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Almost two decades after diagnosing the link rot phenomenon, and in spite of the universal character of the bit rot phenomenon, the need for reminding about these is still valid. This is because it appears that digital device users have become accustomed to them. The bit rot and link rot phenomena describe the inability to access specific contents or the inability to use specific digital resources. This paper aims to answer the question as to whether it is possible to eliminate the link rot and bit rot phenomena from the internet space.

The link rot and bit rot phenomena were characterised based on a review of various source materials, including the academic literature and internet materials.

The phenomena known as bit rot and link rot have already been well researched and described. Research has revealed the reasons for their occurrence, and also offered recommendations on how to minimise their occurrence. In the current digital ecosystem, however, it is not possible to completely eliminate the link rot and bit rot phenomena.

One can forecast that the link rot phenomenon will intensify and the internet resources will be even more unstable, because more and more new, highest-level domains which are purchased are emerging.

The study compares the phenomena of bit rot and link rot, even though they are usually considered separately. Moreover, it presents the terms of “digital bumps”, which cause “digital tsunami”.

To accommodate increasing levels of device integration at the chip level, circuit line densities in electronic packages are continually increasing. Greater circuit line density, in turn, necessitates a corresponding increase in package‐to‐board interconnection density, with I/O counts expected to reach over 600 by 1995. In conjunction with the upward trend in I/O counts are a complementary upward trend in clock speed and an opposing downward trend in package sizes driven by the need to provide more functionality in less space, particularly in notebooks and PCMCIA cards. To satisfy the requirements of increased I/O counts and clock speed, and reduced package sizes, various package‐to‐board interconnection technologies are being developed, such as flip chip attach (FCA) using C4 joints. However, FCA interconnections have a disadvantage of being very difficult, if not impossible, to visually inspect. Though automatic test equipment (ATE) can determine whether the package is functional, it cannot determine the quality and reliability of FCA interconnections. Of the possible inspection techniques available to assess the quality of FCA interconnections — differential laser thermal analysis, acoustic microscopy and cross‐sectional X‐ray radiography — only cross‐sectional X‐ray radiography is capable of accurate, automated inspection of production volumes. This paper will first examine the requirements for inspecting FCA joints and will then describe the various inspection alternatives, outlining their advantages and disadvantages. Having described the potential advantage of one particular cross‐sectional X‐ray technique, digital tomosynthesis, the paper will conclude with some cross‐sectional images of FCA and SMT joints taken by a digital tomosynthesis system being developed for the inspection of FCA joints.

Digital media platforms in Uganda experimented with subscription-based models as an alternative to the traditional advertising model and as a recovery plan from the effects of COVID-19. Drawing from the theory of the political economy of the media, this study focusses on the critical success factors for subscription-based models in digital media platforms, audience consumption habits vis-á-vis payment for content, the effect of paywalls on the company financials and finally, establish the barriers to subscription uptake in Uganda. Media started charging users subscription fees for content in the 1990s (Chyi, 2005). Technological advances changed audience consumption habits from consuming hardcopy newspapers to accessing content on the go through their smartphones, tablets, and computers (Berger, Matt, Steininger, & Hess, 2015). Whilst some consumers pay for content, several audience surveys in East Africa indicated a lack of consistency among the paying audiences (KARF, 2019). Most consumers never purchased subscription and were avert to paywalls. The study used a mixed-method approach to find that the increase in internet penetration in Uganda and smartphone usage were the most significant enablers of paid-content consumption in Uganda. The quality of content, poor packaging, and unfair prices by publishers were the biggest barriers to consumption of paid news content.

A high‐density module for image processing was developed by chip‐on‐wafer technology. A silicon wafer was used as the substrate and the LSI chips were flip‐chip bonded to the silicon wafer by bumps in chip‐on‐wafer technology. A primary benefit of using a silicon wafer is the little induced thermal stress which affects the bumps. The module contained a digital signal processor, SRAMs and other peripheral LSls. A total of sixteen chips were bonded on the wafer. The LSIs were connected to each other by copper/polyimide multilayer interconnections consisting of eight copper conductive layers and polyimide dielectric layers. The characteristic impedance for the signal lines was controlled to 50 ohms. The LSIs were connected to the wafer electrically and mechanically by solder bumps, which were formed on the LSI bonding pads. A 188 pin AIN ceramic package was used for the module in order to obtain high heat radiation and high reliability. The occupied area for the module was reduced to 20%, compared with the size for conventionally assembled DIPs on a PC board.

Dubbed as the “first digital generation,” the millennials (or Generation Y) have been ensconced in digital technologies throughout their lives. As a demographic cohort, the eldest members of Generation Y were the first to reach adulthood by 2001, which heralded the third millennium, and were, therefore, called the millennials.

This research study theorizes that the millennials are ushering an emerging post-digital era that is redefining how we live, work, and play. By situating media consumption within a cross-disciplinary context of mediated engagement, this study analyzed how millennials consume media based on a 2019 meta-analytical research analysis of 22 cross-disciplinary studies, published between 2015 and 2019.

This research study analyzes how millennials curate and engage with digital media and information content in the midst of incessant evolutions of their identity, media use, and digital life. This study explicates six theoretical insights into how millennials consume information and engage with media. In their pursuit of easy access to media, the millennials get most of their information and media content from social media.

In theorizing how millennials engage with digital media, this study explicates important conceptual trends such as incidental news exposure (INE), which refers to people stumbling upon news stories they otherwise would not have purposefully seen or sought. INE spawns “bumpers” who involuntarily bump into news items, as opposed to “seekers” who actively search or seek news content. This leads to the news-finds-me mindset among some passive news consumers who rely and expect other active news consumers to share important news and information.

A low cost multichip module employing solder bumped flip chips mounted on an organic substrate was demonstrated. This functional prototype was used to help assess the preliminary feasibility of low temperature solder bumped flip chip applications, from wafer design, sourcing and bumping, substrate design and fabrication, to MCM‐L assembly.