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The objective of this paper is to demonstrate a method for producing embedded horizontal micro‐channels using a commercial line‐scan stereolithography (SL) system. To demonstrate that the method is repeatable, reproducible and capable of producing accurate horizontal micro‐channels, a statistical design of experiments was performed.

Demonstration of the technique was performed using a 3D Systems Viper si2^TM SL system and DSM Somos^® WaterShed^TM resin with polytetrafluoroethylene (PTFE)‐coated wire having diameters of 31.6 and 57.2 μm. By embedding the wire and building around the insert, the down‐facing surfaces were supported during fabrication enabling accurate fabrication of embedded micro‐channel geometries. The fabrication method involved first building an open micro‐channel, interrupting the SL process and inserting the wire, and then capping over the wire with multiple layers. After fabrication, the part with the inserted micro‐wire was post‐cured to harden any uncured resin around the wire. The micro‐channel was produced by simply pulling the wire out of the part. Scanning electron microscope images were used to examine and measure the geometries of the fabricated micro‐channels, and characterization through a statistical analysis was accomplished to show that the process was capable of producing accurate horizontal micro‐channels.

The measured data showed that the micro‐wires were successfully removed from the channels, leaving high quality micro‐channels, where the mean measured diameters for each wire were 2.65 and 2.18 μm smaller than the measured wire diameters (31.6 and 57.2 μm). Based on the statistical results, it is suggested that the method described in this work can rapidly produce repeatable and reproducible circular, embedded, and accurate micro‐channels.

The method developed in the current work was demonstrated on simple straight channels and a statistical study was used to show that the process is capable of repeatedly and reproducibly producing accurate micro‐channels with circular cross‐section; however, future studies are required to extend these procedures to more realistic and complicated geometries that may include non‐straight channel paths and non‐circular cross‐sectional geometries. The process can be used for micro‐channel fabrication with not only circular cross‐sectional geometries as shown here but potentially with a wide range of additional cross‐sectional geometries that can be fabricated into a PTFE‐coated micro‐wire.

This work demonstrates a process using commercial line‐scan SL and embedding a PTFE‐coated micro‐wire that is subsequently removed for producing repeatable and reproducible horizontal embedded micro‐channels of circular cross‐sectional geometries.

Porous medium has always been introduced as an environment for increasing heat transfer in cooling systems. However, increase in heat transfer and resolving pressure drop in the fluid flow have been focused on by researchers.The purpose of this paper is to study the effects of creating porous micro-channels inside porous macro-blocks to optimize system performance in channels.

To simulate flow field, a developed numerical code that solves Navier–Stokes equations by finite volume method and semi-implicit method for pressure linked equations (SIMPLE) algorithm will be used together with bi-disperse porous medium (BDPM) method. Working fluid is air with Pr = 0.7 in laminar state. Influence of permeability changes by creation of micro-channels containing porous medium in vertical, horizontal and cross-shape patterns will be investigated.

By creating porous micro-channels inside macro-blocks, not only does the heat transfer increase significantly but the pressure also drops remarkably. Increase in performance evaluation criteria (PEC) is more evident in lower Reynolds numbers that can increase the PEC to 75 per cent by creating cross-shape micro-channels. By changing the permeability of micro-channels, PEC will increase by reducing the pressure drop but it has minor changes in Nu.

The current work is applicable to optimizing system performance by decreasing the pressure drop and increasing the heat transfer.

The developed patterns are useful in increasing the system performance including the increase in heat transfer and decrease in pressure drop in systems such as air coolers required in electrical circuits.

Development and optimization of system performance by new patterns using BDPM in comparison to the previous patterns.

In an effort to directly manufacture devices with embedded complex and three‐dimensional (3D) micro‐channels on the order of microns to millimeters, issues associated with micro‐fabrication using current commercially available line‐scan stereolithography (SL) technology were investigated.

