A study of solder paste printing requirements for CSP technology

Jeff Kennedy (Manufacturers’ Services Ltd, Arden Hills, Minnesota, USA)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Publication date: 1 December 2000

Abstract

This paper describes the methodology used to evaluate several different stencil fabrication methods, aperture sizes and thicknesses and different solder pastes. Data collected included the number of printing defects and measurement of solder paste volume and height. Statistics have been used for the analysis of quantitative data. Results from this evaluation have been critical in the success of a new process for CSP assembly in a standard SMT environment. Stencil designs and solder paste selection for other applications have also benefited from the conclusions of this study.

Keywords

Citation

Kennedy, J. (2000), "A study of solder paste printing requirements for CSP technology", Soldering & Surface Mount Technology, Vol. 12 No. 3, pp. 13-19. https://doi.org/10.1108/09540910010347818

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Publisher

:

MCB UP Ltd

Copyright © 2000, MCB UP Limited

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