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The purpose of this work was to characterize NiMn₂O₄ spinel-based thermistor powder, to use it in screen printing technology to fabricate temperature sensors, to study their performance for different sintering temperatures of thermistor layer, with and without insulative cover, as well as to investigate stability of the fabricated thermistors and their applicability in water quality monitoring.

After the characterization of starting NiMn₂O₄ spinel-based thermistor powder, it was converted to thick film paste which was screen printed on alumina substrate. Thermistor layers were sintered at four different sintering temperatures: 980°C, 1050°C, 1150°C and 1290°C. An interdigitated pattern of Ag-Pd conductive layer was used to reduce the resistance. Temperature-resistance characteristics were investigated in air and water, with and without insulative cover atop the thermistor layer. Stability of the fabricated thermistors after aging at 120°C for 300 h was also examined.

Thick film NiMn₂O₄ spinel thermistors, prepared by screen printing and sintering in the temperature range 980°C–1290°C, exhibited good negative temperature coefficient (NTC) characteristics in the temperature range −30°C to 145°C, including high temperature coefficient of resistance, good stability and applicability in water.

This study explores the range of sintering temperature that can be applied for NiMn₂O₄ thermistor thick films without compromising on the temperature sensing performance in air and water, as well as stability of the thermistors after aging at elevated temperatures.

The purpose of this paper is to develop and test the thermal interface materials (TIM) for application in assembly of semiconductor chips to package. Good adhesion properties (>5 MPa shear strength) and low thermal interface resistance (better than for SAC solders) are the goal of this research.

Mechanical and thermal properties of TIM joints between gold plated contacts of chip and substrate were investigated. Sintering technique based on Ag pastes was applied for purpose of this study. Performance properties were assessed by shear force tests and thermal measurements. Scanning electron microscopy was used for microstructural observations of cross-section of formed joints.

It was concluded that the best properties are achieved for pastes containing spherical Ag particles of dozens of micrometer size with flake shaped Ag particles of few micrometers size. Sintering temperature at 230°C and application of 1 MPa force on the chip during sintering gave the higher adhesion and the lowest thermal interface resistance.

The new material based on Ag paste containing mixtures of Ag particles of different size (form nanometer to dozens of microns) and shape (spherical, flake) suspended in resin was proposed. Joints prepared using sintering technique and Ag pastes at 230°C with applied pressure shows better mechanical and thermal than other TIM materials such as thermal grease, thermal gel or thermally conductive adhesive. Those material could enable electronic device operation at temperatures above 200°C, currently unavailable for Si-based power electronics.

Porous implant surface is shown to facilitate bone in-growth and cell attachment, improving overall osteointegration, while providing adequate mechanical integrity. Recently, biodegradable material possessing such superior properties has been the focus with an aim of revolutionizing implant’s design, material and performance. This paper aims to present a comprehensive investigation into the design and development of low elastic modulus porous biodegradable Mg-3Si-5HA composite by mechanical alloying and spark plasma sintering (MA-SPS) technique.

This paper presents a comprehensive investigation into the design and development of low elastic modulus porous biodegradable Mg-3Si-5HA composite by MA-SPS technique. As the key alloying elements, HA powders with an appropriate proportion weight 5 and 10 are mixed with the base elemental magnesium (Mg) particles to form the composites of potentially variable porosity and mechanical property. The aim is to investigate the performance of the synthesized composites of Mg-3Si together with HA in terms of mechanical integrity hardness and Young’s moduli corrosion resistance and in-vitro bioactivity.

Mechanical and surface characterization results indicate that alloying of Si leads to the formation of fine Mg2 Si eutectic dense structure, hence increasing hardness while reducing the ductility of the composite. On the other hand, the allying of HA in Mg-3Si matrix leads to the formation of structural porosity (5-13 per cent), thus resulting in low Young’s moduli. It is hypothesized that biocompatible phases formed within the composite enhanced the corrosion performance and bio-mechanical integrity of the composite. The degradation rate of Mg-3Si composite was reduced from 2.05 mm/year to 1.19 mm/year by the alloying of HA elements. Moreover, the fabricated composites showed an excellent bioactivity and offered a channel/interface to MG-63 cells for attachment, proliferation and differentiation.

