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Article
Publication date: 1 April 2004

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42

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Microelectronics International, vol. 21 no. 1
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 6 August 2019

Anton Wiberg, Johan Persson and Johan Ölvander

This paper aims to review recent research in design for additive manufacturing (DfAM), including additive manufacturing (AM) terminology, trends, methods, classification…

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8234

Abstract

Purpose

This paper aims to review recent research in design for additive manufacturing (DfAM), including additive manufacturing (AM) terminology, trends, methods, classification of DfAM methods and software. The focus is on the design engineer’s role in the DfAM process and includes which design methods and tools exist to aid the design process. This includes methods, guidelines and software to achieve design optimization and in further steps to increase the level of design automation for metal AM techniques. The research has a special interest in structural optimization and the coupling between topology optimization and AM.

Design/methodology/approach

The method used in the review consists of six rounds in which literature was sequentially collected, sorted and removed. Full presentation of the method used could be found in the paper.

Findings

Existing DfAM research has been divided into three main groups – component, part and process design – and based on the review of existing DfAM methods, a proposal for a DfAM process has been compiled. Design support suitable for use by design engineers is linked to each step in the compiled DfAM process. Finally, the review suggests a possible new DfAM process that allows a higher degree of design automation than today’s process. Furthermore, research areas that need to be further developed to achieve this framework are pointed out.

Originality/value

The review maps existing research in design for additive manufacturing and compiles a proposed design method. For each step in the proposed method, existing methods and software are coupled. This type of overall methodology with connecting methods and software did not exist before. The work also contributes with a discussion regarding future design process and automation.

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Rapid Prototyping Journal, vol. 25 no. 6
Type: Research Article
ISSN: 1355-2546

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Article
Publication date: 9 May 2019

Qiaoran Zhang, Abdelhafid Zehri, Jiawen Liu, Wei Ke, Shirong Huang, Martí Gutierrez Latorre, Nan Wang, Xiuzhen Lu, Cheng Zhou, Weijuan Xia, Yanpei Wu, Lilei Ye and Johan Liu

This study aims to develop a bimodal nano-silver paste with improved mechanical property and reliability. Silicon carbide (SiC) particles coated with Ag were introduced in…

Abstract

Purpose

This study aims to develop a bimodal nano-silver paste with improved mechanical property and reliability. Silicon carbide (SiC) particles coated with Ag were introduced in nano-silver paste to improve bonding strength between SiC and Ag particles and enhance high-temperature stability of bimodal nano-silver paste. The effect of sintering parameters such as sintering temperature, sintering time and the proportion of SiC particles on mechanical property and reliability of sintered bimodal nano-silver structure were investigated.

Design/methodology/approach

Sandwich structures consist of dummy chips and copper substrates with nickel and silver coating bonded by nano-silver paste were designed for shear testing. Shear strength testing was conducted to study the influence of SiC particles proportions on the mechanical property of sintered nano-silver joints. The reliability of the bimodal nano-silver paste was evaluated experimentally by means of shear test for samples subjected to thermal aging test at 150°C and humidity and temperature testing at 85°C and 85 per cent RH, respectively.

Findings

Shear strength was enhanced obviously with the increase of sintering temperature and sintering time. The maximum shear strength was achieved for nano-silver paste sintered at 260°C for 10 min. There was a negative correlation between the proportion of SiC particles and shear strength. After thermal aging testing and humidity and temperature testing for 240 h, the shear strength decreased a little. High-temperature stability and high-hydrothermal stability were improved by the addition of SiC particles.

Originality/value

Submicron-scale SiC particles coated with Ag were used as alternative materials to replace part of nano-silver particles to prepare bimodal nano-silver paste due to its high thermal conductivity and excellent mechanical property.

Details

Soldering & Surface Mount Technology, vol. 31 no. 4
Type: Research Article
ISSN: 0954-0911

Keywords

Content available
Article
Publication date: 6 April 2021

Johan Holtström and Helén Anderson

This study aims to contribute with an extended framework on synergy realisation in acquisitions. The study conceptualises synergy realisation after acquisitions, in…

Abstract

Purpose

This study aims to contribute with an extended framework on synergy realisation in acquisitions. The study conceptualises synergy realisation after acquisitions, in interaction with other companies in a business network and that synergy can be the result of both intended and not intended actions.

Design/methodology/approach

The study is based on a company involved in acquisitions, being both the acquirer and the acquired. The data for analysis were collected through semi-structured interviews with managers involved in the described acquisition processes. The semi-structured interviews were guided by overarching themes to cover relevant areas of the described acquisitions.

Findings

This study develops a framework in which synergy is used as a concept in business networks. The framework offers a more dynamic perspective on acquisition processes and extends the view of acquisition performance beyond more financial and company internal aspects of acquisition processes. Further, the findings show that related companies such as customers and suppliers, play important roles in synergy realisation.

Practical implications

From a managerial perspective, the study shows the importance of understanding the underlying forces of integration processes.

Originality/value

The concept of synergy used in this study not only includes the companies integrated in an acquisition but also their business networks. Including the integrated companies and their business networks provides a more dynamic perspective from which to plan and realise synergy.

Details

Journal of Business & Industrial Marketing, vol. 36 no. 13
Type: Research Article
ISSN: 0885-8624

Keywords

Content available
Article
Publication date: 20 September 2021

Daniel Ellström, Johan Holtstrom, Emma Berg and Cecilia Johansson

The purpose of this paper is to identify sensing, seizing and reconfiguring routines of dynamic capabilities that enable digital transformation in firms.

