Citation
(2000), "Technical programme of the SMT/ES&S/Hybrid Conference", Soldering & Surface Mount Technology, Vol. 12 No. 2. https://doi.org/10.1108/ssmt.2000.21912bac.001
Publisher
:Emerald Group Publishing Limited
Copyright © 2000, MCB UP Limited
Technical programme of the SMT/ES&S/Hybrid Conference
Dienstag/Tuesday 27 June 2000
Tutorials
9.00 - 12.00 Uhr
Tutorial 1"Flip Chip in Produktion"Kloeser, Fhg-IZM.
Tutorial 2"Qualitäts-sicherung/Produktprüfung"Halser, Fhg-IZM.
Tutorial 3"Alternative Lotwerkstoffe"Wege, TU München, Griese, FhG-IZM.
Tutorial 4"Introduction to water level packaging"Töpper, FhG-IZM, (E).
Tutorial 5"Bestückung", (E).
Tutorial 6"Einsatz der Analytik zur Untersuchung von Metall-Polymer Verbünden"Kämpfe, FhG-IZM
Tutorial 7"Qualität durch ProzeÞfähigkeits-analysen"Sauer, TUD.
Tutorial 8"Klimasicherheit elektronischer Baugruppen"Schweigart, Dr O.K. Wack, Chemie
Invited papers
14.00 - 17.00 UhrSession chairman: Prof. W. Scheel, Prof. H. Reichl14.00-14.30 "Electronics and the environment"Dr Iwona Turlik, Motorola, USA14.30-15.00 "Solder joint reliability of CSP versus BGA assemblies"Jean Paul Clech, EPSI Inc., Monticlair, USA15.30-16.00 Coffeebreak16.00-16.30 "Mikrovia technology: applications and market trends"E. Jan Vardaman, Frank Bachner, TechSearch International Inc., Austin, Texas, USA16.30-17.00 "N.N." Claes Wennerholm, Ericsson Mobile Communications AB17.00-17.30 "N.N." Tadatomo Suga, Universität Tokyo
Mittwoch/Wednesday 28 June 2000Kongress Teil 1/Conference Part 1
Components
Chair: Dr Lubomir Cergel, Motorola SPS, Switzerland9.00 - "Das 0201: Seit Jahren bereits Reif"Uwe Leers, Panasonic Factory Automation Europe, Hamburg9.30 - "Cost effective CSP solution (micro fine carrier) for low I/O count applications"Yuichi Furumoto, Y. Kuwata, H. Togi, O. Nomoto, S. Matsuzono, S. Uegaki, Semiconductor Components, Kyocera Corporation, Japan10.00 - "BGA goes opto! Introducing optoBGA packaging technology"Joachim Quasdorf, iC-Haus GmbH, Integrated Circuits, Bodenheim, Germany; Ralf Kropf, iC-Haus GmbH, Integrated Circuits, Bodenheim, Germany10.30 - Coffeebreak
Interconnection Technologies
Chair: Prof. Werner Jillek, Georg-Simon-Ohm Fachhochschule, Nurnberg, Germany11:00 - "Optimising the soldering process by using simulation"Dr Ing. Jörg Niemeier, ATN - Automatisierungstechnik Niemeier GmbH, Berlin, Germany; Prof. Dr Ing. Günther Seliger, Technische Universität Berlin, Germany; Andreas Sonntag, Technische Universität Berlin, Germany11:30 - "Selection criteria for the selective soldering process"Jürgen Friedrich, ERSA Löttechnik GmbH, Wertheim, Germany12.00 - "Selective flux deposition for FCIP and PCOB by utilizing coaxial air jetting technology"Horatio Quinones, Fabio Okada, Nordson/Asymtek, USA
Quality Management
Chair: Prof. Wilfried Sauer, Technische Universität, Dresden, Germany9.00 - "Lean contract manufacturing/Einkaufs-kooperationen für Elektronikproduzenten"Prof. Dr Ing. Andreas Syska, Fachhoch-schule Niederrhein, Mönchengladbach, Germany9:30 - "Optimization of manufacturing and test process arrangements with new quality cost models and focus to SPC"Martin Oppermann, Technische Universität Dresden, Germany; Prof. Dr Ing. Wilfried Sauer, Technische Universität Dresden, Germany; Dr Ing. Heinz Wohlrabe, Technische Universität Dresden, Germany; Gerhard Kaiser, Heidelberger Druckmaschinen AG, Wiesloch, Germany; Manfred Schippl, Heidelberger Druckmaschinen AG, Wiesloch, Germany10:00 - "Standards for microsystems production equipment"Dr Ulrich Gengenbach, Forschungszentrum Karlsruhe GmbH, Karlsruhe, Germany10:30 - Coffeebreak
