Search results

This paper aims to compare and evaluate the influence of package designs and characteristics on the mechanical reliability of electronic assemblies when subjected to harmonic vibrations.

Using finite element analysis (FEA), the effect of package design-related parameters, including the interconnect array configuration, i.e. full vs perimeter, and package size, on solder mechanical stresses are fully addressed.

The results of FEA simulations revealed that the number of solder rows or columns available in the array, could significantly affect solder stresses. In addition, smaller packages result in lower solder stresses and differing distributions.

In literature, there are no papers that discuss the effect of solder array layout on electronic packages vibration reliability. In addition, general rules for designing electronic assemblies subjected to harmonic vibration loadings are proposed in this paper.

There are several lead-free solder alloys available in the industry. Over the years, the most favorable solder composition of tin-silver-copper (Sn-Ag-Cu [SAC]) has been vastly used and accepted for joining the electronic components. It is strongly believed that the silver (Ag) content has a significant impact on the solder mechanical behavior and thus solder thermal reliability performance. This paper aims to assess the mechanical response, i.e. creep response, of the SAC solder alloys with various Ag contents.

A three-dimensional nonlinear finite element simulation is used to investigate the thermal cyclic behavior of several SAC solder alloys with various silver percentages, including 1%, 2%, 3% and 4%. The mechanical properties of the unleaded interconnects with various Ag amounts are collected from reliable literature resources and used in the analysis accordingly. Furthermore, the solder creep behavior is examined using the two famous creep laws, namely, Garofalo’s and Anand’s models.

The nonlinear computational analysis results showed that the silver content has a great influence on the solder behavior as well as on thermal fatigue life expectancy. Specifically, solders with relatively high Ag content are expected to have lower plastic deformations and strains and thus better fatigue performance due to their higher strengths and failure resistance characteristics. However, such solders would have contrary fatigue performance in drop and shock environments and the low-Ag content solders are presumed to perform significantly better because of their higher ductility.

Generally, this research recommends the use of SAC solder interconnects of high silver contents, e.g. 3% and 4%, for designing electronic assemblies continuously exposed to thermal loadings and solders with relatively low Ag-content, i.e. 1% and 2%, for electronic packages under impact and shock loadings.

The purpose of this paper is to investigate the thermomechanical response of four well-known lead-free die attach materials: sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds.

This examination is conducted through finite element analysis. The mechanical properties of all die attach systems, including elastic and Anand creep parameters, are obtained from relevant literature and incorporated into the numerical analysis. Consequently, the bond stress-strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results indicate that silver-tin TLP bonds are prone to exhibiting higher inelastic strain energy densities, while sintered silver and copper interconnects tend to possess higher levels of plastic strains and deformations. This suggests a higher susceptibility to damage in these metallic die attachments. On the other hand, the more expensive gold-based solders exhibit lower inelastic strain energy densities and plastic strains, implying an improved fatigue performance compared to other bonding configurations.

The utilization of different metallic material systems as die attachments in power electronics necessitates a comprehensive understanding of their thermomechanical behavior. Therefore, the results of the present paper can be useful in the die attach material selection in power electronics.

In power electronics, there are various metallic material systems used as die attachments. The complete understanding of the thermomechanical behavior of such interconnections is very important. Therefore, this paper aims to examine the thermomechanical response of four famous die attach materials, including sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds, using nonlinear finite element analysis.

During the study, the mechanical properties of all die attach systems, including elastic and viscoplasticity parameters, are obtained from literature studies and hence incorporated into the numerical analysis. Subsequently, the bond stress–strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results showed that the silver-tin TLP bonds are more likely to develop higher inelastic strain energy densities, while the sintered silver and copper interconnects would possess higher plastic strains and deformations. Suggesting higher damage to such metallic die attachments. The expensive gold-based solders have developed least inelastic strain energy densities and least plastic strains as well. Thus, they are expected to have improved fatigue performance compared to other bonding configurations.

This paper extensively investigates and compares the mechanical and thermal response of various metallic die attachments. In fact, there are no available research studies that discuss the behavior of such important die attachments of power electronics when exposed to mechanical and thermomechanical loads.

This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.

The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads.

The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints.

In literature, there is no constitutive modeling data on the AgSn TLP bonds.

