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Solar cells could make textile-based wearable systems energy independent without the need for battery replacement or recharging; however, their laundry resistance, which is prerequisite for the product acceptance of e-textiles, has been rarely examined. This paper aims to report a systematic study of the laundry durability of solar cells embedded in textiles.

This research included small commercial monocrystalline silicon solar cells which were encapsulated with functional synthetic textile materials using an industrially relevant textile lamination process and found them to reliably endure laundry washing (ISO 6330:2012). The energy harvesting capability of eight textile laminated solar cells was measured after 10–50 cycles of laundry at 40 °C and compared with light transmittance spectroscopy and visual inspection.

Five of the eight textile solar cell samples fully maintained their efficiency over the 50 laundry cycles, whereas the other three showed a 20%–27% decrease. The cells did not cause any visual damage to the fabric. The result indicates that the textile encapsulated solar cell module provides sufficient protection for the solar cells against water, washing agents and mechanical stress to endure repetitive domestic laundry.

This study used rigid monocrystalline silicon solar cells. Flexible amorphous silicon cells were excluded because of low durability in preliminary tests. Other types of solar cells were not tested.

A review of literature reveals the tendency of researchers to avoid standardized textile washing resistance testing. This study removes the most critical obstacle of textile integrated solar energy harvesting, the washing resistance.

This paper aims to simulate vital corrective actions (CAs) affecting system availability through a system dynamics approach based on the results obtained by analyzing the causal relationships among failure modes and effects analysis elements.

A stock and flow diagram has been developed to simulate system behaviors during a timeframe. Some improvement scenarios regarding the most necessary CAs according to their strategic priority and the possibility of eliminating root causes of critical failure modes in a roller-transmission system have been simulated and analyzed to choose the most effective one(s) for the system availability. The proposed approach has been examined in a steel-manufacturing company.

Results indicated the most effective CAs to remove or diminish critical failure causes that led to the less reliability of the system. It illustrated the impacts of the selected CAs on eliminating or decreasing root causes of the critical failure modes, lessening the system’s failure rate and increasing the system availability more effectively.

Results allow managers and decision-makers to consider different maintenance scenarios without wasting time and more cost, choosing the most appropriate option according to system conditions.

This study innovation would be the dynamic analysis of interactions among failure modes, effects and causes over time to predict the system behavior and improve availability by choosing the most effective CAs through improvement scenario simulation via VENSIM software.

The purpose of this study is to increase awareness of current supply chain (SC) security-related issues by providing an extensive analysis of existing SC security solutions and their limitations. The security of SCs has received increasing attention from researchers, due to the emerging risks associated with their distributed nature. The increase in risk in SCs comes from threats that are inherently similar regardless of the type of SC, thus, requiring similar defence mechanisms. Being able to identify the types of threats will help developers to build effective defences.

In this work, we provide an analysis of the threats, possible attacks and traceability solutions for SCs, and highlight outstanding problems. Through a comprehensive literature review (2015–2021), we analysed various SC security solutions, focussing on tracking solutions. In particular, we focus on three types of SCs: digital, food and pharmaceutical that are considered prime targets for cyberattacks. We introduce a systematic categorization of threats and discuss emerging solutions for prevention and mitigation.

Our study shows that the current traceability solutions for SC systems do not offer a broadened security analysis and fail to provide extensive protection against cyberattacks. Furthermore, global SCs face common challenges, as there are still unresolved issues, especially those related to the increasing SC complexity and interconnectivity, where cyberattacks are spread across suppliers.

This is the first time that a systematic categorization of general threats for SC is made based on an existing threat model for hardware SC.

This study aims to analyze and discuss the impact of corporate social responsibility (CSR) on firms’ performance, as well as to examine the interplay between CSR and the economy, society and innovation.

This paper collects data from 420 manufacturing firms across various geographical regions in China. By using a structural equation model, the paper investigates the impact of CSR on enterprise innovation, customer management capability, market competitiveness (MC) and firm financial performance.

The findings demonstrate that CSR performance positively contributes to enhancing the level of enterprise innovation, as well as customer management capability and market competitiveness. Furthermore, it assists enterprises in improving market competitiveness and elevating customer management capabilities. Thus, CSR can have a positive effect on the firm financial performance.

The outcomes presented in this paper offer valuable evidence regarding the influence of implementing CSR on different aspects of enterprise performance and innovation. Moreover, it provides practical recommendations for enterprises seeking to transition towards low-carbon practices and upgrade their manufacturing industry.

This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Specimens of the capacitor assembly were subjected to JEDEC level 1 preconditioning (85 °C/85%RH/168 h) with 5× reflow at 270°C peak temperature. Then, they were inspected using a 2 µm scanning electron microscope to investigate the evidence of defects. The reliability test was also numerically simulated and analyzed using the extended finite element method implemented in ABAQUS.

Excellent agreements were observed between the SEM inspections and the simulation results. The findings showed evidence of discontinuities along the Cu and the Cu-epoxy layers and interfacial delamination crack at the Cu/Cu-epoxy interface. The possible root causes are thermal mismatch between the Cu and Cu-epoxy layers, moisture contamination and weak Cu/Cu-epoxy interface. The maximum crack length observed in the experimentally reflowed capacitor was measured as 75 µm, a 2.59% difference compared to the numerical prediction of 77.2 µm.

This work's contribution is expected to reduce the additional manufacturing cost and lead time in investigating reliability issues in MLCCs.

Despite the significant number of works on the reliability assessment of surface mount capacitors, work on crack growth in soft-termination MLCC is limited. Also, the combined experimental and numerical investigation of reflow-induced reliability issues in soft-termination MLCC is limited. These cited gaps are the novelties of this study.

