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The dissolution rates of iron and alloyed steels in molten lead‐free solders were investigated in order to clarify the effect of erosion of iron plating on soldering iron tips. The dissolution rates of iron‐based alloys in lead‐free solders were found to be about three times greater than in conventional Sn‐Pb eutectics, indicating that the iron plating of a soldering iron tip is subjected to heavier damage when used with lead‐free rather than eutectic Sn‐Pb. Several steel alloys showed dissolution rates similar to that of pure iron, suggesting that compositional changes in the iron plating may have little influence on the erosion depth. Decreases in the reaction temperature and time, and a small addition of iron into the solder was found to be effective in suppressing both dissolution of iron wire and erosion of iron plating.

The paper's purpose is to provide a solution to a problem on dissolution and disappearance of copper electrodes in solder bath in lead free soldering on printed circuit board (PCB).

The influence of the copper concentration, temperature, and flowing velocity of molten solder on the copper dissolution have been estimated, and it has been found that the dissolution rate of copper electrodes in Sn‐3.0Ag‐xCu solder alloys is defined by temperature and copper concentration in solder.

It was found that increasing the copper concentration to 1.5 mass% in Sn‐3.0Ag‐xCu solder could lower the rate of copper dissolution to the equivalent level as that of the conventional Sn‐Pb eutectic alloy at the temperature of 560 K.

In this paper, a dissolution phenomenon has been studied on Sn‐Ag‐Cu system alloys. It is interesting about the effect of other elements for controlling the dissolution.

The method to control the copper electrode dissolution in wave soldering is clarified. The copper dissolution rate for Sn‐3.0Ag‐1.5Cu solder can be lowered to the equivalent level as that of conventional Sn‐Pb eutectic solder, even at 560 K.

In this paper, a dissolution phenomenon has been evaluated by flowing molten solder which is close to one in a practical soldering. It is the most different point from earlier study.

To determine the endurance of stainless steels used for wave soldering container materials in molten lead‐free solders.

A dissolution test on stainless steel wires in molten lead‐free solders was performed. The effects of the composition of the stainless steel, test period, and composition of the lead‐free solder on the dissolution rate were investigated. Dissolution was measured by cross‐sectioning the wires and measuring the reduction in radius.

The Sn‐Ag lead‐free solder showed faster dissolution than did the conventional Sn‐Pb eutectic. A severe dissolution rate was also observed for the Sn‐Zn system.

Quantitative data for the reaction rate between stainless steels and molten lead‐free solder is useful for the design of soldering machines and in planning their maintainance.

This paper shows the effect of basic factors on the dissolution rate of stainless steels in molten solder. It can give a basic understanding to engineers of the effect of lead free solders on wave soldering process equipment.

The purpose of this paper is to investigate the various factors that influence the dissolution of copper in molten solder, paying particular attention to important parameters: temperature, solder composition and flow rate.

To determine the dissolution rate of copper in lead‐free solders, a simple and automated technique is developed. This methodology provides repeatable measurements that allow the various experimental parameters to be isolated. Factors that greatly affect the dissolution rate of copper, such as soldering temperature, flow rate and solder composition, are taken into account. Particular attention is paid to the flow rate of the molten solder. In fact, different alloys at the same temperature can have considerably different flow rates, owing to their different viscosities at that temperature. The dissolution rates of copper in seven lead‐free alloys and the Sn‐Pb alloy are compared at 255, 275 and 300°C.

It is observed that generally the samples with a thicker intermetallic layer are those that exhibit a longer dissolution time.

The transition from tin‐lead to lead‐free increases the tendency for copper dissolution in molten solders, clearly representing a serious risk to circuit reliability. This paper presents the many advantages of a method for comparing the dissolution rate of copper with different solder alloys.

Romantic dissolution is a common experience throughout the life course, particularly during emerging adulthood (ages 18–29). The purpose of this review was to summarize and critique theoretical approaches and empirical findings of the aftermath of dating relationship dissolution.

Article searches were conducted within PsycINFO. We utilized terms related to romantic relationship dissolution (i.e., breakup, romantic breakup, relationship termination, relationship dissolution, romantic dissolution, romantic termination, post-dissolution) in a search for key words. We narrowed the results further by limiting the search to include participants between the ages of 18 and 29.

Experiencing romantic dissolution can result in both positive and negative emotional reactions and behaviors, including personal growth and self-expansion as well as experiencing physical and emotional abuse from ex-partners. Furthermore, former romantic partners commonly form other types of friendships and casual sexual relationships after the termination of committed romantic relationships. Many theoretical frameworks are used to guide these investigations, and some articles lack a theoretical framework.

Developmental Systems Theory might be a theoretical framework that best shapes our investigations of romantic dissolution in dating relationships that occur in emerging adulthood.

Relationship education programs would be enhanced by discussing the developmental needs that are important for young people and the ways in which their romantic experiences can or cannot meet those needs. In addition to learning about how to have healthy romantic relationships, young people can also benefit from learning how to identify when romantic relationships should end, and how to end them successfully.

