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An overview of microvia technology

John H. Lau (Express Packaging Systems, Inc., Palo Alto, California, USA)
Chris Chang (Express Packaging Systems, Inc., Palo Alto, California, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 June 2000

Abstract

There are many advantages of microvia: it requires a much smaller pad, which saves the board size and weight; with microvia, more chips can be placed in less space or a smaller PCB, which results in a low cost; and with microvia, electrical performance improves due to a shorter pathway. Basically, there are five major processes for microvia formation: NC drilling; laser via fabrication including CO2 laser, YAG laser, and excimer; photo‐defined vias, wet or dry; etch via fabrications including chemical (wet) etching and plasma (dry) etching; and conductive ink formed vias, wet or dry. This paper will discuss the materials and processes of these five major microvia formation methods. At the end, eight key manufacturers from Japan will be briefly illustrated for their research status and current capability of producing smallest microvia.

Keywords

Citation

Lau, J.H. and Chang, C. (2000), "An overview of microvia technology", Circuit World, Vol. 26 No. 2, pp. 22-32. https://doi.org/10.1108/03056120010310891

Publisher

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MCB UP Ltd

Copyright © 2000, MCB UP Limited