Future Trends
Chair: - Bolko Wietrzynski, Diehl Munitionssysteme GmbH & Co.KG., Röthenbach, Germany11:00 - "A combined system for SMT assembly"Michael Sheffer, Beam Works Ltd, Israel11:30 - "Future trends for the surface mount packages that surround the system on a chip"Pascal Bernard, ON Semiconductor, Toulouse, France12:00 - "Integrated profiling for the twenty-first century"Robert Baxter, KIC Thermal Profiling, Atlanta, Georgia, USA
Quality Assurance
Chair: Prof. Klaus Feldmann, Universität Erlangen-Nürnberg, Germany.9:00 - "Thermo-mechanical compatibility (TMC) of microelectronic components in high tech systems"Bernd Michel, Fraunhofer Institut IZM, Berlin, Germany9:30 - "Optical solutions for the quality assurance of semiconductor devices"Karin Achilles, JENOPTIK Laser, OPTIK, Systeme GmbH, Jena, Germany; Wolfgang Seiferth, JENOPTIK Laser, OPTIK, Systeme GmbH, Jena, Germany10:00 - "High resolution quality inspection for microelectronics and packaging by X-ray scattering and imaging techniques using synchrotron radiation"Dr Tilo Baumbach, Fraunhofer Institut für Zerstörungsfreie Prüfverfahren, Dresden, Germany; Dr Volker Hönig, Fraunhofer Institut für Zerstörungsfreie Prüfverfahren, Dresden, Germany10:30 - Coffeebreak
Quality Assurance
Chair: Prof. Jürgen Villain, Fachhochschule Augsburg, Germany.11:00 - "Qualification of solder pastes according to their behaviour during reflow soldering"Gregor Niedermayer, Technische Universität München, Garching, Germany; Dr Sonja Wege, Technische Universität München, Garching, Germany11:30 - "Creep behavior of the lead-free solder alloy Sn-3.5Ag at high homologues temperatures using laser extensometry with miniprobes"Prof. Dr Jürgen Villain, T. Qasim, Fachhochschule Augsburg, Germany; Prof. Dr O. Brüller, Technische Universität München, Garching, Germany12:00 - "Processing and reliability of advanced underfill materials for area array packages"Josef Schneider, Loctite Research, Development & Engineering, Garching-Hochbrück, Germany
Assembly
Chair: Klaus Gross, Fuji Machine Mit MFG GmbH, Mainz-Kastel, Germany.9:00 - "Im Internet durch die SMD Bestückung 'browsen' - Kennwerte in der SMD Bestückung weltweit via Internet abrufen"Dr Ing. Friedrich W. Nolting, diplan GmbH, Erlangen, Germany9:30 - "Economical assembly of small series"Adrian Schärli, ESSEMTEC AG, Aesch/LU, Switzerland10:00 - "Optimizing high mix - low volume production: innovations in SMT-assembly process using coded feeder concept"Reinhard Pollak, REPOTECH GmbH, Randolfzell a. B., Germany.10:30 - Coffeebreak
Assembly
Chair: Dr. Farhad Farassat, F&K Delvotec, Ottobrunn, Germany.11:00 - "SMD technology trends and its implications for SMD placement equipment"Sjef van Gastel, Philips EMT b.v., Eindhoven, The Netherlands.11:30 - "Assembly of semicondutor based microsystems with sensor guided tools"Dirk Jacob, Michael Höhn, iwb TU München, Garching, Germany.12:00 - "High precision assembly technology for array packaging of micro devices"J. Staud, W. GroÞ, M. Scholl, A. Menschig, Deutsches Zentrum für Luft- und Raumfahrt e.V., Stuttgart, Germany.
