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Coffin‐Manson constant determination for a Sn‐8Zn‐3Bi lead‐free solder joint

Peng Sun (Key State Lab for New Displays and System Integration (Chinese Ministry of Education), SMIT Center, Shanghai University, Shanghai, People's Republic of China, Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, Göteborg, Sweden)
Cristina Andersson (Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, Göteborg, Sweden)
Xicheng Wei (Key State Lab for New Displays and System Integration (Chinese Ministry of Education), SMIT Center, Shanghai University, Shanghai, People's Republic of China)
Zhaonian Cheng (Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, Göteborg, Sweden)
Dongkai Shangguan (Flextronics International, San Jose, California, USA)
Johan Liu (Key State Lab for New Displays and System Integration (Chinese Ministry of Education), SMIT Center, Shanghai University, Shanghai, People's Republic of China Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, Göteborg, Sweden)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 April 2006

784

Abstract

Purpose

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To determine the Coffin‐Manson (CM) equation constants for fatigue life estimation of Sn‐8Zn‐3Bi solder joints, since Sn‐8Zn‐3Bi solder has a melting temperature of around 199°C which is close to that of the conventional Sn‐Pb solder which has previously been used in the electronics assembly industry.

Design/methodology/approach

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Three dimensional finite element (FE) simulation analysis was used for comparison with the experimentally measured data and to determine the CM constants. Low cycle fatigue tests and FE simulations were carried out for these lead‐free solder joints, and eutectic Sn‐37Pb solder was used as a reference.

Findings

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The CM equation for Sn‐8Zn‐3Bi solder joints was fitted to the lifetimes measured and the shear strains simulated. The constants were determined to be 0.0294 for C, the proportional constant, and for the fatigue exponent, β, −2.833.

Originality/value

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The CM equation can now be used to predict the reliability of Sn‐8Zn‐3Bi solder joints in electronics assembly and the knowledge base for the properties of the Sn‐Zn solder system has been increased.

Keywords

Citation

Sun, P., Andersson, C., Wei, X., Cheng, Z., Shangguan, D. and Liu, J. (2006), "Coffin‐Manson constant determination for a Sn‐8Zn‐3Bi lead‐free solder joint", Soldering & Surface Mount Technology, Vol. 18 No. 2, pp. 4-11. https://doi.org/10.1108/09540910610665071

Publisher

:

Emerald Group Publishing Limited

Copyright © 2006, Emerald Group Publishing Limited

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