Soldering & Surface Mount Technology
Issue(s) available: 126 – From Volume: 1 Issue: 1, to Volume: 35 Issue: 5
Microstructural and mechanical evolution of sintered nano-silver joints on bare copper substrates during high-temperature storage
Meng Jiang, Yang Liu, Ke Li, Zhen Pan, Quan Sun, Yongzhe Xu, Yuan TaoThe purpose of this paper is to study the reliability of sintered nano-silver joints on bare copper substrates during high-temperature storage (HTS).
Temperature and current density prediction in solder joints using artificial neural network method
Yang Liu, Xin Xu, Shiqing Lv, Xuewei Zhao, Yuxiong Xue, Shuye Zhang, Xingji Li, Chaoyang XingDue to the miniaturization of electronic devices, the increased current density through solder joints leads to the occurrence of electromigration failure, thereby reducing the…
Deep learning and analytical study of void regional formation in flip-chip underfilling process
Calvin Ling, Muhammad Taufik Azahari, Mohamad Aizat Abas, Fei Chong NgThis paper aims to study the relationship between the ball grid array (BGA) flip-chip underfilling process parameter and its void formation region.
Low-cycle fatigue life assessment of SAC solder alloy through a FEM-data driven machine learning approach
Vicente-Segundo Ruiz-Jacinto, Karina-Silvana Gutiérrez-Valverde, Abrahan-Pablo Aslla-Quispe, José-Manuel Burga-Falla, Aldo Alarcón-Sucasaca, Yersi-Luis Huamán-RomaníThis paper aims to present the novel stacked machine learning approach (SMLA) to estimate low-cycle fatigue (LCF) life of SAC305 solder across structural parts. Using the finite…
Effect of Si3N4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding
Chen Chen, Liang Zhang, Xi Huang, Xiao LuThe purpose of this study is to delve into the mechanism of Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for the expeditious design and…
Flow behavior during solder/Cu column friction plunge micro-welding
Zhili Zhao, Mingqiang Zhang, Xi Meng, Zhenkun Li, Jiazhe Li, Luying Qiu, Zeyu RenThe author proposed a friction plunge micro-welding (FPMW) method and applied it to column grid array packaging to realize the connection of copper columns without precision molds…
Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing
Mohamad Solehin Mohamed Sunar, Maria Abu Bakar, Atiqah A., Azman Jalar, Muhamed Abdul Fatah Muhamed Mukhtar, Fakhrozi Che AniThis paper aims to investigate the effect of physical vapor deposition (PVD)-coated stencil wall aperture on the life span of fine-pitch stencil printing.
Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple
Andromeda Dwi Laksono, Chih-Ming Chen, Yee-Wen YenThe purpose of this study was to examine the influence of adding a small amount of Ti to a Cu-based alloy, specifically the commercial Hyper Titanium Copper alloy (C1990 HP)…
Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere
Bifu Xiong, Siliang He, Jinguo Ge, Quantong Li, Chuan Hu, Haidong Yan, Yu-An ShenThis paper aims to examine the effects of bonding temperature, bonding time, bonding pressure and the presence of a Pt catalyst on the bonding strength of Cu/SB/P-Cu/SB/Cu joints…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang
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