of Re and Pe is decreased, the overall percentage increase in the mixing efficiency is 56.4% for the case of a mixing micro-channel constricted with five triangular obstacles. It is also vivid that as the EDL overlaps in the micro-channel, the mixing efficiency is 52.7% for the given zeta potential, Re and Pe values. The findings of this study may be useful in biomedical, biotechnological, drug delivery applications, cooling of microchips and deoxyribonucleic acid hybridization.

The process of mixing in microchannels is widely studied due to its application in various microfluidic devices like micro electromechanical systems and lab-on-a-chip devices. Hence, its competent designs demand more efficient micro-scale mixing mechanisms. The present study carries out numerical investigations by modifying the existing immersed boundary method, on pressure-driven electro osmotic flow and mixing in a constricted microchannel using the varied number of triangular obstacles by using a modified immersed boundary method. In microchannels, the theory of EDL combined with pressure-driven flow elucidates the electro-osmotic flow.

The purpose of this study is to obtain the numerical as well as regularity results for the nonlinear elliptic set of equations arising in the study of fluid flow in microchannel induced by the pressure in the presence of interfacial electrokinetic effects.

For the numerical study, the authors implemented traditional FDM approach, and for the regularity results they used the classical energy estimates. The interfacial electrokinetic effects result in an additional source term in classical momentum equation, hence affecting the characteristics of the flow and heat transfer. The sinusoidal temperature variation is assumed on side walls.

The results were obtained for various combinations of physical parameters appearing in the governing equations. This study concludes that in the presence of electric double layer, the average heat transfer rate reduces along with larger values of Reynolds number. It is observed that the heat transfer increases with the increase in amplitude ratio and phase deviation. The flow behavior and heat transfer rate inside the microchannel are also strongly affected by the presence of κ (kappa).

To the best of the authors’ knowledge, the problem of heat transfer through microchannel in combination with sinusoidal temperature variation at boundary with electric double layer effects has not been considered previously. Hence, this paper focuses on the influence of the sinusoidal boundary temperature distributions on both sidewalls of a rectangular microchannel through parallel plates with electrokinetic effects on the pressure-driven laminar flow. In addition, a detailed mathematical analysis is also to be carried out to verify the regularity of this model with the proposed boundary conditions. The study used the classical energy method to get the regularity results.

A convection‐diffusion‐reaction scheme is proposed in this study to simulate the high gradient electroosmotic flow behavior in microchannels. The equations governing the total electric field include the Laplace equation for the effective electrical potential and the Poisson‐Boltzmann equation for the electrical potential in the electric double layer.

Mixed electroosmotic/pressure‐driven flow in a straight microchannel is studied with the emphasis on the Joule heat in the equations of motion. The nonlinear behaviors resulting from the hydrodynamic, thermal and electrical three‐field coupling and the temperature‐dependent fluid viscosity, thermal conductivity, electrical permittivity, and conductivity of the investigated buffer solution are analyzed.

The solutions computed from the employed flux discretization scheme for the hydrodynamic, thermal and electric field equations have been verified to have good agreement with the analytical solution. Parametric studies have been carried out by varying the electrical conductivity at the fixed zeta potential and varying the zeta potential at the fixed electrical conductivity.

Investigation is also addressed on the predicted velocity boundary layer and the electric double layer near the negatively charged channel wall.

Recently, powerful instruments for biomedical engineering research studies, including disease modeling, drug designing and nano-drug delivering, have been extremely investigated by researchers. Particularly, investigation in various microfluidics techniques and novel biomedical approaches for microfluidic-based substrate have progressed in recent years, and therefore, various cell culture platforms have been manufactured for these types of approaches. These microinstruments, known as tissue chip platforms, mimic in vivo living tissue and exhibit more physiologically similar vitro models of human tissues. Using lab-on-a-chip technologies in vitro cell culturing quickly caused in optimized systems of tissues compared to static culture. These chipsets prepare cell culture media to mimic physiological reactions and behaviors.

The authors used the application of lab chip instruments as a versatile tool for point of health-care (PHC) applications, and the authors applied a current progress in various platforms toward biochip DNA sensors as an alternative to the general bio electrochemical sensors. Basically, optical sensing is related to the intercalation between glass surfaces containing biomolecules with fluorescence and, subsequently, its reflected light that arises from the characteristics of the chemical agents. Recently, various techniques using optical fiber have progressed significantly, and researchers apply highlighted remarks and future perspectives of these kinds of platforms for PHC applications.

