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Interorganisational buyer‐seller relationships have been primarily studied from the perspective of relationship development and the benefits accrued from relationships. There is a lack of research concerning problems with relationships and relationship dissolution. The dissolution of a business relationship can be either desirable, freeing badly deployed resources, as indicated by the customer portfolio approach, or harmful, involving costly legal disputes and the loss of company reputation. By employing a theory‐driven case study approach we examine the exit strategies available for the disengager in dissolving interorganisational buyer‐seller relationships. We show that the quality of dissolution is affected by the disengager’s choice of exit strategy. Managerial suggestions are provided for achieving “beautiful exits”, i.e. such communication strategies which minimise damages of the dissolution to the disengager, the other party, and the connected business network.

The paper's purpose is to provide a solution to a problem on dissolution and disappearance of copper electrodes in solder bath in lead free soldering on printed circuit board (PCB).

The influence of the copper concentration, temperature, and flowing velocity of molten solder on the copper dissolution have been estimated, and it has been found that the dissolution rate of copper electrodes in Sn‐3.0Ag‐xCu solder alloys is defined by temperature and copper concentration in solder.

It was found that increasing the copper concentration to 1.5 mass% in Sn‐3.0Ag‐xCu solder could lower the rate of copper dissolution to the equivalent level as that of the conventional Sn‐Pb eutectic alloy at the temperature of 560 K.

In this paper, a dissolution phenomenon has been studied on Sn‐Ag‐Cu system alloys. It is interesting about the effect of other elements for controlling the dissolution.

The method to control the copper electrode dissolution in wave soldering is clarified. The copper dissolution rate for Sn‐3.0Ag‐1.5Cu solder can be lowered to the equivalent level as that of conventional Sn‐Pb eutectic solder, even at 560 K.

In this paper, a dissolution phenomenon has been evaluated by flowing molten solder which is close to one in a practical soldering. It is the most different point from earlier study.

The purpose of this paper is to study the functionality of additively manufactured (AM) parts, mainly depending on their dimensional accuracy and surface finish. However, the products manufactured using AM usually suffer from defects like roughness or uneven surfaces. This paper discusses the various surface quality improvement techniques, including how to reduce surface defects, surface roughness and dimensional accuracy of AM parts.

There are many different types of popular AM methods. Unfortunately, these AM methods are susceptible to different kinds of surface defects in the product. As a result, pre- and postprocessing efforts and control of various AM process parameters are needed to improve the surface quality and reduce surface roughness.

In this paper, the various surface quality improvement methods are categorized based on the type of materials, working principles of AM and types of finishing processes. They have been divided into chemical, thermal, mechanical and hybrid-based categories.

The review has evaluated the possibility of various surface finishing methods for enhancing the surface quality of AM parts. It has also discussed the research perspective of these methods for surface finishing of AM parts at micro- to nanolevel surface roughness and better dimensional accuracy.

This paper represents a comprehensive review of surface quality improvement methods for both metals and polymer-based AM parts.

Romantic dissolution is a common experience throughout the life course, particularly during emerging adulthood (ages 18–29). The purpose of this review was to summarize and critique theoretical approaches and empirical findings of the aftermath of dating relationship dissolution.

Article searches were conducted within PsycINFO. We utilized terms related to romantic relationship dissolution (i.e., breakup, romantic breakup, relationship termination, relationship dissolution, romantic dissolution, romantic termination, post-dissolution) in a search for key words. We narrowed the results further by limiting the search to include participants between the ages of 18 and 29.

Experiencing romantic dissolution can result in both positive and negative emotional reactions and behaviors, including personal growth and self-expansion as well as experiencing physical and emotional abuse from ex-partners. Furthermore, former romantic partners commonly form other types of friendships and casual sexual relationships after the termination of committed romantic relationships. Many theoretical frameworks are used to guide these investigations, and some articles lack a theoretical framework.

Developmental Systems Theory might be a theoretical framework that best shapes our investigations of romantic dissolution in dating relationships that occur in emerging adulthood.

Relationship education programs would be enhanced by discussing the developmental needs that are important for young people and the ways in which their romantic experiences can or cannot meet those needs. In addition to learning about how to have healthy romantic relationships, young people can also benefit from learning how to identify when romantic relationships should end, and how to end them successfully.

The purpose of this paper was to develop a physics-based mathematical model to estimate the amount of substrate metal lost during the wet soldering process.

A mathematically rigorous model depicting the actual physics of the substrate/solder interaction and dissolution has been proposed to simulate the dissolution of the substrate metal in the liquid lead-free solder. The basic mass diffusion equation with the implementation of interface reaction kinetics was solved numerically using the finite volume approach. The moving interface was tracked by utilizing the coordinate transformation technique.

