Search results

This study investigates the impact of three parameters such as: number of LED chips, pitch and LED power on the junction temperature of LEDs using a best heat sink configuration selected according to a lower temperature. This study provides valuable insights into how to design LED arrays with lower junction temperatures.

To determine the best configuration of a heat sink, a numerical study was conducted in Comsol Multiphysics on 10 different configurations. The configuration with the lowest junction temperature was selected for further analysis. The number of LED chips, pitch and LED power were then varied to determine the optimal configuration for this heat sink. A general equation for the average LED temperature as a function of these three factors was derived using Minitab software.

Among 10 configurations of the rectangular heat sink, we deduce that the best configuration corresponds to the first design having 1 mm of width, 0.5 mm of height and 45 mm of length. The average temperature for this design is 50.5 C. For the power of LED equal to 50 W–200 W, the average temperature of this LED drops when the number of LED chips reduces and the pitch size decreases. Indeed, the best array-LED corresponds to 64 LED chips and a pitch size of 0.5 mm. In addition, a generalization equation for average temperature is determined as a function of the number of LED chips, pitch and power of LED which are key factors for reducing the Junction temperature.

The study is original in its focus on three factors that have not been studied together in previous research. A numerical simulation method is used to investigate the impact of the three factors, which is more accurate and reliable than experimental methods. The study considers a wide range of values for the three factors, which allows for a more comprehensive understanding of their impact. It derives a general equation for the average temperature of the LED, which can be used to design LED arrays with desired junction temperatures.

Light emitting diode (LED) has been the best resource for commercial and industrial lighting applications. However, thermal management in high power LEDs is a major challenge in which the thermal resistance (R_th) and rise in junction temperature (T_J) are critical parameters. The purpose of this work is to evaluate the R_th and T_j of the LED attached with the modified heat transfer area of the heatsink to improve thermal management.

This paper deals with the design of metal substrate for heatsink applications where the surface area of the heatsink is modified. Numerical simulation on heat distribution proved the influence of the design aspects and surface area of heatsink.

T_J was low for outward step design when compared to flat heatsink design (ΔT ∼ 38°C) because of increase in surface area from 1,550 mm² (flat) to 3,076 mm² (outward step). On comparison with inward step geometry, the T_J value was low for outward step configuration (ΔT_J ∼ 6.6°C), which is because of efficient heat transfer mechanism with outward step design. The observed results showed that outward step design performs well for LED testing by reducing both R_th and T_J for different driving currents.

This work is authors’ own design and also has the originality for the targeted application. To the best of the authors’ knowledge, the proposed design has not been tried before in the electronic or LED applications.

Polymer-based thermal interface materials (TIMs) are having pump out problem and could be resolved for reliable application. Solid-based interface materials have been suggested and reported. The purpose of this paper is suggesting thin film-based TIM to sustain the light-emiting diode (LED) performance and electronic device miniaturization.

Consequently, ZnO thin film at various thicknesses was prepared by chemical vapour deposition (CVD) method and tested their thermal behaviour using thermal transient analysis as solid TIM for high-power LED.

Low value in total thermal resistance (R_th-tot) was observed for ZnO thin film boundary condition than bare Al boundary condition. The measured interface (ZnO thin film) resistance {(R_th-bhs) thermal resistance of the interface layer (thin film) placed between metal core printed circuit board (MCPCB) board and Al substrates} was nearly equal to Ag paste boundary condition and showed low values for ZnO film prepared at 30 min process time measured at 700 mA. The T_J value of LED mounted on ZnO thin film (prepared at 30 min.) coated Al substrates was measured to be 74.8°C. High value in junction temperature difference (ΔT_J) of about 4.7°C was noticed with 30 min processed ZnO thin film when compared with Al boundary condition. Low correlated colour temperature and high luminous flux values of tested LED were also observed with ZnO thin film boundary condition (processed at 30 min) compared with both Al substrate and Ag paste boundary condition.

Overall, 30 min CVD processed ZnO thin film would be an alternative for commercial TIM to achieve efficient thermal management. This will increase the life span of the LED as the proposed material decreases the T_J values.

Quantitative reliability analysis can effectively identify the time the driving system needs to be maintained. Then, the potential safety problems can be found, and some catastrophic failures can be effectively prevented. Therefore, this paper aims to evaluate the reliability of the switched reluctance generator (SRG) driving system.

