Soldering & Surface Mount Technology
Issue(s) available: 115 – From Volume: 1 Issue: 1, to Volume: 33 Issue: 4
Volume 33
Volume 32
Volume 31
Volume 30
Volume 29
Volume 28
Volume 27
Volume 26
Volume 25
Volume 24
Volume 23
Volume 22
Volume 21
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Issue 4 2009
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Issue 3 2009
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Issue 2 2009 Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration HDP'07
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Issue 1 2009
Volume 20
Volume 19
Volume 18
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Issue 4 2006
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Issue 3 2006
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Issue 2 2006 Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging
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Issue 1 2006
Volume 17
Volume 16
Volume 15
Volume 14
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Issue 2 2002
Volume 13
Volume 12
Volume 11
Volume 10
Volume 9
Volume 8
Volume 7
Volume 6
Volume 5
Volume 4
Volume 3
Volume 2
Volume 1
Microstructure evolution and shear strength of full Cu3Sn- microporous copper composite joint by thermo-compression bonding
F Sun, Zhen Pan, Yang Liu, Xiang Li, Haoyu Liu, Wenpeng LiThe purpose of this paper is to quickly manufacture full Cu3Sn-microporous copper composite joints for high-temperature power electronics applications and study the…
Effect of external static magnetic field on the particle distribution, the metallurgical process and the microhardness of Sn3.5Ag solder with magnetic Ni particles
Jianhua Wang, Hongbo Xu, Li Zhou, Ximing Liu, Hongyun ZhaoThis paper aims to investigate the mechanism of Ni particles distribution in the liquid Sn3.5Ag melt under the external static magnetic field. The control steps of Ni…
Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints
Jianing Wang, Jieshi Chen, Zhiyuan Zhang, Peilei Zhang, Zhishui Yu, Shuye ZhangThe purpose of this article is the effect of doping minor Ni on the microstructure evolution of a Sn-xNi (x = 0, 0.05 and 0.1 wt.%)/Ni (Poly-crystal/Single-crystal…
Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate
Xiuqi Wang, Fenglian Sun, Bangyao Han, Yilun Cao, Jinyang Du, Long Shao, Guohuai LiuThe purpose of this paper is to investigate the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates in different soldering processes and the effects of…
Effect of different soldering temperatures on the properties of COB light source
Zhao Wang, Yuefeng Li, Jun Zou, Bobo Yang, Mingming ShiThe purpose of this paper is to investigate the effect of different soldering temperatures on the performance of chip-on-board (COB) light sources during vacuum reflow soldering.
Detection of solder paste defects with an optimization‐based deep learning model using image processing techniques
Ali Sezer, Aytaç AltanIn the production processes of electronic devices, production activities are interrupted due to the problems caused by soldering defects during the assembly of…
Influence of moisture concentration and hydrophobic material on induced stress in FCBGA package under reflow
Elwin Heng, Mohd Zulkifly AbdullahThis paper focuses on the fluid-structure interaction (FSI) analysis of moisture induced stress for the flip chip ball grid array (FCBGA) package with hydrophobic and…
Defect patterns study of pick-and-place machine using automated optical inspection data
Yuqiao Cen, Jingxi He, Daehan WonThis paper aims to study the component pick-and-place (P&P) defect patterns for different root causes based on automated optical inspection data and develop a root cause…
Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process
Xu Han, Xiaoyan Li, Peng YaoThis study aims to investigate the effect of ultrasound on interfacial microstructures and growth kinetics of intermetallic compounds (IMCs) at different temperatures.
Reliability modeling and assessment of solder joints of electronic assemblies under mixed exposure to mechanical loads
Supriyono, Tzu-Chia Chen, Lis M. Yapanto, Zagir Azgarovich Latipov, Angelina Olegovna Zekiy, Lyubov A. Melnikova, Lakshmi Thangavelu, A. Surendar, Nikolay I. Repnikov, Zeinab ArzehgarIn this paper, a lifetime estimation model for the solder joint is proposed which is capable of considering both severe and running mechanical shocks which is the real…
Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys
Rafael Kakitani, Cassio Augusto Pinto da Silva, Bismarck Silva, Amauri Garcia, Noé Cheung, José Eduardo SpinelliOverall, selection maps about the extent of the eutectic growth projects the solidification velocities leading to given microstructures. This is because of limitations of…
Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies
Leonid Anatolevich Olenev, Rafina Rafkatovna Zakieva, Nina Nikolaevna Smirnova, Rustem Adamovich Shichiyakh, Kirill Aleksandrovich Ershov, Nisith GeethaThis study aims to present a more accurate lifetime prediction model considering solder chemical composition.
Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints
Mardiana Said, Muhammad Firdaus Mohd Nazeri, Nurulakmal Mohd Sharif, Ahmad Azmin MohamadThis paper aims to investigate the morphology and tensile properties of SAC305 solder alloy under the influence of microwave hybrid heating (MHH) for soldering at…
Model updating of a temperature field simulation of a printed circuit board assembly based on the Kriging model
Yutian Yin, Hongda Zhou, Cai Chen, Yi Zheng, Hongqiao Shen, Yubing GongThe simulated temperature profile of the printed circuit board assembly (PCBA) during reflow soldering process deviates from the actual profile. To reduce this relative…
Electronic component detection based on image sample generation
Hao Wu, Quanquan Lv, Jiankang Yang, Xiaodong Yan, Xiangrong XuThis paper aims to propose a deep learning model that can be used to expand the number of samples. In the process of manufacturing and assembling electronic components on…
Surface energetic-based analytical filling time model for flip-chip underfill process
Fei Chong Ng, Mohamad Aizat AbasThis paper aims to present new analytical model for the filling times prediction in flip-chip underfill encapsulation process that is based on the surface energetic for…
Simulation of jet printing of solder paste for surface mounted technology
Gustaf Eric Mårtensson, Johan Göhl, Andreas MarkThe purpose of this study is to propose a novel simulation framework and show that it captures the main effects of the deposition process, such as droplet shape, volume and speed.
Experimental measurements of the shear force on surface mount components simulating the wave soldering process
Violeta Carvalho, Bruno Arcipreste, Delfim Soares, Luís Ribas, Nelson Rodrigues, Senhorinha Teixeira, José C. TeixeiraThis study aims to determine the minimum force required to pull out a surface mount component in printed circuit boards (PCBs) during the wave soldering process through…
Impact of thermal interface material on luminous flux curve of InGaAlP low-power light-emitting diodes
Muna E. Raypah, Mutharasu Devarajan, Shahrom MahmudOne major problem in the lighting industry is the thermal management of the devices. Handling of thermal resistance from solder point to the ambiance of the light-emitting…
Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronics
Mathias EkpuIn microelectronics industry, the reliability of its components is a major area of concern for engineers. Therefore, it is imperative that such concerns are addressed by…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Prof Martin Goosey
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