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1 – 7 of 7Giang Ngo Tinh Nguyen and Xianmin Liu
This study explores the relationship between corruption and shadow economy (SE) by examining the potential links and interactions between these two phenomena to see whether it is…
Abstract
Purpose
This study explores the relationship between corruption and shadow economy (SE) by examining the potential links and interactions between these two phenomena to see whether it is a one-way or two-way relationship and a complementarity or substitution linkage.
Design/methodology/approach
Using a dataset comprised of 145 countries all over the world between 1996 and 2015, the authors apply the simultaneous two-step system generalized method of moments approach to address the research question.
Findings
The study findings support a positive bidirectional relationship between corruption and SE. As such, this study has provided evidence supporting the complementarity association. In the authors' further analyses, they point out that several factors can moderate this positive bidirectional linkage. In particular, while Foreign Direct Investment (FDI) inflows strengthen it, it is weakened by other institutional factors such as civil liberties and political rights. Finally, by splitting the full sample into three different subsamples and then examining countries at varying stages of economic development, the authors can gain valuable insights into the evolving dynamics of the relationship between corruption and SE. Specifically, while the authors observe that the positive direction of corruption to SE remains unchanged across different nations, they observe that the positive influence of SE on corruption is strongest among developed economies only.
Practical implications
The study findings provide an important policy implication. This study highlights the synergistic relationship between SE and corruption, indicating that reducing corruption will reduce the size of the SE. Consequently, this reduction in the SE can mitigate the adverse effects of corruption on economic development.
Originality/value
This paper is among the first empirical studies that critically investigate the interrelationship between SE and corruption. It then explores how this two-way linkage is conditional on some factors, such as economic development levels and institutional quality indicators.
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Yanjiang Huang, Yanglong Zheng, Nianfeng Wang, Jun Ota and Xianmin Zhang
The paper aims to propose an assembly scheme based on master–slave coordination for a compliant dual-arm robot to complete a peg-in-hole assembly task.
Abstract
Purpose
The paper aims to propose an assembly scheme based on master–slave coordination for a compliant dual-arm robot to complete a peg-in-hole assembly task.
Design/methodology/approach
The proposed assembly scheme is inspired by the coordinated behaviors of human beings in the assembly process. The left arm and right arm of the robot are controlled to move alternately. The fixed arm and the moving arm are distinguished as the slave arm and the master arm, respectively. The position control model is used at the uncontacted stage, and the torque control model is used at the contacted stage.
Findings
The proposed assembly scheme is evaluated through peg-in-hole assembly experiments with different shapes of assembly piece. The round, triangle and square assembly piece with 0.5 mm maximum clearance between the peg and the hole can be assembled successfully based on the proposed method. Furthermore, three assembly strategies are investigated and compared in the peg-in-hole assembly experiments with different shapes of assembly piece.
Originality/value
The contribution of this study is that the authors propose an assembly scheme for a compliant dual-arm robot to overcome the low positioning accuracy and complete the peg-in-hole assembly tasks with different shapes parts.
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With the analysis of the causes of corruption, this study aims to investigate specific anti-corruption measures that can be implemented to reform the political system and the…
Abstract
Purpose
With the analysis of the causes of corruption, this study aims to investigate specific anti-corruption measures that can be implemented to reform the political system and the social climate of China.
Design/methodology/approach
This study examines 97 severe corruption cases of high-ranking officials in China, which occurred between 2012 and 2015. As this insinuates that both institutional and social corruption are major problems in China, the analysis delves into multiple facts of corruption, including different types, four primary underlying causes, and suggestions regarding the implementation of three significant governmental shifts that focus on investigation, prevention tactics and legal regulations.
Findings
China’s corruption is not only individual-based but also it has developed into institutional corruption and social corruption. Besides human nature and instinct, the causes of corruption can be organised into four categories, namely, social customs, social transitions, institutional designs and institutional operations. For the removed high-ranking officials, the formation of interest chains was an important underlying cause behind their corruption.
Originality/value
This study makes a significant contribution to the literature because this study provides a well-rounded approach to a complex issue by highlighting the significance of democracy and the rule of law as ways to regulate human behaviour to combat future corruption.
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Jeremy Yee Li Yap, Chiung Chiung Ho and Choo-Yee Ting
The purpose of this paper is to perform a systematic review on the application of different multi-criteria decision-making (MCDM) methods in solving the site selection problem…
Abstract
Purpose
The purpose of this paper is to perform a systematic review on the application of different multi-criteria decision-making (MCDM) methods in solving the site selection problem across multiple problem domains. The domains are energy generation, logistics, public services and retail facilities. This study aims to answer the following research questions: Which evaluating criteria were used for each site selection problem domain? Which MCDM methods were frequently applied in a particular site selection problem domain?
Design/methodology/approach
The goals of the systematic review were to identify the evaluating criteria as well as the MCDM method used for each problem domain. A total of 81 recent papers (2014–2018) including 32 papers published in conference proceedings and 49 journal articles from various databases including IEEE Xplore, PubMed, Springer, Taylor and Francis as well as ScienceDirect were evaluated.