In this paper, a method considering different thermal stresses and fault tolerance capacity is proposed to analyze the reliability of an SRG. A full-bridge power converter (FBPC) instead of the asymmetric half-bridge power converter (AHBPC) is adopted to drive the SRG system. First, the primary fault modes of the SRG system are introduced, and a fault criterion is proposed to determine whether the system fails. Second, the thermal circuit model of the converter is established to quickly and accurately obtain the junction temperature of the devices. At last, the Markov models of different levels are established to evaluate the reliability of the system.

The results show that the two-level Markov model is the most suitable when compared to the static model and the one-level Markov model.

The driving system of SRG will be more reliable after the reliability of the system is evaluated by the Markov model. At the same time, an FBPC is adopted to drive the SRG. The FBPCs have the advantages of fewer switching devices, higher integration and lower cost. The proposed driving strategy of the FBPC avoids the current reversal and the generation of dead zone time, which has the advantage of reliable operation. In addition, a precise thermal circuit model of the FBPC is proposed, and the junction temperature of each device can be obtained, respectively.

The performance of oil-filled pressure cores is very much affected by the corrugated diaphragm and the oil filling volume. The purpose of this paper is to show the effects of different corrugated diaphragms, different oil filling volumes and different treatments of the corrugated diaphragms on the performance of pressure sensors.

Pressure-sensitive cores with different diaphragm diameters, different diaphragm ripple numbers and different oil filling volumes are produced, and thermal cycling is introduced to improve the diaphragm performance, and finally the performance of each pressure-sensitive core is tested and the test data are analyzed and compared.

The experimental results show that the larger the diameter of the corrugated diaphragm used for encapsulation, the better the performance. For pressure-sensitive cores using smaller diameter corrugated diaphragms, the performance of one corrugation is better than that of two corrugations. When the number of corrugations and the diameter are the same size, the performance of the outer ring of the diaphragm with concave corrugations is better than that with convex corrugations. At the same time, the diaphragm after thermal cycling treatment and appropriate reduction of encapsulated oil filling can improve the performance of the pressure-sensitive core.

By exploring the effects of corrugated diaphragm and oil filling volume on the performance of oil-filled pressure cores, the design of oil-filled pressure sensors can be guided to improve sensor performance.

This study aims to undertake a comprehensive examination of heat transfer by convection in porous systems with top and bottom walls insulated and differently heated vertical walls under a magnetic field. For a specific nanofluid, the study aims to bring out the effects of different segmental heating arrangements.

An existing in-house code based on the finite volume method has provided the numerical solution of the coupled nondimensional transport equations. Following a validation study, different explorations include the variations of Darcy–Rayleigh number (Ra_m = 10–10⁴), Darcy number (Da = 10^–5–10^–1) segmented arrangements of heaters of identical total length, porosity index (ε = 0.1–1) and aspect ratio of the cavity (AR = 0.25–2) under Hartmann number (Ha = 10–70) and volume fraction of φ = 0.1% for the nanoparticles. In the analysis, there are major roles of the streamlines, isotherms and heatlines on the vertical mid-plane of the cavity and the profiles of the flow velocity and temperature on the central line of the section.

The finding of a monotonic rise in the heat transfer rate with an increase in Ra_m from 10 to 10⁴ has prompted a further comparison of the rate at Ra_m equal to 10⁴ with the total length of the heaters kept constant in all the cases. With respect to uniform heating of one entire wall, the study reveals a significant advantage of 246% rate enhancement from two equal heater segments placed centrally on opposite walls. This rate has emerged higher by 82% and 249%, respectively, with both the segments placed at the top and one at the bottom and one at the top. An increase in the number of centrally arranged heaters on each wall from one to five has yielded 286% rate enhancement. Changes in the ratio of the cavity height-to-length from 1.0 to 0.2 and 2 cause the rate to decrease by 50% and increase by 21%, respectively.

Further research with additional parameters, geometries and configurations will consolidate the understanding. Experimental validation can complement the numerical simulations presented in this study.

This research contributes to the field by integrating segmented heating, magnetic fields and hybrid nanofluid in a porous flow domain, addressing existing research gaps. The findings provide valuable insights for enhancing thermal performance, and controlling heat transfer locally, and have implications for medical treatments, thermal management systems and related fields. The research opens up new possibilities for precise thermal management and offers directions for future investigations.

The conventional design method relies on a priori knowledge, which limits the rapid and efficient development of electronic packaging structures. The purpose of this study is to propose a hybrid method of data-driven inverse design, which couples adaptive surrogate model technology with optimization algorithm to to enable an efficient and accurate inverse design of electronic packaging structures.