Practical issues associated with the successful fabrication of embedded micro‐channels were divided into software part preparation, part manufacture, and post‐cleaning with emphasis on channel geometry, size, and orientation for successful micro‐fabrication. Accurate representation of intended geometries was investigated during conversion from CAD to STL and STL to machine build file, and fabricated vertical and horizontal micro‐channels were inspected. Additional build issues investigated included accurate spatial registration of the build platform, building without base support, and Z‐stage position accuracy during the build.

For successful fabrication of micro‐channels using current technology, it is imperative to inspect the conversion process from CAD to STL and STL to machine build file. Inaccuracies in micro‐channel representation can arise at different stages of part preparation, although newer software versions appear to improve representation of micro‐geometries. Square channel cross‐sections are most easily sliced and vertical channels are most easily stacked together for layered manufacturing. While building, a means should be developed for building without base and internal supports, providing feedback on Z‐stage position, and having the capability for cleaning the micro‐channels.

This research demonstrates that commercial SL technology is capable of accurately fabricating embedded vertical square cross‐section micro‐channels on the order of 100 μm (with reasonable advancements to smaller scales on the order of 10 μm achievable). Additional practical limitations exist on other channel geometries and orientations. The research used a single resin and additional material resins should be explored for improved micro‐fabrication characteristics.

Practical issues associated with micro‐fabrication of embedded channels with appropriate solutions using available SL technology were provided. It is expected that these solutions will enable unique applications of micro‐channel fabrication for micro‐fluidic and other devices.

This work represents an original investigation of the capabilities of current line‐scan SL technology for fabricating embedded micro‐channels, and the solutions provide the means for applying this technology in micro‐fabrication.

This paper consolidates and presents the results of a work conducted to fabricate micro-channels on titanium grade-2 material by ultrasonic machining process (USM). In this research, the effects of important USM parameters, namely, kind of abrasives and its size, concentration of slurry, USM power rating and feed rate, have been probed on micro-channels quality for average surface roughness and process throughput in the form of material removal rate.

Multiple micro-channels on commercially pure titanium (i.e. Ti grade-2) have been fabricated in a single pass by employing micro-tool based USM process. Taguchi-based L18 (mixed level) OA has been selected for experimental design. Analysis of variance (ANOVA) study and regression modeling have also been done. Non-Dominated Sorting Genetic Algorithm (NSGA-II) has been used for process optimization to get optimum values of material removal rate (MRR) and surface roughness (SR).

The influence of important USM variables on SR and MRR have been investigated, and NSGA-II-based multi-response optimization has been done. The best surface roughness values obtained via NSGA-II solution for SiC and B₄C are 0.354 µm and 1.303 µm, respectively. Scanned electron microscopic investigation proves the fabrication of micro-channels with smooth surfaces, and minimum burrs and other defects. The material removed from the surface was due to ductile fractures.

Miniaturization is a modern trend these days to solve many precision, scientific and industrial problems. To manufacture precise micro-products, shapes and features, advanced and micro-machining processes can play a very prominent role. Micro-channels are typical micro-features required in micro-fluidic applications like micro heat exchangers and micro-pumps. Exhaustive review of existing research work indicated that precision micromachining of various materials can be effectively performed using USM, though not much work has been undertaken to explore the feasibility of multiple micro-channels in a single run using USM. The current work fulfills the gap, where multiple micro-channels on commercially pure titanium (i.e. Ti grade-2) have been fabricated in a single pass by employing micro-tool-based USM process.

This paper aims to present a new methodology to manufacture micro-channels suitable for high operating pressures and micro particle image velocimetry (μPIV) measurements using a rapid-prototyping high-resolution 3D printer. This methodology can fabricate channels down to 250 μm and withstand pressures of up to 5 ± 0.2 MPa. The manufacturing times are much shorter than in soft lithography processes.

The novel manufacturing method developed takes advantage of the recently improved resolution in 3D printers to manufacture an rapid prototyping technique part that contains the hose connections and a micro-channel useful for microfluidics. A method to assemble one wall of the micro-channel using UV curable glue with a glass slide is presented – an operation required to prepare the channel for μPIV measurements. Once built, the micro-channel has been evaluated when working under pressure and the grease flow behavior in it has been measured using μPIV. Furthermore, the minimum achievable channels have been defined using a confocal microscopy study.

