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A review has been made of the various factors involved in the design and manufacture of bonded heat sinks for printed circuit boards. Among the factors discussed are the design of heat sink thicknesses and the interrelationship with component lead geometry, the design of heat sink geometry as related to the fabrication of the heat sinks and bonding media, and the complexities of the bonding process itself.

This study aims to capture the heat transfer and entropy generation characteristics of temperature-dependent nano-encapsulated phase change material (NEPCM) slurry in a hybrid wavy microchannel. In addition, the effect of substrate material combined with NEPCM slurry on conjugate heat transfer condition is captured for different microchannel heat sinks.

A novel “hybrid wavy microchannel” is proposed to enhance the overall heat transfer and reduce the pressure drop by combining wavy and raccoon geometry. NEPCM–water slurry is implied in the hybrid wavy, conventional wavy and raccoon microchannel. A user-defined function (UDF) is used to observe the effect of phase-change of paraffin material in thermophysical properties of NEPCM–water nanofluid. All three (hybrid, wavy, raccoon) microchannels are engraved on a rectangular substrate of 1.8 mm width (ωs) and 30 mm length (L), respectively. For hybrid, wavy and raccoon microchannel, waviness (γ) of 0.067 is selected for the investigation.

The result shows that NEPCM particle presence reduces the fluid domain temperature. The thermal performance of proposed Heat sink 2 is found better than the Heat sink 1. The effect of the geometrical modification, wall thermal conductivity, different volumetric concentrations of nanoparticles (ϕ ∼ 1 – 5%) and Reynolds number (Re ∼ 100 – 500) on thermodynamic irreversibility is also observed. Additionally, the effect of thermal and frictional entropy generation is reduced with a combination of NEPCM slurry and higher conductive material for all heat sinks.

A combination of NEPCM slurry with laminar flow microchannel cooling system emerged as a better alternative over other cooling techniques for higher power density devices such as microprocessors, electronic radar systems, aerospace applications, semiconductors, power electronics in modern electronic vehicles, high power lasers, etc.

The phase-change process of the NEPCM slurry is tracked under conjugate heat transfer in a hybrid wavy microchannel. Furthermore, the phase-change process of NEPCM slurry is captured with different heat sink materials (SS316, silicon and copper) under conjugate heat transfer situation for different heat sinks and concentrations (ϕ ∼ 1–5) of NEPCM.

The purpose of this paper is to present a porous medium model for forced air convection in pin/plate‐fin heat sinks subjected to non‐uniform heating of a hot gas impinging jet. Parametric studies are performed to provide comparisons between inline square pin‐fin and plate‐fin heat sinks in terms of overall and local thermal performance for a fixed pressure drop.

Heat conduction in substrates is coupled with forced convection in the pin/plate‐fin flow channel. The forced convection is considered by employing the non‐Darcy model for fluid flow and the thermal non‐equilibrium model for heat transfer. A series of experiments is performed to validate the model for both the pin‐fin and plate‐fin heat sinks.

The present porous medium model is capable of capturing the presence of lateral heat spreading in the plate‐fins and the absence of lateral heat spreading in the pin‐fins under non‐uniform thermal boundary condition, attributing to the adoption of the orthotropic effective thermal conductivity for the solid phase in the energy equation. The present results show that the inline square pin‐fin heat sink has topological advantage over the plate‐fin heat sink, although the heat spreading through the plate‐fins on reducing the peak temperature on the substrate is pronounced.

This paper reports an original research on theoretical modeling of forced convection in pin/plate‐fin heat sinks subjected to the non‐uniform heating of an impinging jet.

The purpose of this paper is to examine the thermal and dynamic performance of the plate-fin heat sink fitted with a shield in the bypass.

The governing equations were solved using the finite volume method based on the SIMPLE algorithm. The k-ω Shear Stress Transport was used to model turbulence. The thermal and dynamic results were presented in term of average Nusselt number and friction factor, respectively. The effect of the height (Hs=6, 10 and 13) and the position (X=0, 1/3, 1/2, 2/3 and 3/4) of the shield was studied for a Reynolds number ranging from 2×103 to 12×103 and compared with a heat sink without shield. To evaluate the performance of different heat sink geometries, the efficiency was presented and discussed.

