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1 – 2 of 2Calvin Ling, Muhammad Taufik Azahari, Mohamad Aizat Abas and Fei Chong Ng
This paper aims to study the relationship between the ball grid array (BGA) flip-chip underfilling process parameter and its void formation region.
Abstract
Purpose
This paper aims to study the relationship between the ball grid array (BGA) flip-chip underfilling process parameter and its void formation region.
Design/methodology/approach
A set of top-down scanning acoustic microscope images of BGA underfill is collected and void labelled. The labelled images are trained with a convolutional neural network model, and the performance is evaluated. The model is tested with new images, and the void area with its region is analysed with its dispensing parameter.
Findings
All findings were well-validated with reference to the past experimental results regarding dispensing parameters and their quantitative regional formation. As the BGA is non-uniform, 85% of the test samples have void(s) formed in the emptier region. Furthermore, the highest rating factor, valve dispensing pressure with a Gini index of 0.219 and U-type dispensing pattern set of parameters generally form a lower void percentage within the underfilling, although its consistency is difficult to maintain.
Practical implications
This study enabled manufacturers to forecast the void regional formation from its filling parameters and array pattern. The filling pressure, dispensing pattern and BGA relations could provide qualitative insights to understand the void formation region in a flip-chip, enabling the prompt to formulate countermeasures to optimise voiding in a specific area in the underfill.
Originality/value
The void regional formation in a flip-chip underfilling process can be explained quantitatively with indicative parameters such as valve pressure, dispensing pattern and BGA arrangement.
Details
Keywords
Farid Salari, Paolo Bosetti and Vincenzo M. Sglavo
Particles bed binding by selective cement activation (SCA) method is a computer-aided manufacturing (CAM) technique used to produce cementitious elements. A computer-aided design…
Abstract
Purpose
Particles bed binding by selective cement activation (SCA) method is a computer-aided manufacturing (CAM) technique used to produce cementitious elements. A computer-aided design file is sliced to generate G-codes before printing. This paper aims to study the effect of key input parameters for slicer software on the final properties of printed products.
Design/methodology/approach
The one factor at a time (OFAT) methodology is used to investigate the impact of selected parameters on the final properties of printed specimens, and the causes for the variations in outcomes of each variable are discussed.
Findings
Finer aggregates can generate a more compact layer, resulting in a denser product with higher strength. Fluid pressure is directly determined by voxel rate (rV); however, high pressures enable better fluid penetration control for fortified products; for extreme rVs, residual voids in the interfaces between successive layers and single-line primitives impair mechanical strength. It was understood that printhead movement along the orientation of the parts in the powder bed improved the mechanical properties.
Originality/value
The design of experiment (DOE) method assesses the influence of process parameters on various input printing variables at the same time. As the resources are limited, a fractional factorial plan is carried out on a subset of a full factorial design; hence, providing physical interpretation behind changes in each factor is difficult. OFAT aids in analyzing the effect of a change in one factor on output while all other parameters are kept constant. The results assist engineers in properly considering the influence of variable variations for future DOE designs.
Details