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This paper aims to design the circuit for electromagnetic interface (EMI) reduction in liquid crystal display (LCD).

The cascode level shifter and segmented driver circuit are applied in LCD column driver integrated circuit (IC) for EMI reduction. Cascode current mirror is used in the proposed level shifter for DC voltage biasing and reduction of the driving current which passes through the level shifter. The on-off switching currents and transient times are measured and compared between the conventional and proposed level shifters. Additionally, a segmented data latch is obtained by the timing spread solution in data latch, and applied to split the large peak switching current into a number of smaller peak current. The timing spread-operation does not actually reduce the total power of the noise, instead, it spreads the noise power evenly over the frequency bandwidth. The optimal number of latch is dependent on the operating frequency and EMI allowance. The column driver IC and clock controller are integrated in 0.18 μm CMOS technology with 1-poly and 4-metal process.

The post-layout simulation shows that the proposed column driver circuit for LCD driver IC significantly reduces the peak switching current, and it results in the reduction of EMI noise level by more than 15 dB. It is obtained with 20 segmented operations in data latch at 40 MHz frequency.

The advantage of the cascode current source is that it can provide a well-controlled bias current with an accurate current transfer ratio. To reduce the EMI noise in LCD driver circuit, the cascode current source is properly located for the DC bias block in the level shifter. The application is rarely done by others, and a significant EMI noise reduction is found. The well-controlled current source provides a high performance switching in the level shifter.

The paper aims to design of dual-mode boost converter with integrated low-voltage control circuit is introduced in this paper. The paper aims to discuss these issues.

The converter is operated either with LC filter or with charge pump circuit by the switch control. The control stage with error amplifier, comparator, and oscillator is designed with the supply voltage of 3.3 V and the operating frequency of 5.5 MHz. The compensator circuit exploits a pole compensation for a stable operation.

The simulation test in 0.35 μm CMOS process shows that the charge pump regulator and DC-DC boost converter are accurately controlled with the variation of number of stages and duty ratio. The output-voltage is obtained to be 6-15 V within the ripple ratio of 5 percent. Maximum power consumption is about 0.65 W.

This dual-mode is useful in the converter with a wide load-current variation. The advantage of the dual-mode converter is that it can be used in either high or low load current with a simple switch control. Furthermore, in charge pump regulator, there is no degradation of output voltage because of the feedback control circuit.

The purpose of this paper is to present a fully integrated power converter. A stacked spiral inductor is applied in a voltage‐mode CMOS DC‐DC converter for the chip miniaturization and low‐power operation.

The three‐layer spiral inductor is simulated with an equivalent circuit and applied to the DC‐DC converter. The DC‐DC buck converter has been fabricated with a standard 0.35 μm CMOS process. The power converter is measured in both experiment and simulation in terms of frequency and electrical characteristics.

Experimental results show that the converter with the stacked spiral inductor operates properly with the inductance of 7.6 nH and mW power range. The measured inductance of the stacked spiral inductor is found to be almost half of the circuit designed value because of the parasitic resistances and capacitances in the spiral inductor.

This paper first introduces the application of the integrated stacked spiral inductor in DC‐DC buck converter for display driver circuit, which requires a low‐power operation. It also shows the fully integrated DC‐DC converter for chip miniaturization.

The purpose of this paper is to introduce a low power digital‐to‐analog converter (DAC) by using a sequential triggering technique in cascaded current source.

The block of current cell consists of current switch and source. A sequential switching on process is implemented with the current triggering technique in source. An experiment of 12‐b 150‐MS/s DAC has been integrated in a single‐poly four‐metal 0.35 μm CMOS process.

Compared with conventional cell array in 12‐b 150‐MS/s DAC, the proposed cell array shows that more than 30 percent of power consumption is reduced in full digital bit operation with allowable linearity error of 0.4 LSB.

This paper presents a new operation method of cell array in a current‐steering digital‐to‐analog converter (DAC) to reduce the power consumption significantly.