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Article
Publication date: 1 March 1987

D.B. Noddin

Methods for producing multilayer boards of highly reinforced fluoropolymer composite systems are detailed. Both similarities and contrasts to conventional fabrication processes…

Abstract

Methods for producing multilayer boards of highly reinforced fluoropolymer composite systems are detailed. Both similarities and contrasts to conventional fabrication processes are discussed, as well as the relative processing effects on final electrical, mechanical, and physical properties of the MLB. Special emphasis encompasses the dimensional properties of these fluoropolymer MLBs and the overall simplicity of manufacture.

Details

Circuit World, vol. 13 no. 4
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 1 June 2000

John H. Lau and Chris Chang

There are many advantages of microvia: it requires a much smaller pad, which saves the board size and weight; with microvia, more chips can be placed in less space or a smaller…

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Abstract

There are many advantages of microvia: it requires a much smaller pad, which saves the board size and weight; with microvia, more chips can be placed in less space or a smaller PCB, which results in a low cost; and with microvia, electrical performance improves due to a shorter pathway. Basically, there are five major processes for microvia formation: NC drilling; laser via fabrication including CO2 laser, YAG laser, and excimer; photo‐defined vias, wet or dry; etch via fabrications including chemical (wet) etching and plasma (dry) etching; and conductive ink formed vias, wet or dry. This paper will discuss the materials and processes of these five major microvia formation methods. At the end, eight key manufacturers from Japan will be briefly illustrated for their research status and current capability of producing smallest microvia.

Details

Circuit World, vol. 26 no. 2
Type: Research Article
ISSN: 0305-6120

Keywords

Article
Publication date: 1 March 2000

Sudhakar Raman, Jae Hun Jeong, Sang Jin Kim, Ben Sun and Keon‐Yang Park

In the past three years, microvia drilling using laser technology has become the dominant method of producing blind vias smaller than 150μm. The ablation characteristics of the…

Abstract

In the past three years, microvia drilling using laser technology has become the dominant method of producing blind vias smaller than 150μm. The ablation characteristics of the materials used in the manufacture of PWBs can be divided into three categories: organics, glass, and metals. Organics are composed of resins and epoxies commercially available from a variety of vendors. Two types of resins that are typically used for microvia formation in the telecommunication applications are resin coated copper foil® (RCC or RCF) for subtractive PCB process, and thermal‐curing resin (TCR) for additive PCB process respectively. This paper details the basics of UV YAG laser capabilities, alignment techniques, plating tests, reliability tests, manufacturable microvia design rules, and production experiences.

Details

Circuit World, vol. 26 no. 1
Type: Research Article
ISSN: 0305-6120

Keywords

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