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Increased sophistication in the manufacture of electronic circuits, together with the ever more widespread adoption of conformal coatings, has led to new problems which are frequently the result of an interaction between residual surface chemicals and the electronic circuits themselves. In some instances poor adhesion between the conformal coating and the substrate may be experienced. This paper intends to assist the engineer in identifying where the problem may lie which only through appropriate quality process control and testing can be suitably resolved. It is important for the reader to consider whether there is a problem, if a circuit assembly has been exposed to, and passed, the required environmental testing regime, yet upon subsequent examination the coating is found to have an unusually poor level of adhesion. It is also particularly relevant to appreciate that there are currently no formal standards of entirely suitable test methods to determine what is an acceptable level of adhesion.

The aim of the present study was to gather and review all the important properties of the Sn–Ag–Cu (SAC) solder alloy. The SAC solder alloy has been proposed as the alternative solder to overcome the environmental concern of lead (Pb) solder. Many researchers have studied the SAC solder alloy and found that the properties such as melting temperature, wettability, microstructure and interfacial, together with mechanical properties, are better for the SAC solder than the tin – lead (SnPb) solders. Meanwhile, addition of various elements and nanoparticles seems to produce enhancement on the prior bulk solder alloy as well. These benefits suggest that the SAC solder alloy could be the next alternative solder for the electronic packaging industry. Although many studies have been conducted for this particular solder alloy, a compilation of all these properties regarding the SAC solder alloy is still not available for a review to say.

Soldering is identified as the metallurgical joining method in electronic packaging industry which uses filler metal, or well known as the solder, with a melting point < 425°C (Yoon et al., 2009; Ervina and Marini, 2012). The SAC solder has been developed by many methods and even alloying it with some elements to enhance its properties (Law et al., 2006; Tsao et al., 2010; Wang et al., 2002; Gain et al., 2011). The development toward miniaturization, meanwhile, requires much smaller solder joints and fine-pitch interconnections for microelectronic packaging in electronic devices which demand better solder joint reliability of SAC solder Although many studies have been done based on the SAC solder, a review based on the important characteristics and the fundamental factor involving the SAC solder is still not sufficient. Henceforth, this paper resolves in stating all its important properties based on the SAC solder including its alloying of elements and nanoparticles addition for further understanding.

Various Pb-free solders have been studied and investigated to overcome the health and environmental concern of the SnPb solder. In terms of the melting temperature, the SAC solder seems to possess a high melting temperature of 227°C than the Pb solder SnPb. Here, the melting temperature of this solder falls within the range of the average reflow temperature in the electronic packaging industry and would not really affect the process of connection. A good amendment here is, this melting temperature can actually be reduced by adding some element such as titanium and zinc. The addition of these elements tends to decrease the melting temperature of the SAC solder alloy to about 3°C. Adding nanoparticles, meanwhile, tend to increase the melting temperature slightly; nonetheless, this increment was not seemed to damage other devices due to the very slight increment and no drastic changes in the solidification temperature. Henceforth, this paper reviews all the properties of the Pb-free SAC solder system by how it is developed from overcoming environmental problem to achieving and sustaining as the viable candidate in the electronic packaging industry. The Pb-free SAC solder can be the alternative to all drawbacks that the traditional SnPb solder possesses and also an upcoming new invention for the future needs. Although many studies have been done in this particular solder, not much information is gathered in a review to give better understanding for SAC solder alloy. In that, this paper reviews and gathers the importance of this SAC solder in the electronic packaging industry and provides information for better knowledge.

This paper resolves in stating of all its important properties based on the SAC solder including its alloying of elements and nanoparticles addition for further understanding.

No‐clean flux printed board appraisal tests were conducted with all materials used in the production process. Metallic growths during environmental testing revealed that there was incompatibility between some materials used. Initial tests with two solder resists and several fluxes showed that one non solder resisted board, soldered using a synthetically activated (SA) flux, had surface insulation resistance (SIR) two decades higher than those using low solids flux (LSF) or other SAs. For boards with solder resist, the SIR of those soldered using LSFs was higher, however, than those using SA fluxes. SIR dependence on temperature and humidity was investigated. Results demonstrated that the dominant factor to determine the SIR of a no‐clean board was the characteristics of the board substrate finish. SIR changes with condensation were logged and found to be significant for solder resist finishes. Tests proved that reducing the contamination levels under and on top of the solder resist, by using hot de‐ionised water rinsing, enabled the calculated minimum SIR level to be achieved for spray fluxed boards and minimised the possibility of metallic growth. Visual examination proved to be at least as important as SIR testing. No‐clean processes were appraised using sequential environmental conditions with differing SIR pass levels. As a result of this appraisal a maximum ionic contamination level of 0·5 μg/cm2 NaCl equivalent and Dl water rinses, before and after solder resist added, will be introduced. Ionic contamination tests indicated that contamination levels reduced with elapsed time, probably due to ionic molecules locking more firmly into the board surface structure. A novel method for SIR measurements at any voltage, developed by the author, is described. It is hoped that this paper will further the understanding of no‐clean flux issues and highlight potential solutions and pitfalls.