By adding a shield in the bypass, a greater amount of air is injected between the heat sink fins, which improves the heat transfer (advantage) of the one part, and increases the friction on the other hand (disadvantage). The efficiency of the heat sink varies inversely proportional with the Reynolds number.

The originality of this work is the method for enhancement of heat transfer.

With development of the modern electronic and mechanical devices, cooling requirement has become a serious challenge. Innovative heat transfer enhancement methods are generally accompanied by undesirable increase of pressure drop and consequently a pumping power penalty. The current study aims to present a novel and easy method to manufacture a mini heat sink using porous fins and magnetite nanofluid (Fe₃O₄/water) as the coolant for simultaneous heat transfer enhancement and pressure drop reduction.

A three-dimensional numerical study is carried out to evaluate the thermal and hydrodynamic performance of the mini heat sink at different volume fractions, porosities and Reynolds numbers, using finite volume method. The solver specifications for discretization of the domain involve the SIMPLE, second-order upwind and second order for pressure, momentum and energy, respectively.

Results show that porous fins have a favorable effect on both heat transfer and pressure drop compared to solid fins. Creation of a virtual velocity slip on the channel-fin interfaces similar to the micro scale conditions and the flow permeation into the porous fins are the main mechanisms of pressure drop reduction. On the other hand, the heat transfer enhancement is attributed to the increase of the solid-fluid contact area and the improvement of the flow mixing because of the flow permeation into the porous fins. An optimal porosity for maximum convective heat transfer enhancement is obtained as a function of Reynolds number. However, taking both pressure drop and heat transfer effects into account, the overall heat sink performance is shown to be improved at high of Reynolds numbers, volume fractions and fin porosities.

Thermal radiation and gravity effects are ignored, and thermal equilibrium is assumed between solid and fluid phases.

A maximum of 32 per cent increase of convective heat transfer is achieved along with a maximum of 33 per cent reduction in the pressure drop using porous fins and ferrofluid in heat sink.

The purpose of the study is to optimise the cross-sectional shape of passively cooled horizontally mounted pin-fin heat sink for higher cooling performance and lower material usage.

Multi-objective shape optimisation technique is used to design the heat sink fins. Non-dominated sorting genetic algorithm (NSGA-II) is combined with a geometric module to develop the shape optimiser. High-fidelity computational fluid dynamics (CFD) is used to evaluate the design objectives. Separate optimisations are carried out to design the shape of bottom row fins and middle row fins of a pin-fin heat sink. Finally, a computational validation was conducted by generating a three-dimensional pin-fin heat sink using optimised fin cross sections and comparing its performance against the circular pin-fin heat sink with the same inter-fin spacing value.

Heat sink with optimised fin cross sections has 1.6% higher cooling effectiveness than circular pin-fin heat sink of same material volume, and has 10.3% higher cooling effectiveness than the pin-fin heat sink of same characteristics fin dimension. The special geometric features of optimised fins that resulted in superior performance are highlighted. Further, Pareto-optimal fronts for this multi-objective optimisation problem are obtained for different fin design scenarios.

For the first time, passively cooled heat sink’s cross-sectional shapes are optimised for different spatial arrangements, using NSGA-II-based shape optimiser, which makes use of CFD solver to evaluate the design objectives. The optimised, high-performance shapes will find direct application to cool power electronic equipment.

The purpose of this paper is to present a way to determine the optimum values of design parameters in a cylindrical heat sink with branched fins. Investigations into the effect of design parameters, such as the number of fins, length of fin, height of fin and outer diameter of the heat sink on heat transfer are reported here. In this analysis, branch angle (α = 10°) is considered.

The Taguchi method, a powerful tool to design optimization, is applied for the tests and standard L9 orthogonal array with three factors, and three levels for each factor are selected. Nine test samples are analyzed in which the total heat transfer rate for each test sample is found. Contribution ratios for each parameter are also found. The results obtained from this analysis are used to find the optimum design parameter values relating to the heat sink performance.

