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Nowadays, various software is available for simulating physical processes in induction heating. The software is often limited in its ability to simulate the billet movement, sometimes assuming uniform distribution of voltages on the inductor winding, uniformity of the physical properties of the billet, etc. The mathematical model of moving cylindrical ferromagnetic billets described in this paper takes into account the billet's movement, the billet phase heterogeneity and the nonuniformity of the supply voltage distribution in the inductor turns. The paper aims to discuss these issues.

The research methodology is based on FEM analysis of the coupled problem, including the electromagnetic and thermal boundary problem with additional algebraic equations, using Comsol 3.5a software.

The electromagnetic and temperature field in the billet and the voltage distribution on the winding turns have been calculated. The phase distribution in the billet has been predicted. Significant interaction of the nonuniformity of the supply voltage distribution, the billet's movement, the billet phase heterogeneity and side effect on the ends of the inductor have been shown.

The results received can be used for designing the induction heating unit for moving cylindrical billets made from ferromagnetic material and improving their characteristics.

Investigation of moving cylindrical ferromagnetic billets induction heating can be done by numerical solving the coupled problem including the electromagnetic and thermal boundary problem with additional algebraic equations for the supply voltage distribution.

During thermal laser processes, heat transfer and fluid flow in the melt pool are primary driven by complex physical phenomena that take place at liquid/vapor interface. Hence, the choice and setting of front description methods must be done carefully. Therefore, the purpose of this paper is to investigate to what extent front description methods may bias physical representativeness of numerical models of laser powder bed fusion (LPBF) process at melt pool scale.

Two multiphysical LPBF models are confronted: a Level-Set (LS) front capturing model based on a C++ code and a front tracking model, developed with COMSOL Multiphysics® and based on Arbitrary Lagrangian–Eulerian (ALE) method. To do so, two minimal test cases of increasing complexity are defined. They are simplified to the largest degree, but they integrate multiphysics phenomena that are still relevant to LPBF process.

LS and ALE methods provide very similar descriptions of thermo-hydrodynamic phenomena that occur during LPBF, providing LS interface thickness is correctly calibrated and laser heat source is implemented with a modified continuum surface force formulation. With these calibrations, thermal predictions are identical. However, the velocity field in the LS model is systematically underestimated compared to the ALE approach, but the consequences on the predicted melt pool dimensions are minor.

This study fulfils the need for comprehensive methodology bases for modeling and calibrating multiphysical models of LPBF at melt pool scale. This paper also provides with reference data that may be used by any researcher willing to verify their own numerical method.

For the past decade, plasma actuators have been identified as a subset in the realm of active flow control devices. As research into plasma actuators continues to mature, computational modelling is needed to complement the investigation of the actuators. This paper seeks to address these issues.

In this study, the Suzen‐Huang model is chosen because of its ability to simulate both the charge density and Lorentz body force. Its advantages and limitations have been identified with a parametric study of two constants used in the modelling: the Debye length (λD) and the maximum charge density value (ρc* ). By varying the two scalars, the effects of charge density, body force and induced velocity are examined.

The results show that the non‐dimensionalised body force (Fb*) is nonlinearly dependent on Debye length. However, a linear variation of Fb* is observed with increasing values of maximum charge density. The optimized form of the Suzen‐Huang model shows better agreement in the horizontal velocity profile but still points to inaccuracy when compared to vertical velocity profile.

The results indicate that the body force still has to be modelled more extensively above the encapsulated electrode, so that the horizontal and vertical components of induced velocities are accurately obtained.

This paper aims to introduce an alternative for modeling levitation forces between NdFeB magnets and bulks of high-temperature superconductors (HTS). The presented approach should be evaluated through two different formulations and compared with experimental results.

The T-A and H-ϕ formulations are among the most efficient approaches for modeling superconducting materials. COMSOL Multiphysics was used to apply them to magnetic levitation models and predict the forces involved.The permanent magnet movement is modeled by combining moving meshes and magnetic field identity pairs in both 2D and 3D studies.

It is shown that it is possible to use the homogenization technique for the T-A formulation in 3D models combined with mixed formulation boundaries and moving meshes to simulate the whole device’s geometry.

The case studies are limited to the formulations’ implementation and a brief assessment regarding degrees of freedom. The intent is to make the simulation straightforward rather than establish a benchmark.

The H-ϕ formulation considers the HTS bulk domain as isotropic, whereas the T-A formulation homogenization approach treats it as anisotropic. The originality of the paper lies in contrasting these different modeling approaches while incorporating the external magnetic field movement by means of the Lagrangian–Eulerian method.

The purpose of this paper is to use finite element method for optimizing the membrane type double cavity vacuum sealed structure for the best achievable sensitivity in a piezoresistive absolute pressure sensor and its validation using a standard complementary metal oxide semiconductor (CMOS) process.

