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Laser (UV) microvia application in cellular technology

Sudhakar Raman (Electro Scientific Industries, USA)
Jae Hun Jeong (Samsung Electromechanics Co. Ltd, Korea)
Sang Jin Kim (Samsung Electromechanics Co. Ltd, Korea)
Ben Sun (Samsung Electromechanics Co. Ltd, Korea)
Keon‐Yang Park (Samsung Electromechanics Co. Ltd, Korea)

Circuit World

ISSN: 0305-6120

Article publication date: 1 March 2000



In the past three years, microvia drilling using laser technology has become the dominant method of producing blind vias smaller than 150μm. The ablation characteristics of the materials used in the manufacture of PWBs can be divided into three categories: organics, glass, and metals. Organics are composed of resins and epoxies commercially available from a variety of vendors. Two types of resins that are typically used for microvia formation in the telecommunication applications are resin coated copper foil® (RCC or RCF) for subtractive PCB process, and thermal‐curing resin (TCR) for additive PCB process respectively. This paper details the basics of UV YAG laser capabilities, alignment techniques, plating tests, reliability tests, manufacturable microvia design rules, and production experiences.



Raman, S., Hun Jeong, J., Jin Kim, S., Sun, B. and Park, K. (2000), "Laser (UV) microvia application in cellular technology", Circuit World, Vol. 26 No. 1, pp. 11-15.




Copyright © 2000, MCB UP Limited

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