The purpose of this paper is to illustrate the new technical demands and reliability challenges to printed circuit board (PCB) designs, materials and processes when the transmission frequency increases from Sub-6 GHz in previous generations to millimeter (mm) wave in fifth-generation (5G) communication technology.

The approach involves theoretical analysis and actual case study by various characterization techniques, such as a stereo microscope, metallographic microscope, scanning electron microscope, energy dispersive spectroscopy, focused ion beam, high-frequency structure simulator, stripline resonator and mechanical test.

To meet PCB signal integrity demands in mm-wave frequency bands, the improving proposals on copper profile, resin system, reinforcement fabric, filler, electromagnetic interference-reducing design, transmission line as well as via layout, surface treatment, drilling, desmear, laminating and electroplating were discussed. And the failure causes and effects of typical reliability issues, including complex permittivity fluctuation at different frequencies or environments, weakening of peel strength, conductive anodic filament, crack on microvias, the effect of solder joint void on signal transmission performance and soldering anomalies at ball grid array location on high-speed PCBs, were demonstrated.

The PCB reliability problem is the leading factor to cause failures of PCB assemblies concluded from statistical results on the failure cases sent to our laboratory. The PCB reliability level is very essential to guarantee the reliability of the entire equipment. In this paper, the summarized technical demands and reliability issues that are rarely reported in existing articles were discussed systematically with new perspectives, which will be very critical to identify potential reliability risks for PCB in 5G mm-wave applications and implement targeted improvements.

Phonecards were largely used in African countries for telephone services. They have been collected by people around the world as a hobby. Images from several themes were printed in phonecards, including insects (beetles, butterflies, dragonflies, etc.). We hypothesized that the display of butterfly images in phonecards aimed to arise issues associated with butterfly endangerment and conservation status by protecting their natural habitat and/or butterfly beautifulness, and that they present “extinct” or “threatened” conservation status classification. The purpose of this study is to describe how butterfly images were used in African phonecards; to identify the butterfly species name through their images and information available in all African phonecards; and to record the most recent known geographical distribution and conservation status of butterflies.

Colnect database was assessed to identify all butterfly-themed African phonecards. International Union for Conservation of Nature database was also assessed to obtain information on the most recent known geographical distribution and conservation status of butterflies.

The species name of butterflies was identified from 6 out of 18 African phonecards. The most recent known geographical distribution of butterflies was wide across Africa and conservation status of most genera is classified as “least concern”.

The display of butterfly images in African phonecards is mostly associated with their beautifulness and least related with butterfly conservation, protection and endangerment status.

This paper aims to compare and evaluate the influence of package designs and characteristics on the mechanical reliability of electronic assemblies when subjected to harmonic vibrations.

Using finite element analysis (FEA), the effect of package design-related parameters, including the interconnect array configuration, i.e. full vs perimeter, and package size, on solder mechanical stresses are fully addressed.

The results of FEA simulations revealed that the number of solder rows or columns available in the array, could significantly affect solder stresses. In addition, smaller packages result in lower solder stresses and differing distributions.

In literature, there are no papers that discuss the effect of solder array layout on electronic packages vibration reliability. In addition, general rules for designing electronic assemblies subjected to harmonic vibration loadings are proposed in this paper.

Waste generated from electrical and electronic equipment, collectively known as E-waste, remains a persistent environmental, economic and social problem. Sustainable E-waste management (EWM) has numerous benefits, such as preventing electronic waste from entering landfills, reducing the need for virgin materials by recovering valuable materials from recycling and lowering greenhouse gas emissions. Circular economy (CE) practices are considered the initial steps toward sustainable EWM, but some hurdles have been reported in the adoption of these practices. Therefore, the current study aims to identify the common CE practices, sustainability of the EWM process and the challenges in EWM, and to develop a conceptual framework for effective EWM.

Very few studies have proposed frameworks that acknowledge the challenges and CE practices of EWM. To fill this gap, a systematic literature review (SLR) was performed, and 169 research articles were explored.

A total of seven challenges in the adoption of effective EWM were identified: rules and policy, infrastructure, consumer behaviour, informal sectors, community culture, technology and economy. Eight common CE practices were also found for effective EWM: reuse, recycle, remanufacturing, refurbishment, repair, reduce, recover and repurpose.

A conceptual framework guiding sustainable EWM was proposed, which includes solutions for the identified challenges, and CE practices with sustainable benefits.

This study aims to introduce a novel technique for nonlinear sensor time constant estimation and sensor dynamic compensation in hot-bar soldering using an extended Kalman filter (EKF) to estimate the temperature of the thermocouple.

Temperature optimal control is combined with a closed-loop proportional integral differential (PID) control method based on an EKF. Different control methods for measuring the temperature of the thermode in terms of temperature control, error and antidisturbance are studied. A soldering process in a semi-industrial environment is performed. The proposed control method was applied to the soldering of flexible printed circuits and circuit boards. An infrared camera was used to measure the top-surface temperature.

The proposed method can not only estimate the soldering temperature but also eliminate the noise of the system. The performance of this methodology was exemplary, characterized by rapid convergence and negligible error margins. Compared with the conventional control, the temperature variability of the proposed control is significantly attenuated.

An EKF was designed to estimate the temperature of the thermocouple during hot-bar soldering. Using the EKF and PID controller, the nonlinear properties of the system could be effectively overcome and the effects of disturbances and system noise could be decreased. The proposed method significantly enhanced the temperature control performance of hot-bar soldering, effectively suppressing overshoot and shortening the adjustment time, thereby achieving precise temperature control of the controlled object.