A double cavity vacuum sealed piezoresistive absolute pressure sensor has been simulated and optimized for its performance and an analytical model describing the behaviour of the sensor has been described. The 1×1 mm sensor chip has two membrane type 100×30×1.7 μm diaphragms consisting of composite layers of plasma enhanced chemical vapour deposition (PECVD) of silicon nitride (Si₃N₄) and silicon dioxide (SiO₂) each hanging over 21 μm deep rectangular cavity. Potassium hydroxide (KOH) based anisotropic etching of single crystal silicon using front side lateral etching technology is used for the fabrication of the sensor. The electrical readout circuitry uses 318 Ω boron diffused low pressure vapour chemical vapour deposition (LPCVD) of polysilicon resistors arranged in the Wheatstone half bridge configuration. The sensing structure is simulated and optimized using COMSOL Multiphysics.

Front-side lateral etching technology has been successfully used for the fabrication of double cavity absolute pressure sensor. A good agreement with the fabricated device for the chosen location of the piezoresistors through simulation has been predicted. The measured pressure sensitivity of two tested pressure sensors is 12.63 and 12.46 mV/MPa, and simulated pressure sensitivity is found to be 12.9 mV/MPa for pressure range of 0 to 0.5 MPa. The location of the piezoresistor has also been optimized using the simulation tools for enhancing the sensor sensitivity to 62.14 mV/MPa. The pressure sensitivity is further enhanced to 92 mV/MPa by increasing the width of the diaphragm to 35 μm.

The simulated and measured pressure sensitivities of the double cavity pressure sensor are in close agreement. Sevenfold enhancement in the pressure sensitivity of the optimized sensing structure has been observed. The proposed front-side lateral etching technology can be adopted for making membrane type diaphragms hanging over vacuum sealed micro-cavities for high sensitivity pressure sensing applications.

This study aims to optimize the manufacturing process to improve the manufacturing quality, costs and delivering time with the help of multiscale multiphysics modelling and simulation. Multiscale multiphysics-based modelling and simulations are receiving more and more interest by research community and the industry particularly in the context of increasing demands for manufacturing high precision complex products and understanding the intrinsic complexity in associated manufacturing processes.

In this paper, some modelling and analysis techniques using multiscale multiphysics modelling are presented and discussed.

Furthermore, the possibility of adopting the multiscale multiphysics modelling and simulation to develop the virtual machining system is evaluated, and further supported with an industrial case study on abrasive flow machining (AFM) of integrally bladed rotors using the techniques and system developed.

With the development of multiscale multiphysics-based modelling and simulation, it will enable effective and efficient optimisation of manufacturing processes and further improvement of manufacturing quality, costs, delivery time and the overall competitiveness.

The purpose of this paper is to explore a new possibility of providing high-temperature stable lead-free interconnections for low-temperature co-fired ceramics (LTCC) hotplate. For gas-sensing application, a temperature range of 200°C-400°C is usually required by the sensing film to detect different gases which imply the requirement of thermally stable interconnects. To observe the effect of parameters influencing power of the device, electro-thermal simulation of LTCC hotplate is also presented. Simulated LTCC hotplate is fabricated using the LTCC technology.

The proposed task is to fabricate LTCC hotplate with interconnects through vertical access. Dedicated via-holes generated on the LTCC hotplate are used to provide the interconnections. These interconnections are based on adherence and bonding mechanism between LTCC and thick film. COMSOL software is used for finite element method (FEM) simulation of the LTCC hotplate structure.

Thermal reliability of these interconnections is tested by continuous operation of hotplate at 350°C for 175 h and cycling durability test performed at 500°C. Additionally, vibration test is also carried out for the hotplate with no damage observed in the interconnections. An optimized firing profile to reproduce these interconnections along with the experimental flowchart is presented.

Research activity includes design and fabrication of LTCC hotplate with metal to thick-film based interconnections through vertical access. Research work on interconnections based on adherence of LTCC and thick film is limited.

A new way of providing lead-free and reliable interconnections will be useful for gas sensor fabricated on LTCC substrate. The FEM results are useful for optimizing the design for developing low-power LTCC hotplate.

Adherence and bonding mechanism between LTCC and thick film can be used to provide interconnections for LTCC devices. Methodology for providing such interconnections is discussed.

The paper introduces and illustrates the use of numerical models for the simulation of electromagnetic and thermal processes in an absorbing ceramic layer (susceptor) of a new millimeter-wave (MMW) heat exchanger. The purpose of this study is to better understand interaction between the MMW field and the susceptor, choose the composition of the ceramic material and help design the physical prototype of the device.

A simplified version of the heat exchanger comprises a rectangular block of an aluminum nitride (AlN) doped with molybdenum (Mo) that is backed by a thin metal plate and irradiated by a plane MMW. The coupled electromagnetic-thermal problem is solved by the finite-difference time-domain (FDTD) technique implemented in QuickWave. The FDTD model is verified by solving the related electromagnetic problem by the finite element simulator COMSOL Multiphysics. The computation of dissipated power and temperature is based on experimental data on temperature-dependent dielectric constant, loss factor, specific heat and thermal conductivity of the AlN:Mo composite. The non-uniformity of patterns of dissipated power and temperature is quantified via standard-deviation-based metrics.

