Soldering & Surface Mount Technology
Issue(s) available: 132 – From Volume: 1 Issue: 1, to Volume: 37 Issue: 1
A study on the effect of the geometric properties and surface defects on silicon chip flexibility for wearable electronics
Yan Pan, Taiyu Jin, Xiaohui Peng, Pengli Zhu, Kyung W. PaikThe purpose of this paper was to investigate how variations in the geometry of silicon chips and the presence of surface defects affect their static bending properties. By…
Chip warpage and stress analysis in power modules of different substrate configurations
Mohammad A. GharaibehThis paper aims to use rigorous finite element simulations to investigate the impact of different substrate systems on the warpage behavior of silicon (Si) chips of power modules…
Investigation of the thermal properties, microstructure, and mechanical properties of Sn-3Ag-3Sb-xIn lead-free solder alloys
Jiacheng Zhou, Jinglin Shi, Dongfan Yin, Lei Xu, Fuwen Zhang, Zhigang Wang, Qiang Hu, Huijun HeThis study aims to investigate the impact of indium (In) content on the thermal properties, microstructure and mechanical properties of Sn-3Ag-3Sb-xIn (x = 0, 1, 2, 3, 4, 5 Wt.%…
Inhibition mechanism of palladium on intermetallic compounds in Au–Al bonding under high temperature storage
Zhimin Liang, Xinyu Zhao, Yunjia Li, Yuzhong Rao, Kehong Wang, Xiaobing WangAdding Pd element to Au wire can improve the reliability of Au-Al bonding, but the mechanism of Pd element has not been well revealed so far. The purpose of this study is to…
Effect of sintering temperature on ratcheting-fatigue behavior of nanosilver sintered lap shear joint
Danqing Fang, Chengjin Wu, Yansong Tan, Xin Li, Lilan Gao, Chunqiu Zhang, Bingjie ZhaoThe paper aims to study the effect of sintering temperature on the microstructure, shear strength and ratcheting fatigue life of nanosilver sintered lap shear joint. In addition…
Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy
Jinshuai Xie, Lei Tang, Pengfei Gao, Zhengquan Zhang, Liangfeng LiThis paper aims to study the effect of different Ni content on the microstructure and properties of Sn-0.7Cu alloy. Then, the spreading area, wetting angle, interface layer…
Effects of soldering temperature and preheating temperature on the properties of Sn–Zn solder alloys using wave soldering
Songtao Qu, Qingyu Shi, Gong Zhang, Xinhua Dong, Xiaohua XuThis study aims to address the problem of low-temperature wave soldering in industry production with Sn-9Zn-2.5 Bi-1.5In alloys and develop qualified process parameters. Sn–Zn…
Microstructure and mechanical behavior of Sn15Bi-xAg\Cu solder joints during isothermal aging
Fengjiang Wang, Dapeng Yang, Guoqing YinThis paper aims to focus on the reliability of Sn15Bi–xAg and Sn15Bi–xCu solder joints during isothermal aging.
Influences of hygrothermal conditions and structure parameters on moisture diffusion behavior in a system‐in‐package module by moisture-thermal-mechanical-coupled finite element modeling
Li Liu, Chunhua Zhang, Ping Hu, Sheng Liu, Zhiwen ChenThis paper aims to investigate the moisture diffusion behavior in a system-in-package module systematically by moisture-thermalmechanical-coupled finite element modeling with…
Elastoplastic nanoindentation behaviors of sintered nano-silver under various sintering parameters
Yanwei Dai, Libo Zhao, Fei Qin, Si ChenThis study aims to characterize the mechanical properties of sintered nano-silver under various sintering processes by nano-indentation tests.
Influence of doping Si3N4 nanoparticles on the properties and microstructure of Sn58Bi solder for connecting Cu substrate
Kai Deng, Liang Zhang, Chen Chen, Xiao Lu, Lei Sun, Xing-Yu GuoThis study aims to explore the feasibility of adding Si3N4 nanoparticles to Sn58Bi and provides a theoretical basis for designing and applying new lead-free solder materials for…
The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance
Bingyi Li, Songtao Qu, Gong ZhangThis study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide…
ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang
Further Information