The purpose of this paper is to present a new test method (tape peel method) to evaluate conformal coating adhesion to electronic assemblies.

The key issue for this method is the low cohesive force of conformal coatings, and hence selection of a supporting material to peel the coating from the substrate is critical. A suitable cloth material (35 per cent cotton +75 per cent polyester with 20 per cent open area) has been selected as a peel tape, and achieved the best bonding with coatings, and the smallest affect on the coating curing process. Using the tape, the peel force of the coating from the electronic assembly, can be measured quantitatively, and hence the adhesion performance of the conformal coating assessed.

The method was validated using different coating types, substrate materials (bare laminate with and without resist, copper clad laminate, and contaminated laminate material), assemblies and components. The results demonstrated that the tape peel test is a sensitive method for measuring coating adhesion on different materials found on PCB assemblies. Coating adhesion was found not to be effected by a wide range flux residues, but components and some resists presented a far greater coating challenge, with some coatings achieving very low adhesion values.

This new method for evaluating conformal coating adhesion to electronic assemblies will be of benefit to coating developers and users, and help to minimise adhesion failures in service. The test has been demonstrated to be sensitive to a number of process and material variables.

Purpose: The purpose of this chapter is to elaborate on the major conceptual and practical considerations of the use of robots, artificial intelligence and service automation (RAISA) in travel, tourism, and hospitality companies (TTH).

Design/methodology/approach: The chapter develops a conceptual framework of the major issues related to the use of RAISA in the travel, tourism and hospitality context.

Findings: The findings indicate that while there is a creeping incursion of RAISA into TTH, there are major concerns that the TTH industry has to consider in regard to automating TTH services.

Practical implications: In a practical sense, the chapter identifies the decisions that TTH industry professionals need to take when dealing with RAISA technologies. Furthermore, the chapter elaborates on the impacts RAISA have on business operations, marketing management, human resources and financial management of TTH companies. The TTH industry has to adjust its practices and communicate with its workforce in ways as not to increase Luddite tendencies and resistance among employees.

Social implications: The analysis shows that there is an upcoming era in which automation of services will be so advanced that wealthy countries may not need to import labour to make up with its own aging workforce, suggesting that RAISA and its further development has the potential for disrupting society and international relations.

Originality/value: This chapter provides a comprehensive review of the issues related to the use of RAISA in the TTH industry, including the drivers of RAISA adoption in tourism, advantages and disadvantages of RAISA technologies compared to human employees, decisions that managers need to take, and the impacts of RAISA on business processes. It shows how macroenvironmental pressures shape the microeconomic decisions to use RAISA in a TTH context.

The future beckons… a new millennium…

The concept of company culture is now playing an ever‐increasing role in the continuing endeavour to work towards ever better company management, particularly in the industrial field. This monograph reviews the history and development of both national and company cultures, and then goes on to demonstrate the significance of a culture to proper company management. Well‐managed companies will have both a “quality culture” and a “safety culture” as well as a cultural history. However, it has to be recognised that the company culture is subject to change, and effecting this can be very difficult. Of the many national cultures, that of Japan is considered to be the most effective, as is demonstrated by the present dominance of Japan on the industrial scene. Many industrialised nations now seek to emulate the Japanese style of management, but it is not possible to copy or acquire Japan′s cultural heritage. The text is illustrated by a large number of practical examples from real life, illustrating the way in which the company culture works and can be used by management to improve company performance.

Defines legitimation. Proposes six social factors or forces for analysing the current bases for legitimation in information systems development. Argues that if the directions of these forces shift, it could signal a major social change. Asserts that consideration of the concepts related to the six factors can help information systems researchers to sense emergent issues.