Soldering & Surface Mount Technology
Issue(s) available: 128 – From Volume: 1 Issue: 1, to Volume: 36 Issue: 2
Influences of hygrothermal conditions and structure parameters on moisture diffusion behavior in a system‐in‐package module by moisture-thermal-mechanical-coupled finite element modeling
Li Liu, Chunhua Zhang, Ping Hu, Sheng Liu, Zhiwen ChenThis paper aims to investigate the moisture diffusion behavior in a system-in-package module systematically by moisture-thermalmechanical-coupled finite element modeling with…
A temperature control method of hot-bar soldering based on extended Kalman filter
Min Zeng, Jianxing Xie, Zhitao Li, Qincheng Wei, Hui YangThis study aims to introduce a novel technique for nonlinear sensor time constant estimation and sensor dynamic compensation in hot-bar soldering using an extended Kalman filter…
Improvement of SAC0307/Cu column friction plunge micro-welding quality by static constraint
Zhenkun Li, Zhili Zhao, Jinliang Liu, Xin DingTo solve the problems caused by using precise molds for copper column positioning in the current column grid array package, this paper aims to optimize the proposed friction…
Influence of doping Si3N4 nanoparticles on the properties and microstructure of Sn58Bi solder for connecting Cu substrate
Kai Deng, Liang Zhang, Chen Chen, Xiao Lu, Lei Sun, Xing-Yu GuoThis study aims to explore the feasibility of adding Si3N4 nanoparticles to Sn58Bi and provides a theoretical basis for designing and applying new lead-free solder materials for…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang