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This study aims to investigate the fatigue crack propagation behavior of SiC particle-reinforced 2124 Al alloy composites under constant amplitude axial loading at a stress ratio of R = 0.1. For this purpose, it is performed experiments and comparatively analyze the results by producing 5, 10, 15 Vol.% SiCp-reinforced composites and unreinforced 2124 Al alloy billets with powder metallurgy (PM) production technique.

With the PM production technique, SiCp-reinforced composite and unreinforced 2124 Al alloy billets were produced at 5%, 10%, 15% volume ratios. After the produced billets were extruded and 5 mm thick plates were formed, tensile and fatigue crack propagation compact tensile (CT) samples were prepared. Optical microscope examinations were carried out to determine the microstructural properties of billet and samples. To determine the SiC particle–matrix interactions due to the composite microstructure, unlike the Al alloy, which affects the crack initiation life and crack propagation rate, detailed scanning electron microscopy (SEM) studies have been carried out.

Optical microscope examinations for the determination of the microstructural properties of billet and samples showed that although SiC particles were rarely clustered in the Al alloy matrix, they were generally homogeneously dispersed. Fatigue crack propagation rates were determined experimentally. While the highest crack initiation resistance was achieved at 5% SiC volume ratio, the slowest crack propagation rate in the stable crack propagation region was found in the unreinforced 2124 Al alloy. At volume ratios greater than 5%, the number of crack initiation cycles decreases and the propagation rate increases.

As a requirement of damage tolerance design, the fatigue crack propagation rate and fatigue behavior of materials to be used in high-tech vehicles such as aircraft structural parts should be well characterized. Therefore, safer use of these materials in critical structural parts becomes widespread. In this study, besides measuring fatigue crack propagation rates, the mechanisms causing crack acceleration or deceleration were determined by applying detailed SEM examinations.

The purpose of this paper is to determine the ultra-high cycle fatigue behavior and ultra-slow crack propagation behavior of selective laser melting (SLM) AlSi7Mg alloy under as-built conditions.

Constant amplitude and two-step variable amplitude fatigue tests were carried out using ultrasonic fatigue equipment. The fracture surface of the failure specimen was quantitatively analyzed by scanning electron microscope (SEM).

The results show that the competition of surface and interior crack initiation modes leads to a duplex S–N curve. Both manufacturing defects (such as the lack of fusion) and inclusions can act as initially fatal fatigue microcracks, and the fatigue sensitivity level decreases with the location, size and type of the maximum defects.

The research results play a certain role in understanding the ultra-high cycle fatigue behavior of additive manufacturing aluminum alloys. It can provide reference for improving the process parameters of SLM technology.

This study aims to investigate the reliability issues of microvoid cracks in solder joint packages exposed to thermal cycling fatigue.

The specimens are subjected to JEDEC preconditioning level 1 (85 °C/85%RH/168 h) with five times reflow at 270°C. This is followed by thermal cycling from 0°C to 100°C, per IPC-7351B standards. The specimens' cross-sections are inspected for crack growth and propagation under backscattered scanning electronic microscopy. The decoupled thermomechanical simulation technique is applied to investigate the thermal fatigue behavior. The impacts of crack length on the stress and fatigue behavior of the package are investigated.

Cracks are initiated from the ball grid array corner of the solder joint, propagating through the transverse section of the solder ball. The crack growth increases continuously up to 0.25-mm crack length, then slows down afterward. The J-integral and stress intensity factor (SIF) values at the crack tip decrease with increased crack length. Before 0.15-mm crack length, J-integral and SIF reduce slightly with crack length and are comparatively higher, resulting in a rapid increase in crack mouth opening displacement (CMOD). Beyond 0.25-mm crack length, the values significantly decline, that there is not much possibility of crack growth, resulting in a negligible change in CMOD value. This explains the crack growth arrest obtained after 0.25-mm crack length.

This work's contribution is expected to reduce the additional manufacturing cost and lead time incurred in investigating reliability issues in solder joints.

The work investigates crack propagation mechanisms of microvoid cracks in solder joints exposed to moisture and thermal fatigue, which is still limited in the literature. The parametric variation of the crack length on stress and fatigue characteristics of solder joints, which has never been conducted, is also studied.

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

The purpose of this paper is to compile a comprehensive status report on pipes/piping networks across different industrial sectors, along with specifications of materials and sizes, and showcase welding avenues. It further extends to highlight the promising friction stir welding as a single solid-state pipe welding procedure. This paper will enable all piping, welding and friction stir welding stakeholders to identify scope for their engagement in a single window.

The paper is a review paper, and it is mainly structured around sections on materials, sizes and standards for pipes in different sectors and the current welding practice for joining pipe and pipe connections; on the process and principle of friction stir welding (FSW) for pipes; identification of main welding process parameters for the FSW of pipes; effects of process parameters; and a well-carved-out concluding summary.

A well-carved-out concluding summary of extracts from thoroughly studied research is presented in a structured way in which the avenues for the engagement of FSW are identified.

The implications of the research are far-reaching. The FSW is currently expanding very fast in the welding of flat surfaces and has evolved into a vast number of variants because of its advantages and versatility. The application of FSW is coming up late but catching up fast, and as a late starter, the outcomes of such a review paper may support stake holders to expand the application of this process from pipe welding to pipe manufacturing, cladding and other high-end applications. Because the process is inherently inclined towards automation, its throughput rate is high and it does not need any consumables, the ultimate benefit can be passed on to the industry in terms of financial gains.

To the best of the authors’ knowledge, this is the only review exclusively for the friction stir welding of pipes with a well-organized piping specification detailed about industrial sectors. The current pipe welding practice in each sector has been presented, and the avenues for engaging FSW have been highlighted. The FSW pipe process parameters are characteristically distinguished from the conventional FSW, and the effects of the process parameters have been presented. The summary is concise yet comprehensive and organized in a structured manner.

This study provides an analysis of patch repair for cracked aircraft structures. Delamination is a type of damage that affects the patch's behavior. The purpose of this study is to assess the influence of delamination on repair performance.

An analytical and numerical study using the finite element method was conducted for a cracked plate repaired with a patch containing a pre-existing delamination defect. The method for defining the contact pair surfaces and modeling the delamination interaction within the patch interface is specified using the virtual crack closure technique (VCCT) approach.

The efficiency of the repair is measured in terms of the J-integral. The effects of delamination initiation, mechanical loading, crack length and patch stacking sequences are presented. It is noted that in mode I, delamination propagation is only significant at node A. The numerical results are in good agreement with those of the analytical solution found in the literature. It is observed that the patch's behavior is strongly dependent on loading, crack size and stacking sequences in terms of reducing the structure's lifespan, especially in the presence of delamination.

The numerical modeling presented by the VCCT approach is highly valuable for studying delamination evolution. The influence of loading, crack size and stacking sequences on repair performance is discussed in this work.

This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Specimens of the capacitor assembly were subjected to JEDEC level 1 preconditioning (85 °C/85%RH/168 h) with 5× reflow at 270°C peak temperature. Then, they were inspected using a 2 µm scanning electron microscope to investigate the evidence of defects. The reliability test was also numerically simulated and analyzed using the extended finite element method implemented in ABAQUS.

Excellent agreements were observed between the SEM inspections and the simulation results. The findings showed evidence of discontinuities along the Cu and the Cu-epoxy layers and interfacial delamination crack at the Cu/Cu-epoxy interface. The possible root causes are thermal mismatch between the Cu and Cu-epoxy layers, moisture contamination and weak Cu/Cu-epoxy interface. The maximum crack length observed in the experimentally reflowed capacitor was measured as 75 µm, a 2.59% difference compared to the numerical prediction of 77.2 µm.

This work's contribution is expected to reduce the additional manufacturing cost and lead time in investigating reliability issues in MLCCs.

Despite the significant number of works on the reliability assessment of surface mount capacitors, work on crack growth in soft-termination MLCC is limited. Also, the combined experimental and numerical investigation of reflow-induced reliability issues in soft-termination MLCC is limited. These cited gaps are the novelties of this study.

