An overview of microvia technology
Abstract
There are many advantages of microvia: it requires a much smaller pad, which saves the board size and weight; with microvia, more chips can be placed in less space or a smaller PCB, which results in a low cost; and with microvia, electrical performance improves due to a shorter pathway. Basically, there are five major processes for microvia formation: NC drilling; laser via fabrication including CO2 laser, YAG laser, and excimer; photo‐defined vias, wet or dry; etch via fabrications including chemical (wet) etching and plasma (dry) etching; and conductive ink formed vias, wet or dry. This paper will discuss the materials and processes of these five major microvia formation methods. At the end, eight key manufacturers from Japan will be briefly illustrated for their research status and current capability of producing smallest microvia.
Keywords
Citation
Lau, J.H. and Chang, C. (2000), "An overview of microvia technology", Circuit World, Vol. 26 No. 2, pp. 22-32. https://doi.org/10.1108/03056120010310891
Publisher
:MCB UP Ltd
Copyright © 2000, MCB UP Limited