This chapter focuses on the heterogeneous pathways (including marital and cohabiting union and parenting histories) through which people navigate their family life courses from adolescence through mid-life, and their implications for union dissolution in middle and later life. The analyses draw on data (retrospective, cross-sectional) from the 2011 and 2017 Canadian General Social Surveys. The study sample includes individuals aged 50 and over (n = 14,547) who were in a union at age 50. Sequence analyses are used to identify the most common family life course trajectories among these individuals from adolescence through midlife (ages 15–50). Logistic regression analyses then address the implications of these trajectories for union dissolution in middle and later life (ages 50+). The results reveal four main family trajectories that characterize the earlier years of the adult life course: married with children, cohabiting with children, single or cohabiting without children, and married without children. These family trajectories, together with their level of complexity, play an important role in relation to both marital and cohabiting union dissolution outcomes in later life.

The objective of this paper is to establish a solution strategy for obtaining dual solutions, namely trivial (conventional) and nontrivial (unconventional) solutions, of coupled pore-fluid flow and chemical dissolution problems in heterogeneous porous media.

Through applying a perturbation to the pore-fluid velocity, original governing partial differential equations of a coupled pore-fluid flow and chemical dissolution problem in heterogeneous porous media are transformed into perturbed ones, which are then solved by using the semi-analytical finite element method. Through switching off and on the applied perturbation terms in the resulting perturbed governing partial differential equations, both the trivial and nontrivial solutions can be obtained for the original governing partial differential equations of the coupled pore-fluid flow and chemical dissolution problem in fluid-saturated heterogeneous porous media.

When a coupled pore-fluid flow and chemical dissolution system is in a stable state, the trivial and nontrivial solutions of the system are identical. However, if a coupled pore-fluid flow and chemical dissolution system is in an unstable state, then the trivial and nontrivial solutions of the system are totally different. This recognition can be equally used to judge whether a coupled pore-fluid flow and chemical dissolution system involving heterogeneous porous media is in a stable state or in an unstable state. The proposed solution strategy can produce dual solutions for simulating coupled pore-fluid flow and chemical dissolution problems in fluid-saturated heterogeneous porous media.

A solution strategy is proposed to obtain the nontrivial solution, which is often overlooked in the computational simulation of coupled pore-fluid flow and chemical dissolution problems in fluid-saturated heterogeneous porous media. The proposed solution strategy provides a useful way for understanding the underlying dynamic mechanisms of the chemical damage effect associated with the stability of structures that are built on soil foundations.

Identifies the communication strategies available to companies when dissolving cross‐cultural inter‐organisational relationships to achieve effective (cooperative) outcomes. First, addresses the importance of communication dissolution, and proposes a typology of available communication strategies. Second, emphasises the importance of understanding cultural diversity in business relationships in general and dissolution in particular. Third, proposes two related theoretical frameworks. The first addresses different conflict management styles that bridge the gap between dissolution communication strategies and the cultural context in which the actors are embedded. The second is a theoretical model for analysing dissolution process in a cross‐cultural business relationship context. Proposes the independent variable, culture, as providing a frame of reference by which meaning and intent are assigned by the foreign company to the communications of the terminating company (disengager), thus affecting the choice of dissolution strategy.

The electrodissolution of binary alloy films formed on inert substrates is a subject of recent origin. The Cu‐Au and Cu ‐30 per cent alloys, when dissolved anodically, showed a selective dissolution of the less noble metal occurring earlier than the simultaneous dissolution of both the components of the binary alloy films. However, the mode of dissolution, either galvanostatic or potentiostatic, varied the mechanism of dissolution. In the galvanostatic mode of dissolution, the dissolution changed from a preferential to a simultaneous one, while in the potentiodynamic type, simultaneous dissolution occurred. In the case of an ideal solid solution of Cu‐Ni alloy, under linear sweep conditions, an intermediate phase and an intermetallic compound dissolved simultaneously. Only for the eutectic types of alloy like Cu‐Pb and Cd‐Zn the dissolution was selective. On the other hand, Swathirajan considered that the dissolution was always preferential for the less noble metal.

Interorganisational buyer‐seller relationships have been primarily studied from the perspective of relationship development and the benefits accrued from relationships. There is a lack of research concerning problems with relationships and relationship dissolution. The dissolution of a business relationship can be either desirable, freeing badly deployed resources, as indicated by the customer portfolio approach, or harmful, involving costly legal disputes and the loss of company reputation. By employing a theory‐driven case study approach we examine the exit strategies available for the disengager in dissolving interorganisational buyer‐seller relationships. We show that the quality of dissolution is affected by the disengager’s choice of exit strategy. Managerial suggestions are provided for achieving “beautiful exits”, i.e. such communication strategies which minimise damages of the dissolution to the disengager, the other party, and the connected business network.