Microstructural and mechanical evolution of sintered nano-silver joints on bare copper substrates during high-temperature storageMeng Jiang, Yang Liu, Ke Li, Zhen Pan, Quan Sun, Yongzhe Xu, Yuan Tao
The purpose of this paper is to study the reliability of sintered nano-silver joints on bare copper substrates during high-temperature storage (HTS).
Due to the miniaturization of electronic devices, the increased current density through solder joints leads to the occurrence of electromigration failure, thereby reducing the…
This paper aims to study the relationship between the ball grid array (BGA) flip-chip underfilling process parameter and its void formation region.
Low-cycle fatigue life assessment of SAC solder alloy through a FEM-data driven machine learning approachVicente-Segundo Ruiz-Jacinto, Karina-Silvana Gutiérrez-Valverde, Abrahan-Pablo Aslla-Quispe, José-Manuel Burga-Falla, Aldo Alarcón-Sucasaca, Yersi-Luis Huamán-Romaní
This paper aims to present the novel stacked machine learning approach (SMLA) to estimate low-cycle fatigue (LCF) life of SAC305 solder across structural parts. Using the finite…
The purpose of this study is to delve into the mechanism of Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for the expeditious design and…
The author proposed a friction plunge micro-welding (FPMW) method and applied it to column grid array packaging to realize the connection of copper columns without precision molds…
This paper aims to investigate the effect of physical vapor deposition (PVD)-coated stencil wall aperture on the life span of fine-pitch stencil printing.
The purpose of this study was to examine the influence of adding a small amount of Ti to a Cu-based alloy, specifically the commercial Hyper Titanium Copper alloy (C1990 HP)…
Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphereBifu Xiong, Siliang He, Jinguo Ge, Quantong Li, Chuan Hu, Haidong Yan, Yu-An Shen
This paper aims to examine the effects of bonding temperature, bonding time, bonding pressure and the presence of a Pt catalyst on the bonding strength of Cu/SB/P-Cu/SB/Cu joints…
Online date, start – end:1989
Copyright Holder:Emerald Publishing Limited
- Professor Peng He
- Associate Professor Shuye Zhang