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This study aims to develop a bimodal nano-silver paste with improved mechanical property and reliability. Silicon carbide (SiC) particles coated with Ag were introduced in nano-silver paste to improve bonding strength between SiC and Ag particles and enhance high-temperature stability of bimodal nano-silver paste. The effect of sintering parameters such as sintering temperature, sintering time and the proportion of SiC particles on mechanical property and reliability of sintered bimodal nano-silver structure were investigated.

Sandwich structures consist of dummy chips and copper substrates with nickel and silver coating bonded by nano-silver paste were designed for shear testing. Shear strength testing was conducted to study the influence of SiC particles proportions on the mechanical property of sintered nano-silver joints. The reliability of the bimodal nano-silver paste was evaluated experimentally by means of shear test for samples subjected to thermal aging test at 150°C and humidity and temperature testing at 85°C and 85 per cent RH, respectively.

Shear strength was enhanced obviously with the increase of sintering temperature and sintering time. The maximum shear strength was achieved for nano-silver paste sintered at 260°C for 10 min. There was a negative correlation between the proportion of SiC particles and shear strength. After thermal aging testing and humidity and temperature testing for 240 h, the shear strength decreased a little. High-temperature stability and high-hydrothermal stability were improved by the addition of SiC particles.

Submicron-scale SiC particles coated with Ag were used as alternative materials to replace part of nano-silver particles to prepare bimodal nano-silver paste due to its high thermal conductivity and excellent mechanical property.

Traditional chip‐level interconnection materials show many weaknesses given the development trend of microelectronic packaging technology. In order to meet the needs of high‐temperature packaging for wide‐bandgap semiconductors, low‐temperature sintered nano‐silver as a novel semiconductor device‐metallized substrate interconnection material is being developed. One phenomenon that larger interconnection area would cause poor interconnection quality had been found in the industry butut the mechanisms were never previously studied. This paper aims to address these issues.

The changes in the shear strengths and microstructures of nano‐silver joints induced by the changes of interconnection areas were investigated by shear tests and scanning electron microscopy.

The increased interconnection area blocks the organic components to be burnout and causes a higher pore ratio. Thus, it reduces the bonding quality. To ensure a good and steady sintering quality, the interconnection area should be limited to 3 × 3 mm².

A sintering technology or paste with oxygen agent will be studied in the future.

A relationship of shear strength and interconnection area of sintering joints with nano‐silver paste was observed.

This study aims to improve the corrosion resistance of TA2-welded joints by superhydrophobic surface modification using micro-arc oxidation technology and low surface energy substance modification.

The microstructure and chemical state of the superhydrophobic film layer were analyzed using scanning electron microscopy, energy dispersive X-ray spectroscopy, three-dimensional morphology, X-ray diffraction, X-ray photoelectron spectroscopy and Fourier transform infrared absorption spectroscopy. The influence of the superhydrophobic film layer on the corrosion resistance of TA2-welded joints was investigated using classical electrochemical testing methods.

The characterization results showed that the super hydrophobic TiO₂ ceramic membrane was successfully constructed on the surface of the TA2-welded joint, and the construction of the super hydrophobic film greatly improved the corrosion resistance of the TA2-welded joint.

The superhydrophobic TiO₂ ceramic membrane has excellent corrosion resistance. The micro nanostructure in the superhydrophobic film can intercept air to form an air layer to prevent the corrosion medium from contacting the surface, thus, improving the corrosion resistance of the sample.