The multisurrogate accumulative local error-based ensemble forward prediction model is proposed to predict the performance properties of the packaging structure. As the forward prediction model is adaptive, it can identify respond to sensitive regions of design space and sample more design points in those regions, getting the trade-off between accuracy and computation resources. In addition, the forward prediction model uses the average ensemble method to mitigate the accuracy degradation caused by poor individual surrogate performance. The Particle Swarm Optimization algorithm is then coupled with the forward prediction model for the inverse design of the electronic packaging structure.

Benchmark testing demonstrated the superior approximate performance of the proposed ensemble model. Two engineering cases have shown that using the proposed method for inverse design has significant computational savings while ensuring design accuracy. In addition, the proposed method is capable of outputting multiple structure parameters according to the expected performance and can design the packaging structure based on its extreme performance.

Because of its data-driven nature, the inverse design method proposed also has potential applications in other scientific fields related to optimization and inverse design.

Multilevel inverters play a major role in the development of high-power industrial applications. In traditional low-level inverters (e.g. 2-level), the switching frequency is restricted and the harmonic spectrum of the system is hard to meet power requirements. Similarly, high-level inverters consist of a large number of switches, complex modulation techniques and complex hardware architecture, which results in high power loss and a significant amount of harmonic distortion. Furthermore, it is a must to ensure that every switch experiences the same stress of voltage and current. The purpose of this paper is to present an inverter topology with lower conduction and switching losses via reduced number of switches and equal voltage source-sharing technique.

Herein, the authors present a cascaded multilevel inverter having less power switches, a simple modulation technique and an equal voltage source-sharing phenomenon implementation.

The modulation technique becomes more complex when equal voltage source-sharing is to be implemented. In this study, a novel topology for the multilevel inverter with fewer switches, novel modulation technique, equal voltage source-sharing and Inductor-Capacitor-Inductor filter implementation is demonstrated to the reduce harmonic spectrum and power losses of the proposed system.

The nine-level inverter design is validated using software simulations and hardware prototype testing; the power losses of the proposed inverter design are elaborated and compared with the traditional approach.

This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.

Compared to industrial optical modules, optical modules for aerospace applications require better reliability and stability, which is hard to achieve via the dispensing adhesive process that is used for traditional industrial optical modules. In this paper, 25 µm SAC305 solder foils and the AlNi nanofoil heat source were used to bond the back of the PIC chip with the heat sink. The temperature field and temperature history were analyzed by the finite element analysis (FEA) method. The junction-to-case thermal resistance is 0.0353°C/W and reduced by 85% compared with the UV hybrid epoxy joint.

The self-propagating reaction ends within 2.82 ms. The maximum temperature in the PIC operating area during the process is 368.5°C. The maximum heating and cooling rates of the solder were 1.39 × 107°C/s and −5.15 × 106°C/s, respectively. The microstructure of SAC305 under self-propagating reaction heating is more refined than the microstructure of SAC305 under reflow. The porosity of the heat sink-SAC305-PIC chip self-propagating joint is only 4.7%. Several metastable phases appear as AuSn3.4 and AgSn3.

A new bonding technology was used to form the bonding between the PIC chip with the heat sink for the aerospace optical module. The reliability and thermal resistance of the joint are better than that of the UV hybrid epoxy joint.

This study aims to elucidate the role of curved walls in the presence of identical mass of porous bed with identical heating at a wall for two heating objectives: enhancement of heat transfer to fluid saturated porous beds and reduction of entropy production for thermal and flow irreversibilities.

Two heating configurations have been proposed: Case 1: isothermal heating at bottom straight wall with cold side curved walls and Case 2: isothermal heating at left straight wall with cold horizontal curved walls. Galerkin finite element method is used to obtain the streamfunctions and heatfunctions associated with local entropy generation terms.

The flow and thermal maps show significant variation from Case 1 to Case 2 arrangements. Case 1 configuration may be the optimal strategy as it offers larger heat transfer rates at larger values of Darcy number, Da_m. However, Case 2 may be the optimal strategy as it provides moderate heat transfer rates involving savings on entropy production at larger values of Da_m. On the other hand, at lower values of Da_m (Da_m ≤ 10⁻³), Case 1 or 2 exhibits almost similar heat transfer rates, while Case 1 is preferred for savings of entropy production.

The concave wall is found to be effective to enhance heat transfer rates to promote convection, while convex wall exhibits reduction of entropy production rate. Comparison between Case 1 and Case 2 heating strategies enlightens efficient heating strategies involving concave or convex walls for various values of Da_m.