Kongress Teil 2/Conference Part 2
Interconnection Technologies
Chair: Dr Viktor Tiederle, Mannesmann VDO AG, Karben.14.00 - "Curing of industrial adhesives using UV irradiation - an introduction into chemistry and UV lamp technology"Dr Dietmar Dengler, DELO Industrieklebstoffe GmbH & Co.KG, Landsberg; Petra Burger, Fusion UV Systems GmbH, Martinsried14.30 - N.N.David A. van de Wall, WE-Europe, Helmond, Niederlande.15.00 - "A new tool for bonding with anisotropic conductive adhesives, and pulsed thermode soldering"Reinhard G.O. Hampel, SARL Display Control, Villers le Lac, Frankreich.15.30 - Coffeebreak
Interconnection Technologies
Chair: Dr Karl Deckelmann, W.C. Heraeus GmbH, Hanau.16.00 - "The influence of stencil design on reflow result 'Modern stencils for the surface mount technology"'Dr Schurig, Firma Osram, München.16.30 - "Optimised surface mount printing using stencil technology"Tony Weldon, Tecan Components Ltd., Weymouth, Dorset, GroÞbritannien.17.00 - "Heat transfer in forced convection reflow soldering systems: lead-free solder paste, a new challenge"Dr Klaus Brodt, SMT GmbH & Co. KG, Wertheim.
Future Trends
Chair: Uwe Leers, Panasonic Factory Automation Europe, Hamburg.14.00 - "Hotmelt encapsulation: new possibilities for packaging of sensititve components"T. Braun, M. Schneider-Ramelow, F. Ansorge, R. Aschenbrenner, H. Reichl, Fraunhofer Institut für Zuverlässigkeit u. Mikrointegration, Berlin; K.-F. Becker, Technische Universität Berlin; T. Kaselow, OptiMel Schmelzgußtechnik GmbH & Co.KG, Iserlohn14.30 - "3D packaging applications in Europe"Christian Val, 3 D PLUS, Buc Cedex, Frankreich15:00 - "3D hybrid - high density integration technique on flexible substrates"Hansjoerg Beutel, Oliver Scholz, Thomas Stieglitz, J.-Uwe Meyer, Fraunhofer Institut für Biomedizinische Technik, St Ingbert15:30 - Coffeebreak
Future Trends
Chair: Manfred Hof, Polytec GmbH, Waldbronn.16:00 - "Innovative technology and production of contactless - and dual interface - smart-cards"Friedrich Jambor, Consultant for Smart Card Technology, Steinach.16:30 - "Use of room temperature storable epoxy reflow encapsulant in the fabrication of optical sensors"Dr Hiep Diep-Quang, Litton Kester Solder, Gernlinden.17.00 - "Wafer level integration of micro-optic elements and photodiodes by assembly and structuring of a glass-silicon wafer-stack"Wolfgang Buß Fraunhofer Institut für Angewandte Optik u. Feinmechanik, Jena, Germany; Matthias Mohaupt, Fraunhofer Institut für Angewandte Optik u. Feinmechanik, Jena, Germany; Gregor Woldt, Microelectronic Packaging Dresden GmbH, Dresden, Germany.