The optimum design parameters are analyzed in this paper. The reliability of the optimum test samples is verified. Also, the variation of the average heat transfer rate of optimum sample is reported when it is compared with the reference sample.

Effective design of a cylindrical heat sink has been reported for cooling light-emitting diode (LED) lights, which have recently attracted the attention of the illumination industry. In this analysis, the contribution ratios have an important role to set out the performance characteristics of a heat sink.

The reliability of the optimum test samples is verified. Also, the variation of the average heat transfer rate of optimum sample is reported when it is compared with the reference sample.

To fabricate and characterise novel heat sinks manufactured by selective laser melting (SLM). The investigation explores features of SLM produced heat sinks that may be exploited to improve their heat transfer capability.

The study was conducted on heat sinks manufactured from 316L stainless steel and aluminium 6061. The heat transfer devices' thermal and pressure drop performances were determined by experimental test.

The research demonstrates the performance enhancements that can be realised by using novel heat sink designs, fabricated by SLM, over conventional pin fin arrays. aluminium 6061 is used with the process to illustrate the improvement in heat transfer provided by higher conductivity feedstock materials.

Although the manufacturing technique is still in the development stage and the heat transfer devices that have so far been manufactured should not be considered optimal, the potential for creative new designs and applications is clear. This study highlights the need to develop the SLM process parameters to allow the repeatable production of heat transfer devices from higher conductivity metals with controllable surface finishes.

This paper outlines the design issues and performance of novel heat transfer devices fabricated using SLM. A new material, aluminium 6061, is introduced to the family of materials that can be processed with SLM and example heat sinks are tested.

This paper sets out to optimize the shape and size of microchannels cooling heat sink, which has been widely used to cool electronic chip for its high heat transfer coefficient and compact structure.

Sequential Quadratic Programming (SQP) method is used to optimize the cross‐section sizes of microchannels. Finite volume method is used to numerically simulate the cooling performance of optimal microchannel cooling heat sink.

The optimized cross‐section shape of microchannel is rectangular, and the width and depth of microchannel is 50 and 1,000 μm, respectively, the number of microchannels is 60, and the corresponding least thermal resistance is 0.115996°C/W. The results show that the heat transfer performance of microchannel cooling heat sink is affected intensively by its cross‐section shape and dimension. The convection heat resistance R_conv between inner surface in microchannels and working fluid has more influence in the total heat resistance. The heat flux of chip is 278 W/cm² and, through the optimization microchannel cooling heat sink, the highest temperature in the chip can be kept below 42°C, which is about half of that without optimizing heat sink and can ensure the stability and reliability of chip.

The convection heat transfer coefficient is calculated approximatively here for convenience, and that may induce some errors.

The optimized microchannels cooling heat sink may satisfy the request for removal of high heat flux in new‐generation chips.

This study aims to examine the effect of a combination of hybrid pin-fin patterns on a heat sink's performance using numerical techniques. Also, flow characteristics have been studied, such as secondary flow formation and flow-wall interaction.

In this study, the effect of hybrid arrangements of elliptical and hexagonal pin-fins with different distribution percentages on flow characteristics and performance evaluation criteria in laminar flow was investigated. Ansys-Fluent software solves the governing equations using the finite volume method. Also, the accuracy of obtained results was compared with the experimental results of other similar papers.

The results of this study highlighted that hybrid arrangements show higher overall performance than single pin-fin patterns. Among the hybrid arrangements, case 3 has the highest values of performance evaluation criteria, that is, 1.84 in Re = 900. The results revealed that, with the instantaneous change in the pattern from elliptic to hexagonal, the secondary flow increases in the cross-sectional area of the channels, and the maximum velocity in the cross-section of the channel increases. The important advantages of case 3 are its highest overall performance and a lower chip surface temperature of up to about 2% than other hybrid patterns.

Prior research has shown that in the single pin-fin pattern, the cooling power at the end of the heat sink decreases with increasing fluid temperature. Also, a review of previous studies showed that existing papers had not investigated hybrid pin-fin patterns by considering the effect of changing distribution percentages on overall performance, which is the aim of this paper.