This technique is much faster than previous micro-manufacturing techniques where different steps were needed to obtain the micro-machined parts. However, due to current 3D printers ' resolutions (around 50 μm) and according to the experimental results, channels smaller than 250-μm2 cross-section should not be used to characterize fluid flow behaviors, as inaccuracies in the channel boundaries can deeply affect the fluid flow behavior.

The present methodology is developed due to the need to validate micro-channels using μPIV to lubricate critical components (bearings and gears) in wind turbines.

This novel micro-manufacturing technique overcomes current techniques, as it requires less manufacturing steps and therefore it is faster and with less associated costs to manufacture micro-channels down to 250-μm2 cross-section that can withstand pressures higher than 5 MPa that can be used to characterize microfluidic flow behavior using μPIV.

To analyze two‐phase flow in micro‐channel heat exchangers used for high flux micro‐electronics cooling and to obtain performance parameters such as thermal resistance, pressure drop, etc. Both uniform and non‐uniform micro‐channel base heat fluxes are considered.

Energy balance equations are developed for two‐phase flow in micro‐channels and are solved using the finite element method (FEM). A unique ten noded element is used for the channel descritization. The formulation also automatically takes care of single‐phase flow in the micro‐channel.

Micro‐channel wall temperature distribution, thermal resistance and the pressure drop for various uniform micro‐channel base heat fluxes are obtained, both for single‐ and two‐phase flows in the micro‐channel. Results are compared against data available in the literature. The wall temperature distribution for a particular case of non‐uniform base heat flux is also obtained.

The analysis is done for a single micro‐channel and the effects of multiple or stacked channels are not considered. The analysis needs to be carried out for higher heat fluxes and the validity of the correlation needs to be ascertained through experimentation. Effects of flow mal‐distribution in multiple channels, etc. need to be considered.

The role of two‐phase flow in micro‐channels for high flux micro‐electronics cooling in reducing the thermal resistance is demonstrated. The formulation is very useful for the thermal design and management of microchannels with both single‐ and two‐phase flows for either uniform or non‐uniform base heat flux.

A simple approach to accurately determine the thermal resistance in micro‐channels with two‐phase flow, for both uniform and non‐uniform base heat fluxes is the originality of the paper.

The purpose of this paper is to show how, with a view to the shortcomings of traditional optimization methods, a multi‐objective optimization concerning the structure sizes of micro‐channel heat sink is performed by adaptive genetic algorithm. The optimized micro‐channel heat sink is simulated by computational fluid dynamics (CFD) method, and the total thermal resistance is calculated to compare with that of thermal resistance network model.

Taking the thermal resistance and the pressure drop as goal functions, a multi‐objective optimization model was proposed for the micro‐channel cooling heat sink based on the thermal resistance network model. The coupled solution of the flow and heat transfer is considered in the optimization process, and the aim of the procedure is to find the geometry most favorable to simultaneously maximize heat transfer while obtaining a minimum pressure drop. The optimized micro‐channel heat sink was numerically simulated by CFD software.

The results of optimization show that the base convection thermal resistance contributes to maximum the total thermal resistance, and base conduction thermal resistance contributes to least. The width of optimized micro‐channel and fin are 197 and 50 μm, respectively, and the corresponding total thermal resistance of the whole micro‐channel heat sink is 0.838 K/W, which agrees well with the analysis result of thermal resistance network model.

The convection heat transfer coefficient is calculated approximately here for convenience, and that may induce some errors.

The maximum difference in temperature of the optimized micro‐channel cooling heat sink is 84.706 K, which may satisfy the requirement for removal of high heat flux in new‐generation chips. The numerical simulation results are also presented, and the results of numerical simulation show that the optimized micro‐channel heat sink can enhance thermal transfer performance.