The authors assembled several microfluidic chips through cell culture and immune-fluorescent, as well as using microscopy measurement and image analysis for RNA sequencing. By this work, several chip assemblies were fabricated, and the application of the fluidic routing mechanism enables us to provide chip-to-chip communication with a variety of tissue-on-a-chip. By lab-on-a-chip techniques, the authors exhibited that coating the cell membrane via poly-dopamine and collagen was the best cell membrane coating due to the monolayer growth and differentiation of the cell types during the differentiation period. The authors found the artificial membrane, through coating with Collagen-A, has improved the growth of mouse podocytes cells-5 compared with the fibronectin-coated membrane.

The authors could distinguish the differences across the patient cohort when they used a collagen-coated microfluidic chip. For instance, von Willebrand factor, a blood glycoprotein that promotes hemostasis, can be identified and measured through these type-coated microfluidic chips.

This paper aims to focus on the steps necessary to bolster marketability of ISFET‐based sensors, keeping in view the present technological status of ISFET and its limitations.

Technical problems inhibiting commercialization of ISFET‐based sensors are highlighted. The problems considered include sensitivity, drift, cleaning, disposability, reference systems, chip structural designs, packaging, light, temperature, hysteresis and body effects, and instability of biosensors. Available solutions are prescribed, discussing both direct and indirect ways of addressing the problems of ISFET sensors.

The history of progress of ISFET (Ion‐sensitive Field‐Effect Transistor) is synonymous with the ways and means devised by different researchers for surmounting (direct approach) or acclimatizing to the shortcomings of this device (indirect approach). Signal conditioning hardware and software considerably help in obviating issues such as drift, hysteresis and thermal effects.

Reliable on‐chip reference electrodes and ISFET packaging for continuous online applications are interesting research areas.

Where a plausible solution exists, it should be readily availed; otherwise the device limitation should be understood and ingeniously bypassed. Compromising solutions targeted on the specific applications pave the way towards widespread utilization of these sensors in industrial, biomedical, food and environmental sectors.

The study helps in understanding the problems besetting utilization of ISFETs, calling attention to essential remedies for ISFET‐based products. It provides information of value to those involved in ISFET measurements.

Electronic packaging is increasingly becoming a vital part of the electronics industry, representing a key barrier to cost reduction and performance improvement. Of all the packaging methods, flip‐chip technology offers, up to now, the highest packaging density and best electrical performance. In this paper, flip‐chip test design considerations, process development and driving forces for adhesive joining and soldering flip‐chip processes will be given. Reliability test results of flip‐chip interconnection technology using conductive adhesive joining will also be presented. The electrical contact nature of the adhesive joint will be elaborated in the light of continuous and static electrical resistance measurement. Future research work directions in flip‐chip joining using eutectic solder and conductive adhesives on flexible circuits will also be discussed.

The purpose of this paper is to simulate micro direct methanol fuel cells (DMFCs) for portable electronic devices by means of a non‐linear equivalent circuit based on a fully coupled, dynamic, electrochemical model.

The equivalent circuit accounts for electrochemical reactions and electric current generation inside the catalyst layers, electronic and protonic conduction, fuel crossover across the membrane, mass transport of reactants inside the diffusion layers. The V‐I characteristic of the device is obtained by combining mass transport and electric equations. The transient dynamics is accounted for by an equivalent capacitance, while the slow dynamics by the mass conservation equation. The equivalent circuit is embedded in the Matlab/Simulink^® dynamic model of a hybrid system, consisting of a micro fuel cell and a Li‐ion rechargeable battery.

An original equivalent circuit of a passive DMFC suitable for static and dynamic simulations under variable loading conditions is proposed and validated.

The one‐dimensional model of the micro cell does not take into account transverse mass transfer and current density variations in the cell layers, which can be due to non‐homogeneous materials or to the complex dynamics of the convective mass flow in the reservoir and in the room air.

The equivalent circuit can be used for simulating the dynamic performance in realistic operating conditions when the fuel cell is used to supply the electronic equipment through a power management unit.

The DMFC is described from an electrical point of view as a controlled non‐linear generator; such equivalent representation is particularly suited for designing power management units for electronic portable devices.