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This paper discusses some basic ideas about process development and control in Part I and applies them to soldering in Part II. Because it is possible to understand how design, materials and process affect the product, it is unnecessary and inappropriate to resort to the statistical‐correlation methods that are applied to complex processes. A process qualifies for the label ‘closed loop’ only if the design and materials going into.it are controlled. The types, degree and sophistication of control needed for a process are to be judged by consistency of the product. For soldered assemblies, the product is evaluated by visual inspection, and the adequacy of process development and control depends on the adequacy of inspection. Inspection can be improved if it is regarded as a process. It can also be improved if inspectors understand which features are important and which can be ignored safely, i.e., by understanding their causes and associated risks. Much of the criticism of visual inspection, and perception of need for automated inspection, derive from a failure to distinguish clearly enough between material and process variables, between the two types of inspection (product‐oriented and materials/process‐oriented) and between appearance and risk. Properly controlled visual inspection is well suited for evaluating the soldering process. The most important visual attribute to look for in solder inspection is the contour of the fillet, because this is what reveals the quality of wetting, and wetting is the most important physical attribute of the connection in determining its strength and reliability. Wetting depends on just two basic requirements, heat transfer and solderability, and these are discussed in some detail. Causes of non‐ideal texture and lustre of the solder are given, but these attributes do not affect reliability, nor is measuring solder purity important. Additional factors which do affect reliability relate more to design and materials than to process. Failure to deal with these factors can result in solder defects that are undetectable by any inspection technique. The answer to this problem is therefore not automated inspection to find more kinds of defects than visual inspection can, but control of design and materials, as well as process, to prevent them entirely.

Although wave soldering is a long established technique, the touch‐up percentage is still unacceptably high. This leads to high touch‐up costs and too low product quality. One cause lies in the fact that the complexity of the boards is increasing all the time (greater component density, greater diversity, more leads and smaller pitches). The main reason, however, lies in the lack of a fundamental process technology background. This becomes even more serious now that soldering processes are becoming more critical. The touch‐up percentage can and must be lowered through accurate process adjustment and control. A further improvement in process adjustment and control will give a considerable improvement in soldering quality in the short term. In this way, the actions are successful, although benefits can be achieved only if the improvements are consolidated. Further improvements can be achieved through systematic application of design rules.

In the production processes of electronic devices, production activities are interrupted due to the problems caused by soldering defects during the assembly of surface-mounted elements on printed circuit boards (PCBs), and this leads to an increase in production costs. In solder paste applications, defects that may occur in electronic cards are usually noticed at the last stage of the production process. This situation reduces the efficiency of production and causes delays in the delivery schedule of critical systems. This study aims to overcome these problems, optimization based deep learning model has been proposed by using 2D signal processing methods.

An optimization-based deep learning model is proposed by using image-processing techniques to detect solder paste defects on PCBs with high performance at an early stage. Convolutional neural network, one of the deep learning methods, is trained using the data set obtained for this study, and pad regions on PCB are classified.

A total of six types of classes used in the study consist of uncorrectable soldering, missing soldering, excess soldering, short circuit, undefined object and correct soldering, which are frequently used in the literature. The validity of the model has been tested on the data set consisting of 648 test data.

The effect of image processing and optimization methods on model performance is examined. With the help of the proposed model, defective solder paste areas on PCBs are detected, and these regions are visualized by taking them into a frame.

The effects of oxygen on solder surface tension, wetting time and surface damping are presented. Oxygen levels greater than 10 ppm lower surface tension, increase wetting time and increase surface damping. Decreased surface tension leads to higher misalignment defects in reflow soldering, but can lower the incidence of dewetting. Increased wetting times can increase non‐wetting defects in both wave and reflow soldering, especially when using no‐clean fluxes. Increased surface damping can lead to lower bridging rates in wave soldering, provided that the oxygen level and flux levels are properly balanced. Choosing the optimum oxygen level for production soldering is trade ‐ off between the stability and the versatility of the process. The most stable soldering processes will be those performed in an inert atmosphere with less than 10 ppm oxygen .These processes are insensitive to variations in soldering machine operating parameters (i,e. a larger process window).This is most desirable for manufacturers soldering large volumes of a given circuit board. The soldering process can be optimised by optimising the circuit board design. The most versatile soldering processes will be those performed in an inert atmosphere with controlled addition of oxygen in the range of 100 ppm to 10,000 ppm (1%). This will be most desirable to manufacturers soldering short runs of a large variety of circuit boards. The soldering process is best optimised by controlling the soldering machine operating parameters (oxygen, flux, preheat, conveyor speed, etc.).

In an attempt to reduce the incidence of wave soldering defects on printed wiring assemblies, Boeing Electronics Systems Division (BESD) has been investigating and implementing SQC (Statistical Quality Control). The concept is introduced in its historical context, explained and its application by this company to troubleshoot wave soldering problems outlined. Detailed results are provided to illustrate the value of the technique and indicate the important variables influencing soldering quality.