The development of novel cooling techniques is needed in order to be able to substantially increase the performance of integrated electronic circuits whose operations are limited by the maximum allowable temperature. Air cooled micro‐channels etched in the silicon substrate have the potential to remove heat directly from the chip. For reasonable pressure drops, the flow in micro‐channels is inherently laminar, so that the heat transfer is not very large. A synthetic jet may be used to improve mixing, thereby considerably increasing heat transfer. This paper seeks to address this issue.

CFD has been used to study the flow and thermal fields in forced convection in a two‐dimensional micro‐channel with an inbuilt synthetic jet actuator. The unsteady Navier‐Stokes and energy equations are solved. The effects of variation of the frequency of the jet at a fixed pressure difference between the ends of the channel and with a fixed jet Reynolds number, have been studied with air as the working fluid. Although the velocities are very low, the compressibility of air has to be taken into account.

The use of a synthetic jet appreciably increases the rate of heat transfer. However, in the frequency range studied, whilst there are significant changes in the details of the flow, due primarily to large phase changes with frequency, there is little effect of the frequency on the overall rate heat transfer. The rates of heat transfer are not sufficiently large for air to be a useful cooling medium for the anticipated very large heat transfer rates in future generations of microchips.

The study is limited to two‐dimensional flows so that the effect of other walls is not considered.

It does not seem likely that air flowing in channels etched in the substrate of integrated circuits can be successfully used to cool future, much more powerful microchips, despite a significant increase in the heat transfer caused by synthetic jet actuators.

CFD is used to determine the thermal performance of air flowing in micro‐channels with and without synthetic jet actuators as a means of cooling microchips. It has been demonstrated that synthetic jets significantly increase the rate of heat transfer in the micro‐channel, but that changing the frequency with the same resulting jet Reynolds number does not have an effect on the overall rate of heat transfer. The significant effect of compressibility on the phase shifts and more importantly on the apparently anomalous heat transfer from the “cold” air to the “hot” wall is also demonstrated.

The purpose of this paper is to optimize the configuration sizes of micro‐channel cooling heat sink using the thermal resistance network model. The optimized micro‐channel heat sink is simulated by computational fluid dynamics method, and the total thermal resistance is calculated to compare with that of thermal resistance network model.

Taking the thermal resistance and the pressure drop as goal functions, a multi‐objective optimization model was proposed for the micro‐channel cooling heat sink based on the thermal resistance net work model. The Sequential Quadratic Programming procedure was used to do the optimization design of the structure size of the micro‐channel. The optimized micro‐channel heat sink was numerically simulated by computational fluid dynamics (CFD) software.

For the heat sink to cool a chip with the sizes of L × W = 2.5 mm × 2.5 mm and the power of 8 W, the optimized width and height of the micro‐channel are 154 μm and 1,000 μm, respectively, and its corresponding total thermal resistance is 8.255 K/W. According to the simulation results, the total thermal resistance of whole micro‐channel heat sink R_total is 7.596 K/W, which agrees well with the analysis result of thermal resistance network model.

The convection heat transfer coefficient is calculated approximatively here for convenience, and that may induce some errors. Originality/value –The maximum difference in temperature of the optimized micro‐channel cooling heat sink is 59.064 K, which may satisfy the requirement for removal of high heat flux in new‐generation chips.

This study aims to produce lubricating surfaces with micro-channels by the selective laser melting (SLM) method, and to investigate their tribological behavior.

In this study, three kinds of samples with different geometries were designed, impregnated with oil and then subjected to flow analysis in a virtual environment using Ansys Fluent software. According to the results of these analyses, the best-lubricated surface geometry sample was identified, and a number of geometries were produced by SLM, which is one of the additive manufacturing methods. Tribological tests were performed using a pin-on-disk tribometer with a stainless steel ball as the contact surface. The structural and morphological features were investigated by a three-dimensional profilometer and scanning electron microscopy.

The results obtained showed that the impregnated oil reached the surface of the sample compared to untreated samples, and it was seen that the wear rates were reduced, and that the impregnated oil samples exhibited the highest wear resistance.

In this study, solid geometries that are difficult to be produced by other methods are produced with additive manufacturing method, and the surfaces have been given lubricating properties.