The continuous increase of energy demands is a critical worldwide matter. Jordan’s household sector accounts for 44% of overall electricity usage annually. This study aims to use artificial neural networks (ANNs) to assess and forecast electricity usage and demands in Jordan’s residential sector.

Four parameters are evaluated throughout the analysis, namely, population (P), income level (IL), electricity unit price (E$) and fuel unit price (F$). Data on electricity usage and independent factors are gathered from government and literature sources from 1985 to 2020. Several networks are analyzed and optimized for the ANN in terms of root mean square error, mean absolute percentage error and coefficient of determination (R²).

The predictions of this model are validated and compared with literature-reported models. The results of this investigation showed that the electricity demand of the Jordanian household sector is mainly driven by the population and the fuel price. Finally, time series analysis approach is incorporated to forecast the electricity demands in Jordan’s residential sector for the next decade.

The paper provides useful recommendations and suggestions for the decision-makers in the country for dynamic planning for future resource policies in the household sector.

Financial technology (fintech) has emerged as a major player in the global financial system, providing a range of services such as payments, digital currencies, money transfers, loans, crowdsourcing, and insurance. Fintech startups in Arab countries have also gained traction due to economic openness and globalization. However, concerns remain about the safety, durability, and security of traditional financial services, especially with the increasing use of artificial intelligence (AI) and digitization. The Central Bank of Bahrain and other regulatory authorities need to balance risk avoidance with the global trend toward innovation in fintech, as well as ensure that these technologies are not used for fraud, money laundering, piracy, or terrorist financing. The Bahraini government and supervisory authorities must strike a balance between preserving the integrity and robustness of the financial and banking sector and developing innovation. This can be achieved by adjusting the rhythm of comparison, strengthening and enhancing the safety of banks, achieving financial stability, and ensuring compliance with laws and legislation. It is important to address gaps in regulatory rules, information security, and the business environment, and launch financial awareness at the community level before embracing the potential of fintech and its unseen future development at the level of cryptocurrencies and others. The current work examines the impact of Fintech on the Future of banking in Bahrain and the opportunities and challenges.

This paper aims to investigate the relationship between entrepreneurial motivation and pharmapreneurial intention among pharmacists in Jordan.The authors also assessed the moderating effect of gender and the COVID-19 pandemic on the relationship between these two variables.

This study is a quantitative study targeting pharmacists and using a nonprobability sample. A structured questionnaire was distributed through official channels to the entire population of registered pharmacists in Jordan. SmartPLS 3 was used for carrying an advanced structural equation model analysis, and SPSS 26 for the descriptive statistics.

The three entrepreneurial motivation variables (behavioral control [BC], risk tolerance and desirability of self-employment) affected pharmapreneurial intention, with BC contributing more to pharmapreneurial intention among pharmacists in Jordan than the other variables examined. On the other hand, gender and COVID-19 did not moderate this relationship.

The authors find that entrepreneurial motivation affects pharmapreneurial intention. Consequently, the authors provide insights to policymakers and educators regarding dovetailing the recent financial literacy programs implemented in Jordanian schools with medical education in Jordan to better motivate the formation of pharmapreneurial intention.

Policymakers and educators should be dovetailing the recent financial literacy programs implemented in Jordanian schools with medical education in Jordan to better motivate the formation of pharmapreneurial intention.

To the best of the authors’ knowledge, this is the first study to examine pharmapreneurship in Jordan.

This paper aims to systematically review the literature on digital supply chain (DSC), big data (BD) and manufacturing lead time (MLT) in industrial companies.

This study provides a systematic review of the 99 research on this subject that was published between 2015 and 2022. Studies were found in the Scopus database. This review also identifies gaps in the literature, highlights conflicting results, examines prospective data sources for empirical researchers and offers suggestions for choosing promising research subjects in the future.

This study performed a thorough literature review to a developing field of inquiry in order to identify the impact of the digital supply chain, BD and manufacturing lean time, an area that has received little attention in the literature. Future pathways and ramifications are also offered based on the literature content search. The results showed that BD improves DSC performance through resilience and innovation of the DSC. MLT and DSC integration were found to be positively correlated, according to the results.

Although the production lead time is preferable to boost customer value and supply reliability, the long lead time hurts the DSC’s ability to compete. DSC integration also improves coordination and streamlines processes. The researchers suggest fostering organizational flexibility, information exchange to accomplish DSC integration and adaptable behaviors including responsiveness and alertness.