It was observed that “no solder” or “skipped solder” defects occurred on a particular printed circuit board assembly product during wave soldering. Investigations were carried out to find out the cause of this defect and to recommend an optimal hot air level coating thickness. To evaluate whether thicker plating helps to produce better solderability, new printed circuit boards with an average plating thickness of 4.27 μm were sent for solderability testing. This increase in plating thickness resulted in no defects in the solderability test. This is in contrast to the current printed circuit board that had a no/skipped solder defect rate of 1,433 ppm due to the thinner plating thickness which was in the region of 2.26 μm. In summary, the investigations made have revealed imperfections in the pad plating, and it is recommended that a thicker or more even plating is achieved during the hot air levelling process at the printed circuit board manufacturing site so as to eliminate no/skipped solder defects that are induced by this printed circuit board deficiency.

The purpose of the present study was to review the thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the review include challenges in modelling of the reflow soldering process, optimization and the future challenges in the reflow soldering process. Besides, the numerical approach of lead-free solder reliability is also discussed.

Lead-free reflow soldering is one of the most significant processes in the development of surface mount technology, especially toward the miniaturization of the advanced SMCs package. The challenges lead to more complex thermal responses when the PCB assembly passes through the reflow oven. The virtual modelling tools facilitate the modelling and simulation of the lead-free reflow process, which provide more data and clear visualization on the particular process.

With the growing trend of computer power and software capability, the multidisciplinary simulation, such as the temperature and thermal stress of lead-free SMCs, under the influenced of a specific process atmosphere can be provided. A simulation modelling technique for the thermal response and flow field prediction of a reflow process is cost-effective and has greatly helped the engineer to eliminate guesswork. Besides, simulated-based optimization methods of the reflow process have gained popularity because of them being economical and have reduced time-consumption, and these provide more information compared to the experimental hardware. The advantages and disadvantages of the simulation modelling in the reflow soldering process are also briefly discussed.

This literature review provides the engineers and researchers with a profound understanding of the thermo-mechanical challenges of reflowed lead-free solder joints in SMCs and the challenges of simulation modelling in the reflow process.

The unique challenges in solder joint reliability, and direction of future research in reflow process were identified to clarify the solutions to solve lead-free reliability issues in the electronics manufacturing industry.

Several effects of the atmosphere in the soldering oven on both the soldering process itself and the soldering results are discussed. Experiments have been undertaken to compare the results of soldering in air and in nitrogen containing 10,100 and 1000 ppm oxygen, in which, e.g., discolouration, wettability, solderability after reflow, solder bridging and solder‐ball formation were investigated. Unmounted FR‐4 testboards with both an RMA solder paste of known high quality and a low‐residue paste were used. Mounted test boards were used to analyse the self‐alignment of components and to compare the levels of soldering defects obtained in air and in nitrogen. The test results show that a nitrogen atmosphere containing 1000 ppm of oxygen or less is sufficiently pure to realise improved soldering conditions for most types of components. For the low‐residue paste tested, 1000 ppm is too high, but 100 ppm is sufficiently low. All effects on the soldering process will depend on the amount of oxygen in the gas. To produce an oven atmosphere of nitrogen with a very low amount of O2 (e.g., <100 ppm) is rather expensive, if this oven is to work under production conditions. Will the extra cost of investment and gas consumption be worthwhile in view of a better production yield and higher product quality? The authors explain why they do not believe this to be the case.

Reflow soldering is one of the most significant factors in determining solder joint defect rate. This study aims to introduce an innovative approach for optimizing the multiple performances of the reflow soldering process.

This study aims to minimize the solder joint defect rate of a ball grid array (BGA) package by using the grey‐based Taguchi method. The entropy measurement method was employed together with the grey‐based Taguchi method to compute for the weights of each quality characteristic. The Taguchi L18 orthogonal array was performed, and the optimal parameter settings were determined. Various factors, such as slope, temperature, and reflow profile time, as well as two extreme noise factors, were considered. The thermal stress, peak temperature, reflow time, board‐ and package‐level temperature uniformity were selected as the quality characteristics. These quality characteristics were determined using the numerical method. The numerical method comprises the internal computational flow that models the reflow oven coupled with the structural heating and cooling models of the BGA assembly. The Multi‐physics Code Coupling Interface was used as the coupling software.

The analysis of variance results reveals that the cooling slope was the most influential factor among the multiple quality characteristics, followed by the soaking temperature and the peak temperature. Experimental confirmation test results show that the performance characteristics improved significantly during the reflow soldering process.

The proposed approach greatly reduces solder joint defects and enhances solutions to lead‐free reliability issues in the electronics manufacturing industry.

The findings provide new guidelines to the optimization method which are very useful for the accurate control of the solder joint defect rate within components and printed circuit board (PCB) which is one of the major requirements to achieve high reliability of electronic assemblies.

For over 30 years, wave soldering has been the most popular and most economical method for mass soldering of electronic assemblies. For conventional circuits, this is a mature technology. Training, proper board design, process control during board fabrication, assembly and soldering and, finally, an awareness of the need for solderability have resulted in very high manufacturing yields in some companies with the associated high quality and much improved profits which result by doing it right the first time. With the introduction of surface mount technology, the same concerns need to be addressed. However, due to the smaller size of components and higher densities, new problems arise. This paper presents some of the concerns encountered in wave soldering of surface mount assemblies.