Overall, the findings suggest that the Mg-3Si-HA composite fabricated by MA and plasma sintering may be considered as a potential biodegradable material for orthopedic application.

This study aims to enhance merging of additive manufacturing (AM) techniques with powder injection molding (PIM). In this way, the prototypes could be 3D-printed and mass production implemented using PIM. Thus, the surface properties and mechanical performance of parts produced using powder/polymer binder feedstocks [material extrusion (MEX) and PIM] were investigated and compared with powder manufacturing based on direct metal laser sintering (DMLS).

PIM parts were manufactured from 17-4PH stainless steel PIM-quality powder and powder intended for powder bed fusion compounded with a recently developed environmentally benign binder. Rheological data obtained at the relevant temperatures were used to set up the process parameters of injection molding. The tensile and yield strengths as well as the strain at break were determined for PIM sintered parts and compared to those produced using MEX and DMLS. Surface properties were evaluated through a 3D scanner and analyzed with advanced statistical tools.

Advanced statistical analyses of the surface properties showed the proximity between the surfaces created via PIM and MEX. The tensile and yield strengths, as well as the strain at break, suggested that DMLS provides sintered samples with the highest strength and ductility; however, PIM parts made from environmentally benign feedstock may successfully compete with this manufacturing route.

This study addresses the issues connected to the merging of two environmentally efficient processing routes. The literature survey included has shown that there is so far no study comparing AM and PIM techniques systematically on the fixed part shape and dimensions using advanced statistical tools to derive the proximity of the investigated processing routes.

The purpose of this paper is to review possibilities of implementing ceramic additive manufacturing (AM) into electronic device production, which can enable great new possibilities.

A short introduction into additive techniques is included, as well as primary characterization of structuring capabilities, dielectric performance and applicability in the electronic manufacturing process.

Ceramic stereolithography (SLA) is suitable for microchannel manufacturing, even using a relatively inexpensive system. This method is suitable for implementation into the electronic manufacturing process; however, a search for better materials is desired, especially for improved dielectric parameters, lowered sintering temperature and decreased porosity.

Relatively inexpensive ceramic SLA, which is now available, could make ceramic electronics, currently restricted to specific applications, more available.

Ceramic AM is in the beginning phase of implementation in electronic technology, and only a few reports are currently available, the most significant of which is mentioned in this paper.

The purpose of this study is to verify how the carbon doping of the WC-Co cemented carbide (CC) affected their structure before their processing by hot isostatic pressing (HIP) technology.

The samples for this experiment were fabricated by selective laser melting technology (SLM) using a YAG fiber laser with a power of P = 40 W and a scanning speed of 83 mm/s. The subsequent carbon doping process was performed in a chamber furnace at 900 0 C for 1, 4 and 12 h. The HIP was performed at 1,390°C and pressures of 40 MPa, 80 MPa and 120 MPa. The changes induced in the structures were evaluated using X-ray diffraction and various microscopic methods.

X-ray diffraction analysis showed that the structure of the samples after SLM consisted of WC, W₂C, Co₄W₂C and Co phases. As a result of the increase in the carbon content in the structure of the samples, the transition carbide W₂C and structural phase Co₄W₂C decayed. Their decay was manifested by the coarsening of the minor alpha phase (WC), which occurred both during the carburizing process and during the subsequent processing using HIP. In the samples in which the structure was carburized prior to HIP, only the structural phases WC and Co were observed in most cases.

The results confirm that it is possible to increase the homogeneity of the CC structure and thus its applicability in practice by additional carburization of the sample structure with subsequent processing by HIP technology.