Findings
This study has shown that site selection for energy generation facilities is the most active site selection problem domain, and that the analytic hierarchy process (AHP) method is the most commonly used MCDM method for site selection. For energy generation, the criteria which were most used were geographical elements, land use, cost and environmental impact. For logistics, frequently used criteria were geographical elements and distance, while for public services population density, supply and demand, geographical layout and cost were the criteria most used. Criteria useful for retail facilities were the size (space) of the store, demographics of the site, the site characteristics and rental of the site (cost).
Research limitations/implications
This study is limited to reviewing papers which were published in the years 2014–2018 only, and only covers the domains of energy generation, logistics, public services and retail facilities.
Practical implications
MCDM is a viable tool to be used for solving the site selection problem across the domains of energy generation, logistics, public services and retail facilities. The usage of MCDM continues to be relevant as a complement to machine learning, even as data originating from embedded IoT devices in built environments becomes increasingly Big Data like.
Originality/value
Previous systematic review studies for MDCM and built environments have either focused on studying the MCDM techniques itself, or have focused on the application of MCDM for site selection in a single problem domain. In this study, a critical review of MCDM techniques used for site selection as well as the critical criteria used during the MCDM process of site selection was performed on four different built environment domains.
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Hao Wu and Xiangrong Xu
The authors propose a solder joint recognition method based on eigenspace technology.
Abstract
Purpose
The authors propose a solder joint recognition method based on eigenspace technology.
Design/methodology/approach
The original solder joint image is transformed into a small set of feature subspace called “eigensolder”, which is the eigenvector of the training set and can represent a solder joint well. Then, the eigensolder feature is extracted by projecting the new solder joint image into the subspace, and the Euclidean distance measure is used to classify the solder joint.
Findings
The experimental results show that the proposed method is superior to the traditional classification method in solder joint recognition, and it can achieve 96.43 per cent recognition rate using only 15 eigenvalue images. It is suitable for the classification with small samples.
Originality/value
Traditional classification method like neural network and statistical method cost long time. Here, Eigensolder method is used to extract feature. Eigensolder method is more efficient, as it uses the principal component analysis method to reduce the feature dimension of input image and only measure the distance to classify.
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Wenjie Chen, Nian Cai, Huiheng Wang, Jianfa Lin and Han Wang
Automatic optical inspection (AOI) systems have been widely used in many fields to evaluate the qualities of products at the end of the production line. The purpose of this paper…
Abstract
Purpose
Automatic optical inspection (AOI) systems have been widely used in many fields to evaluate the qualities of products at the end of the production line. The purpose of this paper is to propose a local-to-global ensemble learning method for the AOI system based on to inspect integrated circuit (IC) solder joints defects.
Design/methodology/approach
In the proposed method, the locally statistically modeling stage and the globally ensemble learning stage are involved to tackle the inspection problem. At the former stage, the improved visual background extraction–based algorithm is used for locally statistically modeling to grasp tiny appearance differences between the IC solder joints to achieve potential defect images for the subsequent stage. At the latter stage, mean unqualified probability is introduced based on a novel ensemble learning, in which an adaptive weighted strategy is proposed for revealing different contributions of the base classifier to the inspection performance.
Findings
Experimental results demonstrate that the proposed method achieves better inspection performance with an acceptable inspection time compared with some state-of-the-art methods.
Originality/value
The approach is a promising method for IC solder joint inspection, which can simultaneously grasp the local characteristics of IC solder joints and reveal inherently global relationships between IC solder joints.
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Ali Sezer and Aytaç Altan
In the production processes of electronic devices, production activities are interrupted due to the problems caused by soldering defects during the assembly of surface-mounted…
Abstract
Purpose
In the production processes of electronic devices, production activities are interrupted due to the problems caused by soldering defects during the assembly of surface-mounted elements on printed circuit boards (PCBs), and this leads to an increase in production costs. In solder paste applications, defects that may occur in electronic cards are usually noticed at the last stage of the production process. This situation reduces the efficiency of production and causes delays in the delivery schedule of critical systems. This study aims to overcome these problems, optimization based deep learning model has been proposed by using 2D signal processing methods.
Design/methodology/approach
An optimization-based deep learning model is proposed by using image-processing techniques to detect solder paste defects on PCBs with high performance at an early stage. Convolutional neural network, one of the deep learning methods, is trained using the data set obtained for this study, and pad regions on PCB are classified.
Findings
A total of six types of classes used in the study consist of uncorrectable soldering, missing soldering, excess soldering, short circuit, undefined object and correct soldering, which are frequently used in the literature. The validity of the model has been tested on the data set consisting of 648 test data.
Originality/value
The effect of image processing and optimization methods on model performance is examined. With the help of the proposed model, defective solder paste areas on PCBs are detected, and these regions are visualized by taking them into a frame.
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