Abstract

Purpose

The purpose of this paper is to identify sensing, seizing and reconfiguring routines of dynamic capabilities that enable digital transformation in firms.

Design/methodology/approach

A qualitative approach is used. Representatives from a firm going through digital transformations are interviewed, and focus groups have been carried out with a consultancy firm experienced in giving advice to firms going through digital transformation.

Findings

Six routines identified as relevant specifically for digital transformation are identified. These are cross-industrial digital sensing, inside-out digital infrastructure sensing, digital strategy development, determination of enterprise boundaries, decomposition of digital transformation into specified projects and creation of a unified digital infrastructure.

Practical implications

The authors provide direction for managers on how to approach digital transformation. In relation to previous research, the authors provide more specific guidance regarding how to reconfigure the organization in digital transformation.

Originality/value

The paper uses a novel context for digital transformation and complements the very few studies available using dynamic capabilities to understand digital transformation.

Details

Journal of Strategy and Management, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1755-425X

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Content available
Article
Publication date: 10 April 2009

Johan Liu, Daoqiang Lu and Cristina Andersson

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312

Abstract

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Soldering & Surface Mount Technology, vol. 21 no. 2
Type: Research Article
ISSN: 0954-0911

Content available
Article
Publication date: 1 April 2006

Chris Bailey and Johan Liu

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193

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Soldering & Surface Mount Technology, vol. 18 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 April 2006

Peng Sun, Cristina Andersson, Xicheng Wei, Zhaonian Cheng, Dongkai Shangguan and Johan Liu

To determine the Coffin‐Manson (CM) equation constants for fatigue life estimation of Sn‐8Zn‐3Bi solder joints, since Sn‐8Zn‐3Bi solder has a melting temperature of around…

Abstract

Purpose

To determine the Coffin‐Manson (CM) equation constants for fatigue life estimation of Sn‐8Zn‐3Bi solder joints, since Sn‐8Zn‐3Bi solder has a melting temperature of around 199°C which is close to that of the conventional Sn‐Pb solder which has previously been used in the electronics assembly industry.

Design/methodology/approach

Three dimensional finite element (FE) simulation analysis was used for comparison with the experimentally measured data and to determine the CM constants. Low cycle fatigue tests and FE simulations were carried out for these lead‐free solder joints, and eutectic Sn‐37Pb solder was used as a reference.

Findings

The CM equation for Sn‐8Zn‐3Bi solder joints was fitted to the lifetimes measured and the shear strains simulated. The constants were determined to be 0.0294 for C, the proportional constant, and for the fatigue exponent, β, −2.833.

Originality/value

The CM equation can now be used to predict the reliability of Sn‐8Zn‐3Bi solder joints in electronics assembly and the knowledge base for the properties of the Sn‐Zn solder system has been increased.

Details

Soldering & Surface Mount Technology, vol. 18 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 December 2001

Johan Liu

Anisotropically Conductive Adhesives (ACAs) have been used in electronics packaging for over a decade on glass substrates, and more recently in contactless smart‐card…

Abstract

Anisotropically Conductive Adhesives (ACAs) have been used in electronics packaging for over a decade on glass substrates, and more recently in contactless smart‐card module assembly and for bare chip attach on flexible and rigid substrates. Summarises various technologies used in connection with ACA joining. A summary of our understanding of the electrical, thermal, physical, chemical, environmental and cost behaviours of ACAs in conjunction with various packaging applications is elaborated. Finally, future research areas and remaining issues are pointed out.

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Soldering & Surface Mount Technology, vol. 13 no. 3
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 10 April 2009

C.D. Zou, Y.L. Gao, B. Yang, Q.J. Zhai, C. Andersson and J. Liu

The purpose of this paper is to study the melting temperature of the nanoparticles of the new developed Sn‐0.4Co‐0.7Cu (wt%) lead‐free solder alloy.

Abstract

Purpose

The purpose of this paper is to study the melting temperature of the nanoparticles of the new developed Sn‐0.4Co‐0.7Cu (wt%) lead‐free solder alloy.

Design/methodology/approach

Nanoparticles of Sn‐0.4Co‐0.7Cu lead‐free solder alloy were prepared by the self‐developed consumable‐electrode direct current arc technique, where ultrasonic vibration was applied during the manufacturing of the particles. X‐ray diffraction and field emission scanning electron microscope were employed to analyze the crystal structure and morphology of the nanopartiles, respectively. Differential scanning calorimetry was used to investigate the melting temperature of both the bulk alloy and as‐prepared nanoparticles.

Findings

The melting temperature of the nanoparticles was approximately 5°C lower compared to that of the bulk alloy.

Originality/value

As a novel developed lead‐free solder alloy, the Sn‐0.4Co‐0.7Cu (wt%) alloy provides a cost advantage compared to the extensively used Sn‐Ag‐Cu system. Some limitations still exist, however, mainly due to its relatively higher melting temperature compared to that of eutectic Sn‐37Pb solder. In view of this situation, the attempt to lower its melting temperature has recently attracted more attention based on the knowledge that the melting temperature for pure metals is reduced when the particle size is decreased down to a few tens of nanometers.

Details

Soldering & Surface Mount Technology, vol. 21 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

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