Lead-free Solders
Chair: Hansjörg Griese, FhG-IZM, BerlinDr Sonja Wege, Technische Universität München.14.00 - "Towards lead free electronic assemblies"Jutta Müller, Hansjörg Griese, G. Somi, K.-H. Zuber, Fraunhofer Institut für Zuverlässigkeit und Mikrointegration, Berlin.14.30 - "Lead-free soldering - where the world is going/prospect of lead free alternatives for reflow soldering"Dr Ning-Cheng Lee, Indium Corporation of America, Clinton, USA.15:00 - "Joining technologies with leadfree connecting materials"M. Detert, Th. Herzog, K.-J. Wolter, Th. Zerna, Technische Universität Dresden.15:30 - Coffeebreak
Lead-free Solders
Chair: Angela Chrusd, Heraeus Inc., Cermalloy Division, West Conshohocken, USA.16:00 - "Lead-free solders under the laser beam"Prof. Dr Ing. Lutz Dorn, Dr Ing. Fritz Herbert, Dipl.-Ing Shiva Shrestha, TU Berlin, Institutsbereich Fügetechnik und Beschichtungstechnik.16:30 - "Effects of lead-free solder compounds on X-ray laminographic imaging"Dr R. Shane Fazzio, Agilent Technologies AG, Urdorf, Schweiz.17.00 - "Behaviour of lead-free solder joints under thermal and mechanical stresses"Th. Lauer, S. Wege, Technische Universität München, Garching.
Substrates
Chair: Dr Karl-Heinz Segsa, Spree Hybrid & Kommunikationstechnologie, Berlin.14.00 - "Material developments for high-density-interconnect-structure PWBs"Michael Weinhold, DuPont de Nemours International S.A., Genf, Switzerland.14.30 - "Photovias on silicon substrates form high density interconnect for flip-chip assembly without redistribution and underfill"Hans-Wolfgang Diesing, STRAND Interconnect, Schöngeising.15:00 - "System integration by flexible substrates"Horst Kober, Freudenberg Forschungsdienste KG, Weinheim.15:30 - Coffeebreak
Substrates
Chair: Michael Feil, FhG-IZM, München.16:00 - "Investigation on fine line patterning of advanced thick film paste"Gerhard Klink, Horst Richter, Michael Feil, Fraunhofer Institut für Zuverlässigkeit und Mikrointegration, München.16:30 - "Advances in interconnection technology using selective electroplating"Peter Moran, Advanced Interconnection Technology Ltd, Manchester, England.17.00 - "Water soluble metallization pastes for AIN - a new ecological approach"Dr Bernhard Mussler, ANCeram GmbH & Co.KG, Bindlach; Dr P. Otschik, Dr C. Kretzschmar, Dr W. Schaffrath, Fraunhofer Institut für Keramische Technologien und Sinterwerstoffe, Dresden.17.30 - "Impulsbelastbarkeit von SMD-Widerständen"Dietrich Gerth, QUINEL, Zug, Schweiz.
Dienstag/Thursday 29 June 2000
Tutorials
9.00 - 12.00 Uhr
Tutorial 9"Mechantronik"Ansorge, FhG-IZM.
Tutorial 10"Flexible circuits as interconncetion interposers"Fjelstad, Pacific Consultants, USA (E).
Tutorial 11"Non-conductive polymers adhesives, encapsulants and underfills"Gilleo, Cookson Electronics (E).
Tutorial 12"Design of PCBs for high frequency generation"Stahl, IBM (E).
Tutorial 13"Neue AVT - opto-elektrische Leiterplatte"Scheel, Krabe, FhG-IZM.
Tutorial 14"Lead free"Willis, EPS (E).
Tutorial 15"New materials"Wong, Georgia Tech (E).
Tutorial 16"Reliability of flip chip and chip size package solder joints"Clech, EPSI (E).
14.00-17.00 Uhr
Tutorial 17"SMT Kleben und Löten"Miric, Hereaus.
Tutorial 18"Wire Bonding für zukünftige Anwendungen"Lang, FhG-IZM.
Tutorial 19"Hochtemperatur-Silizium-System-Lösungen im Automobebau"Triantafyllou, Motorola.
Tutorial 20"Entwicklung und Fertigung hochzuverlässiger Baugruppen unter Praxisgesichts-punkten"Reichelt, Kämpfert, Bruderreck TechnoLab.
Tutorial 21"Advanced PWB manufacturing HDI and microvias"Fjelstad, Pacific Consultants, USA (E).
Tutorial 22"Introduction to simultaneous double sided reflow soldering"Willis, EPS (E).
Tutorial 23"New materials"Wong, Georgia Tech (E).
Tutorial 24"Flex circuits"Gilleo, Cookson Electronic (E).