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This paper seeks to give an overview on the benefits and challenges of moulded interconnect devices‐technology and the use of flexible printed circuits (FPC) in electronics production.

Each process step was adapted to the boundary conditions of manufacturing three‐dimensional substrates and FPC. The substrate materials were examined under the specific requirements of electronics production with a special focus on the thermal stability of the materials and the adhesiveness of the metallization.

The use of thermoplastics as substrate materials for electronic devices offers high potential but new challenges, e.g. the higher coefficient of thermal expansion of thermoplastics, have to be taken into consideration as well. In most cases, standard machines for surface mount technology can be used with few modifications. Research has shown that even components with very fine pitches can be used successfully on alternative substrate materials.

The paper covers a selection of possible thermoplastic materials that can be used in electronics production. Depending on the requirements of the application and the operating environment other substrate materials open up a large variety of possible solutions.

The paper details the most promising thermoplastic materials for use in electronics production as rigid and FPC. Furthermore, it gives information about manufacturing guidelines for the production of three‐dimensional circuit carriers.

The production of printed circuit boards (PCB) is facing considerable challenges concerning the demand for higher interconnection density and environmental friendliness. These demands cannot be satisfied by only optimising the conventional subtractive process chain, but require new production technologies to be developed. The production equipment has to guarantee that the process is carried out in a reliable way and at an acceptable speed. Therefore, the development of new process chains requires a critical review, or even a redesign of suitable manufacturing equipment. The application of simulation tools and “virtual prototyping” can support this process as the technology's impact on the machine design can be evaluated without the need for building costly prototypes. Finally, the costs of the new and current processes can be compared using the simulation results.

At the Institute for Manufacturing Automation and Production Systems (FAPS), in Erlangen, Germany, the influence of different storage conditions on cracking behaviour of high‐pin‐count components is examined. The aim is to register all relevant influence parameters in an expanded‐damage model and to quantify its effects on the later processing of the components. Effective strategies can be developed, based on this new model of damage, for storage and transportation of components.

This paper aims to detail the qualification of alternative substrate materials and reliability aspects for quad flat no lead (QFN) packages for highly stressed electronic devices, e.g. for use in automotive applications.

Detailed information is given on the advanced climatic and mechanical requirements that electronic devices have to withstand during life cycle testing to qualify for the automotive industry. Studies on the suitability of high‐temperature thermoplastics as substrate materials for printed circuit boards and the qualification of QFN packages for advanced requirements are described. In addition, information on cause‐effect relationships between thermal and vibration testing are given.

With respect to adhesion of metallization on high‐temperature thermoplastics and the long‐term stability of the solder joints, these substrate materials offer potential for use in electronic devices for advanced requirements. In addition, the long‐term stability of the solder joints of QFN packages depends on the design of the landings on the PCB and the separation process of the components during manufacturing.

The paper covers only a selection of possible high‐temperature thermoplastic materials that can be used in electronics production. Also, this paper has a focus on the new packaging type, QFN, in the context of qualification and automotive standards.

The paper details the requirements electronic devices have to meet to be qualified for the automotive industry. Therefore, this contribution has its value in giving information on possible substrate alternatives and the suitability for the usage of QFN components for highly stressed electronic devices.

Shipley Europe have appointed Alex Kostelecky as Group Sales Director for their range of specialist chemicals and processes for the printed circuit board industry.

At the Annual General Meeting of ISHM‐France, held on 12 June 1991, the following were elected:

The purpose of this paper is to explore innovations in customer experience at the intersection of the digital, physical and social realms. It explicitly considers experiences involving new technology-enabled services, such as digital twins and automated social presence (i.e. virtual assistants and service robots).

Future customer experiences are conceptualized within a three-dimensional space – low to high digital density, low to high physical complexity and low to high social presence – yielding eight octants.

The conceptual framework identifies eight “dualities,” or specific challenges connected with integrating digital, physical and social realms that challenge organizations to create superior customer experiences in both business-to-business and business-to-consumer markets. The eight dualities are opposing strategic options that organizations must reconcile when co-creating customer experiences under different conditions.

A review of theory demonstrates that little research has been conducted at the intersection of the digital, physical and social realms. Most studies focus on one realm, with occasional reference to another. This paper suggests an agenda for future research and gives examples of fruitful ways to study connections among the three realms rather than in a single realm.

This paper provides guidance for managers in designing and managing customer experiences that the authors believe will need to be addressed by the year 2050.

This paper discusses important societal issues, such as individual and societal needs for privacy, security and transparency. It sets out potential avenues for service innovation in these areas.

The conceptual framework integrates knowledge about customer experiences in digital, physical and social realms in a new way, with insights for future service research, managers and public policy makers.

This paper aims to investigate how a small business is able to continually use entrepreneurial financial sources (i.e. crowdfunding) within and after a successful transformation from an entrepreneur. It additionally investigates how a market incumbent is able to successfully join the market of entrepreneurial financial resources.

Therefore, a comparative case study using qualitative and quantitative data as well as triangulation technique is conducted within the international board game (or tabletop) market at the crowdfunding platform Kickstarter. The US company CMON, which has developed from an entrepreneur to a small business and beyond, is compared with the German incumbent Pegasus. Based on an analysis of a set of key performance indicators suggested in the literature, qualitative and quantitative variables are deductively derived to measure their impact on the financial goal achievement, thereby showing their impact on the goal achievement. During the analysis, additional variables are identified inductively.

As a result, several qualitative components are found to be crucial, including oral storytelling and computer animated videos/images, a perfect multilingual product language, prototyped components, an active community and a depth and regularity in campaign updates. In quantitative terms, important components include having more product images than longer project descriptions, more optional buys than different but fixed project rewards, a big social network (on Twitter and Facebook), and the number of updates.

Based upon the data and findings, this study invites for more research, especially in conducting a larger scale quantitative analysis using the developed framework to compare more cases within a branch, cases across branches and cases with different background stories.

But to successfully run a crowdfunding campaign, entrepreneurs and incumbents can use the provided measures as a first design- and decision-roadmap, as well as copying the new business strategy of continually practicing crowdfunding for new products.

Despite its limits, this paper offers the first in-depth qualitative and quantitative crowdfunding case study showing on the one hand a new business strategy about crowdfunding as well as providing a structured measure to compare crowdfunding project performance.