It was observed that the process of metal dissolution in the liquid solder was governed by two important parameters, viz., interface kinetics and long-range diffusion in the liquid solder. Non-equilibrium behavior was observed in the early stage of the process. The early stage of the dissolution process was seen as governed by interface kinetics, while diffusion became the rate-controlling mechanism at the later phase of soldering.

Substrate dissolution can be accurately estimated for a particular substrate–solder combination and for the given process conditions. This early estimation will help in ensuring the reliability and health of the solder joint.

A model based on actual physics is proposed, and interface reaction kinetics has been introduced to capture the actual behavior of the process. The model will serve as the basis for two- and three-dimensional analysis, including the formation of an intermetallic compound in the solder joint.

In electronic packaging, when solid copper comes in contact with liquid solder alloy, the former dissolves and intermetallic compounds (IMCs) form at the solid‐liquid interface. The purpose of this paper is to study the effect of the presence of molybdenum nanoparticles on the dissolution of copper and the formation of interfacial IMC.

Cu wire having a diameter of 250 μm is immersed in liquid composite solders at 250°C up to 15 min. Composite solder was prepared by adding various amount of Mo nanoparticles into the Sn‐3.8Ag‐0.7Cu (SAC) solder paste. The dissolution behavior of Cu substrate is studied for SAC and Mo nanoparticles added SAC solders. The IMCs and its microstructure between the solder and substrate are analyzed by using conventional scanning electron microscope (SEM) and field emission SEM. The elemental analysis was done by using energy‐dispersive X‐ray spectroscopy.

Generally, the dissolution of the substrate increases with increasing immersion time but decreases with the increase of the content of Mo nanoparticles in the solder. The IMC thickness increases with increasing the reaction time but Mo nanoparticles can hinder the growth of IMC layer. The presence of Mo nanoparticle is found to be effective in reducing the dissolution of copper into SAC solder.

The paper shows that molybdenum nanoparticles in liquid SAC solders have a prominent effect on the substrate dissolution rate and the interfacial IMC between the SAC solder and copper substrate.

The purpose of this paper is to study the mechanism of electrochemical dissolution of SAC305 solder in mild acid solution.

Cyclic voltammetry (CV) was used to obtain electrochemical dissolution peaks followed by chronoamperometery (CA) to investigate the dissolution mechanism at each peak. Structural and microstructural characterization was performed to verify the CA analysis. Potentiodynamic polarization was performed afterwards to determine the corrosion potential of every phase in SAC305.

The early cycle of CV exhibits only dissolution peaks of β-Sn until intermetallic compound (IMC) peaks emerged at a later cycle. CA performed for 24 h at selected potentials reveals that β-Sn can be removed completely from the sample without disrupting the IMC network at a suitable potential. This was later verified by XRD and SEM. Potentiodynamic polarization determined the corrosion potential of IMC as −0.36 V.

The mechanism of anodic dissolution of SAC305 was studied and proposed.

The purpose of this paper is to investigate the various factors that influence the dissolution of copper in molten solder, paying particular attention to important parameters: temperature, solder composition and flow rate.

To determine the dissolution rate of copper in lead‐free solders, a simple and automated technique is developed. This methodology provides repeatable measurements that allow the various experimental parameters to be isolated. Factors that greatly affect the dissolution rate of copper, such as soldering temperature, flow rate and solder composition, are taken into account. Particular attention is paid to the flow rate of the molten solder. In fact, different alloys at the same temperature can have considerably different flow rates, owing to their different viscosities at that temperature. The dissolution rates of copper in seven lead‐free alloys and the Sn‐Pb alloy are compared at 255, 275 and 300°C.

It is observed that generally the samples with a thicker intermetallic layer are those that exhibit a longer dissolution time.

The transition from tin‐lead to lead‐free increases the tendency for copper dissolution in molten solders, clearly representing a serious risk to circuit reliability. This paper presents the many advantages of a method for comparing the dissolution rate of copper with different solder alloys.

The literature is rich with examples that stress the importance of marketers having long‐term customer relationships. Yet, the reality is that while relational attachments can foster benefits, there are many occasions when marketers seek, or are forced, to disband or change the nature of customer relationships. Interestingly however, despite the obviousness of this circumstance, this remains an unexamined strategic condition. In a unique investigation, this article explores the strategic opportunities and conditions that emanate from “relational unrest” in the business‐to‐business marketplace. Consequently, this article notes how sellers can benefit from understanding how to properly manage relational unrest. To address this issue, a strategic framework is proposed, which concludes that when sellers experience relational difficulties, strategic options with positive outcomes and related managerial implications can be associated with this condition.

The understanding of the dissolution and corrosion behaviour of tin and lead in fluoboric acid solutions, is of technological interest as their fluoborate solutions are prepared by the dissolution of the individual metals in acid solutions. The cyclic polarization studies revealed the dissolution of these metals involve the chemical step involving BF₄^‐ ion preceding the second electron transfer as the slow step.