Soldering & Surface Mount Technology
Issue(s) available: 110 – From Volume: 1 Issue: 1, to Volume: 32 Issue: 3
Category:
Electrical and Electronic Engineering
Volume 32
Volume 31
Volume 30
Volume 29
Volume 28
Volume 27
Volume 26
Volume 25
Volume 24
Volume 23
Volume 22
Volume 21
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Issue 4 2009
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Issue 3 2009
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Issue 2 2009 Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration HDP'07
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Issue 1 2009
Volume 20
Volume 19
Volume 18
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Issue 4 2006
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Issue 3 2006
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Issue 2 2006 Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging
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Issue 1 2006
Volume 17
Volume 16
Volume 15
Volume 14
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Issue 2 2002
Volume 13
Volume 12
Volume 11
Volume 10
Volume 9
Volume 8
Volume 7
Volume 6
Volume 5
Volume 4
Volume 3
Volume 2
Volume 1
Impact of convection on thermographic analysis of silver based thermal joints
Krzysztof Jakub Stojek, Jan Felba, Johann Nicolics, Dominik WołczyńskiThis paper aims to develop thermal analysis method of thermal joints characterization. The impact on convection on thermal resistance analysis with use thermography for…
Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing
Oliver Krammer, Tareq I. Al-Ma’aiteh, Balazs Illes, David Bušek, Karel DušekThe purpose of this paper is to investigate the effect of different viscosity models (Cross and Al-Ma’aiteh) and different printing speeds on the numerical results (e.g…
Selective etching and hardness properties of quenched SAC305 solder joints
Muhamad Zamri Yahaya, Nor Azmira Salleh, Soorathep Kheawhom, Balazs Illes, Muhammad Firdaus Mohd Nazeri, Ahmad Azmin MohamadThe purpose of this paper is to investigate the morphology of intermetallic (IMC) compounds and the mechanical properties of SAC305 solder alloy under different cooling conditions.
The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces
Rabiatul Adawiyah Mohamed Anuar, Saliza Azlina OsmanThe surface finish is an essential step in printed circuit boards design because it provides a solderable surface for electronic components. The purpose of this study to…
The influence of soldering process parameters on the optical and thermal properties of power LEDs
Przemysław Ptak, Krzysztof Górecki, Agata Skwarek, Krzysztof Witek, Jacek TarasiukThis paper aims to present the results of investigations that show the influence of soldering process parameters on the optical and thermal parameters of power LEDs.
Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces
Daniel Straubinger, István Bozsóki, Balazs Illes, Oliver Krammer, David Bušek, Attila GeczyThe paper aims to present an investigation on heat transfer in a vapour phase soldering (VPS) oven, focusing on the differences of horizontally and vertically aligned…
Performance of 96.5Sn–3Ag–0.5Cu/fullerene composite solder under isothermal ageing and high-current stressing
Guang Chen, Xinzhan Cui, Yaofeng Wu, Wei Li, Fengshun WuThe purpose of this paper is to investigate the effect of fullerene (FNS) reinforcements on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305…
Reliability assessment of ball grid array joints under combined application of thermal and power cycling: solder geometry effect
Sathish Kumar, Oleg R. Kuzichkin, Ahmed Faisal Siddiqi, Inna Pustokhina, Aleksandr Yu KrasnopevtsevThis study aims to investigate simultaneous power and thermal loading.
Effect of different thermocouple constructions on heat-level vapour phase soldering profiles
Mohamed Amine Alaya, Viktória Megyeri, David Bušek, Gábor Harsányi, Attila GeczyTo improve productivity and reach better quality in assembling, measurements and proper process controlling are a necessary factor. This study aims to focus on the…
Automatic optical inspection system for IC solder joint based on local-to-global ensemble learning
Wenjie Chen, Nian Cai, Huiheng Wang, Jianfa Lin, Han WangAutomatic optical inspection (AOI) systems have been widely used in many fields to evaluate the qualities of products at the end of the production line. The purpose of…
Influence of aging on microstructure and hardness of lead-free solder alloys
Carina Morando, Osvaldo FornaroThe purpose of this paper is to carry out a study of the evolution of the microstructure and the microhardness of Sn-Cu-Ag alloys from as-cast condition and under…
Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition
Norliza Ismail, Azman Jalar, Maria Abu Bakar, Nur Shafiqa Safee, Wan Yusmawati Wan Yusoff, Ariffin IsmailThe purpose of this paper is to investigate the effect of carbon nanotube (CNT) addition on microstructure, interfacial intermetallic compound (IMC) layer and…
Low-voiding solder pastes in LED assembly
Barbara Dziurdzia, Maciej Sobolewski, Janusz Mikołajek, Sebastian WrońskiThis paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow…
Structural characterization of inkjet printed capacitor layers in various technological conditions
Milena Kiliszkiewicz, Dariusz Przybylski, Jan Felba, Ryszard KorbutowiczThe purpose of this paper is to analyze the individual steps during the printing of capacitor structures. The method of substrate preparation, the obtained roughness of…
The effect of Bi addition on the electrical and microstructural properties of SAC405 soldered structure
Delfim Soares, Manuel Sarmento, Daniel Barros, Helder Peixoto, Hugo Figueiredo, Ricardo Alves, Isabel Delgado, José C. Teixeira, Fátima CerqueiraThis study aims to investigate the effect of bismuth addition (up to 30 Wt%) on the microstructure and electrical conductivity of a commercial lead-free alloy (SAC405…
An experimental study of carbonyl powder power inductor cracking during reflow process
Faisal Rehman, Rafiq Asghar, Kashif Iqbal, Ali Aman, Agha Ali NawazIn surface mount assembly (SMA) process, small components are subjected to high temperature variations, which result in components’ deformation and cracking. Because of…
Mechanical reliability of self-aligned chip assembly after reflow soldering process
Mohd Najib Ali Mokhtar, M.Z. Abdullah, Abdullah Aziz Saad, Fakhrozi CheaniThis paper focuses on the reliability of the solder joint after the self-alignment phenomenon during reflow soldering. The aim of this study is to analyse the joint…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen access:
hybridEditor:
- Prof Martin Goosey
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