Soldering & Surface Mount Technology
Issue(s) available: 120 – From Volume: 1 Issue: 1, to Volume: 34 Issue: 4
Numerical simulation of reliability of single-sided/double-sided package interconnect structure under temperature cyclic load
Shuo Huang, Yang Liu, Ke LiThe purpose of this paper is to compare the single-sided packaging structure and double-sided packaging structure of high-power module and study the overall heat…
Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu3Sn/Cu solder joint
Gangli Yang, Xiaoyan Li, Xu Han, Shanshan LiThis study aims to analyse the changes in the microstructure and grain orientation of the full Cu3Sn solder joint (Cu/Cu3Sn/Cu) during isothermal aging at 420°C.
Investigation of ultrasound-assisted soldering of SiC ceramics by using Zn-Al-In solder for high-temperature applications
Igor Kostolný, Roman Kolenak, Paulina Babincova, Martin KusýThis study aims to investigate soldering of SiC ceramics by using Zn-Al-In-based solders and ultrasonic soldering. The focus was on the quality of soldered joints…
Mechanical, photoelectric and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip LED package component during aging
Xinmeng Zhai, Yue Chen, Yuefeng Li, Jun Zou, Mingming Shi, Bobo YangThis study aims to study the mechanical, photoelectric, and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip light-emitting diode (LED…
Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging
Bangyao Han, Fenglian Sun, Chi Zhang, Xinlei WangThis paper aims to investigate the effect of the Cu, Ni and Ag addition in Sn5Sb-based alloy on the mechanical properties and its mechanism.
Effect of the IMC layer geometry on a solder joint thermomechanical behavior
Paulina Araújo Capela, Maria Sabrina Souza, Sharlane Costa, Jose C. Teixeira, Miguel Fernandes, Hugo Figueiredo, Isabel Delgado, Delfim SoaresIn a printed circuit board assembly (PCBA), the coefficient of thermal expansion (CTE) mismatch between the solder joint materials has a detrimental impact on reliability…
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder
Rizk Mostafa Shalaby, Musaeed AllzelehThis study aims to study the impact of intermetallic compound on microstructure, mechanical characteristics and thermal behavior of the melt-spun Bi-Ag high-temperature…
Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach
Wan Yusmawati Wan Yusoff, Norliza Ismail, Nur Farisa Nadia Mohmad Lehan, Azuraida Amat, Ku Zarina Ku Ahmad, Azman Jalar, Irman Abdul RahmanThis paper aims to investigate the effect of different doses of gamma radiation on the micromechanical response (hardness properties and creep behaviour) of…
Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review
Lina Syazwana Kamaruzzaman, Yingxin GohThis paper aims to review recent reports on mechanical properties of Sn-Bi and Sn-Bi-X solders (where X is an additional alloying element), in terms of the tensile…
Effect of TiO2 nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy
Hamed Al-sorory, Mohammed S. Gumaan, Rizk Mostafa ShalabyThis study aims to investigate the effect of a small amount of TiO2 NPs addition on the microstructure, thermal, mechanical and electrical properties of environmentally…
Study on temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints
Meng Xu, Fenglian Sun, Zhen Pan, Yang LiuThe purpose of this paper is to study the temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints compared with Sn-5Sb/Cu and SAC305/Cu micro…
Thermal and mechanical analysis of low-temperature and low-pressure silver-based sintered thermal joints
Krzysztof Jakub Stojek, Jan Felba, Damian Nowak, Karol Malecha, Szymon Kaczmarek, Patryk Tomasz Tomasz AndrzejakThis paper aims to perform thermal and mechanical characterization for silver-based sintered thermal joints. Layer quality affects thermal and mechanical performance, and…
Predictive model of the solder paste stencil printing process by response surface methodology
Chun-Sheng Chen, Hai Wang, Yung-Chin Kao, Po-Jen Lu, Wei-Ren ChenThis paper aims to establish the predictive equations of height, area and volume of printed solder paste during solder paste stencil printing (SPSP) process in surface…
Development of holmium doped eutectic Sn-Ag lead-free solder for electronic packaging
Rizk Mostafa ShalabyThis study aims to summarize the effects of minor addition of Ho REE on the structure, mechanical strength and thermal stability of binary Sn- Ag solder alloys for…
An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model
Yangyang Lai, Ke Pan, Yuqiao Cen, Junbo Yang, Chongyang Cai, Pengcheng Yin, Seungbae ParkThis paper aims to provide the proper preset temperatures of the convection reflow oven when reflowing a printed circuit board (PCB) assembly with varied sizes of…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Prof Martin Goosey
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