It is shown that with the power density of the plane wave on the block’s front face of 1.0 W/mm², at 95 GHz, 10 × 10 × 10-mm blocks with Mo = 0.25 – 4% can be heated up to 1,000 °C for 60-100 s depending on Mo content. The uniformity of the temperature field is exceptionally high – in the course of the heating, temperature is evenly distributed through the entire volume and, in particular, on the back surface of the block. The composite producing the highest level of total dissipated power is found to have Mo concentration of approximately 3%.

In the electromagnetic model, the heating of the AlN:Mo samples is characterized by the volumetric patterns of density of dissipated power for the dielectric constant and the loss factor corresponding to different temperatures of the process. The coupled model is run as an iterative procedure in which electromagnetic and thermal material parameters are upgraded in every cell after each heating time step; the process is then represented by a series of thermal patterns showing time evolution of the temperature field.

Determination of practical dimensions of the MMW heat exchanger and identification of material composition of the susceptor that make operations of the device energy efficient in the required temperature regime require and expensive experimentation. Measurement of heat distribution on the ceramic-metal interface is a practically challenging task. The reported model is meant to be a tool assisting in development of the concept and supporting system design of the new MMW heat exchanger.

While exploitation of a finite element model (e.g. in COMSOL Multiphysics environment) of the scenario in question would require excessive computational resources, the reported FDTD model shows operational capabilities of solving the coupled problem in the temperature range from 20°C to 1,000°C within a few hours on a Windows 10 workstation. The model is open for further development to serve in the ongoing support of the system design aiming to ease the related experimental studies.

The purpose of this paper is to employ the Generalized Integral Transform Technique in the analysis of conjugated heat transfer in micro-heat exchangers, by combining this hybrid numerical-analytical approach with a reformulation strategy into a single domain that envelopes all of the physical and geometric sub-regions in the original problem. The solution methodology advanced is carefully validated against experimental results from non-intrusive techniques, namely, infrared thermography measurements of the substrate external surface temperatures, and fluid temperature measurements obtained through micro Laser Induced Fluorescence.

The methodology is applied in the hybrid numerical-analytical treatment of a multi-stream micro-heat exchanger application, involving a three-dimensional configuration with triangular cross-section micro-channels. Space variable coefficients and source terms with abrupt transitions among the various sub-regions interfaces are then defined and incorporated into this single domain representation for the governing convection-diffusion equations. The application here considered for analysis is a multi-stream micro-heat exchanger designed for waste heat recovery and built on a PMMA substrate to allow for flow visualization.

The methodology here advanced is carefully validated against experimental results from non-intrusive techniques, namely, infrared thermography measurements of the substrate external surface temperatures and fluid temperature measurements obtained through Laser Induced Fluorescence. A very good agreement among the proposed hybrid methodology predictions, a finite elements solution from the COMSOL code, and the experimental findings has been achieved. The proposed methodology has been demonstrated to be quite flexible, robust, and accurate.

The hybrid nature of the approach, providing analytical expressions in all but one independent variable, and requiring numerical treatment at most in one single independent variable, makes it particularly well suited for computationally intensive tasks such as in optimization, inverse problem analysis, and simulation under uncertainty.

The purpose of this paper is to study an electrolytic etching method to prepare fine lines on printed circuit board (PCB). And the influence of organics on the side corrosion protection of PCB fine lines during electrolytic etching is studied in detail.

In this paper, the etching factor of PCB fine lines produced by new method and the traditional method was analyzed by the metallographic microscope. In addition, field emission scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) were used to study the inhibition of undercut of the four organometallic corrosion inhibitors with 2,5-dimercapto-1,3,4-thiadiazole, benzotriazole, l-phenylalanine and l-tryptophan in the electrolytic etching process.

The SEM results show that corrosion inhibitors can greatly inhibit undercut of PCB fine lines during electrolytic etching process. XPS results indicate that N and S atoms on corrosion inhibitors can form covalent bonds with copper during electrolytic etching process, which can be adsorbed on sidewall of PCB fine lines to form a dense protective film, thereby inhibiting undercut of PCB fine lines. Quantum chemical calculations show that four corrosion inhibitor molecules tend to be parallel to copper surface and adsorb on copper surface in an optimal form. COMSOL Multiphysics simulation revealed that there is a significant difference in the amount of corrosion inhibitor adsorbed on sidewall of the fine line and the etching area.

As a clean production technology, electrolytic etching method has a good development indicator for the production of high-quality fine lines in PCB industry in the future. And it is of great significance in saving resources and reducing environmental pollution.