Soldering & Surface Mount Technology
Issue(s) available: 111 – From Volume: 1 Issue: 1, to Volume: 32 Issue: 4
Category:
Electrical and Electronic Engineering
Volume 32
Volume 31
Volume 30
Volume 29
Volume 28
Volume 27
Volume 26
Volume 25
Volume 24
Volume 23
Volume 22
Volume 21
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Issue 4 2009
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Issue 3 2009
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Issue 2 2009 Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration HDP'07
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Issue 1 2009
Volume 20
Volume 19
Volume 18
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Issue 4 2006
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Issue 3 2006
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Issue 2 2006 Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging
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Issue 1 2006
Volume 17
Volume 16
Volume 15
Volume 14
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Issue 2 2002
Volume 13
Volume 12
Volume 11
Volume 10
Volume 9
Volume 8
Volume 7
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Volume 5
Volume 4
Volume 3
Volume 2
Volume 1
The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces
Rabiatul Adawiyah Mohamed Anuar, Saliza Azlina OsmanThe surface finish is an essential step in printed circuit boards design because it provides a solderable surface for electronic components. The purpose of this study to…
Spatial analysis of underfill flow in flip-chip encapsulation
Fei Chong Ng, Mohd Hafiz Zawawi, Mohamad Aizat AbasThe purpose of the study is to investigate the spatial aspects of underfill flow during the flip-chip encapsulation process, for instance, meniscus evolution and contact…
Performance of 96.5Sn–3Ag–0.5Cu/fullerene composite solder under isothermal ageing and high-current stressing
Guang Chen, Xinzhan Cui, Yaofeng Wu, Wei Li, Fengshun WuThe purpose of this paper is to investigate the effect of fullerene (FNS) reinforcements on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305…
Reliability assessment of ball grid array joints under combined application of thermal and power cycling: solder geometry effect
Sathish Kumar, Oleg R. Kuzichkin, Ahmed Faisal Siddiqi, Inna Pustokhina, Aleksandr Yu KrasnopevtsevThis study aims to investigate simultaneous power and thermal loading.
Automatic optical inspection system for IC solder joint based on local-to-global ensemble learning
Wenjie Chen, Nian Cai, Huiheng Wang, Jianfa Lin, Han WangAutomatic optical inspection (AOI) systems have been widely used in many fields to evaluate the qualities of products at the end of the production line. The purpose of…
Influence of aging on microstructure and hardness of lead-free solder alloys
Carina Morando, Osvaldo FornaroThe purpose of this paper is to carry out a study of the evolution of the microstructure and the microhardness of Sn-Cu-Ag alloys from as-cast condition and under…
Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition
Norliza Ismail, Azman Jalar, Maria Abu Bakar, Nur Shafiqa Safee, Wan Yusmawati Wan Yusoff, Ariffin IsmailThe purpose of this paper is to investigate the effect of carbon nanotube (CNT) addition on microstructure, interfacial intermetallic compound (IMC) layer and…
The effect of Bi addition on the electrical and microstructural properties of SAC405 soldered structure
Delfim Soares, Manuel Sarmento, Daniel Barros, Helder Peixoto, Hugo Figueiredo, Ricardo Alves, Isabel Delgado, José C. Teixeira, Fátima CerqueiraThis study aims to investigate the effect of bismuth addition (up to 30 Wt%) on the microstructure and electrical conductivity of a commercial lead-free alloy (SAC405…
An experimental study of carbonyl powder power inductor cracking during reflow process
Faisal Rehman, Rafiq Asghar, Kashif Iqbal, Ali Aman, Agha Ali NawazIn surface mount assembly (SMA) process, small components are subjected to high temperature variations, which result in components’ deformation and cracking. Because of…
Mechanical reliability of self-aligned chip assembly after reflow soldering process
Mohd Najib Ali Mokhtar, M.Z. Abdullah, Abdullah Aziz Saad, Fakhrozi CheaniThis paper focuses on the reliability of the solder joint after the self-alignment phenomenon during reflow soldering. The aim of this study is to analyse the joint…
An investigation on function of current type on solder joint degradation in electronic packages
Wenhui Cai, Fei Huang, Kai Liu, Mohammed AlaazimAs in real applications several alternating current (AC) currents may be injected to the electronic devices, this study aims to analyze their effects on the lifetime of…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen access:
hybridEditor:
- Prof Martin Goosey
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