As an advanced manufacturing method, additive manufacturing (AM) technology provides new possibilities for efficient production and design of parts. However, with the continuous expansion of the application of AM materials, subtractive processing has become one of the necessary steps to improve the accuracy and performance of parts. In this paper, the processing process of AM materials is discussed in depth, and the surface integrity problem caused by it is discussed.

Firstly, we listed and analyzed the characterization parameters of metal surface integrity and its influence on the performance of parts and then introduced the application of integrated processing of metal adding and subtracting materials and the influence of different processing forms on the surface integrity of parts. The surface of the trial-cut material is detected and analyzed, and the surface of the integrated processing of adding and subtracting materials is compared with that of the pure processing of reducing materials, so that the corresponding conclusions are obtained.

In this process, we also found some surface integrity problems, such as knife marks, residual stress and thermal effects. These problems may have a potential negative impact on the performance of the final parts. In processing, we can try to use other integrated processing technologies of adding and subtracting materials, try to combine various integrated processing technologies of adding and subtracting materials, or consider exploring more efficient AM technology to improve processing efficiency. We can also consider adopting production process optimization measures to reduce the processing cost of adding and subtracting materials.

With the gradual improvement of the requirements for the surface quality of parts in the production process and the in-depth implementation of sustainable manufacturing, the demand for integrated processing of metal addition and subtraction materials is likely to continue to grow in the future. By deeply understanding and studying the problems of material reduction and surface integrity of AM materials, we can better meet the challenges in the manufacturing process and improve the quality and performance of parts. This research is very important for promoting the development of manufacturing technology and achieving success in practical application.

Unconventional machining processes, particularly ultrasonic vibration cutting (UVC), can overcome such technical bottlenecks. However, the precise mechanism through which UVC affects the in-service functional performance of advanced aerospace materials remains obscure. This limits their industrial application and requires a deeper understanding.

The surface integrity and in-service functional performance of advanced aerospace materials are important guarantees for safety and stability in the aerospace industry. For advanced aerospace materials, which are difficult-to-machine, conventional machining processes cannot meet the requirements of high in-service functional performance owing to rapid tool wear, low processing efficiency and high cutting forces and temperatures in the cutting area during machining.

To address this literature gap, this study is focused on the quantitative evaluation of the in-service functional performance (fatigue performance, wear resistance and corrosion resistance) of advanced aerospace materials. First, the characteristics and usage background of advanced aerospace materials are elaborated in detail. Second, the improved effect of UVC on in-service functional performance is summarized. We have also explored the unique advantages of UVC during the processing of advanced aerospace materials. Finally, in response to some of the limitations of UVC, future development directions are proposed, including improvements in ultrasound systems, upgrades in ultrasound processing objects and theoretical breakthroughs in in-service functional performance.

This study provides insights into the optimization of machining processes to improve the in-service functional performance of advanced aviation materials, particularly the use of UVC and its unique process advantages.

This paper aims to present the novel stacked machine learning approach (SMLA) to estimate low-cycle fatigue (LCF) life of SAC305 solder across structural parts. Using the finite element simulation (FEM) and continuous damage mechanics (CDM) model, a fatigue life database is built. The stacked machine learning (ML) model's iterative optimization during training enables precise fatigue predictions (2.41% root mean square error [RMSE], R² = 0.975) for diverse structural components. Outliers are found in regression analysis, indicating potential overestimation for thickness transition specimens with extended lifetimes and underestimation for open-hole specimens. Correlations between fatigue life, stress factors, nominal stress and temperature are unveiled, enriching comprehension of LCF, thus enhancing solder behavior predictions.

This paper introduces stacked ML as a novel approach for estimating LCF life of SAC305 solder in various structural parts. It builds a fatigue life database using FEM and CDM model. The stacked ML model iteratively optimizes its structure, yielding accurate fatigue predictions (2.41% RMSE, R² = 0.975). Outliers are observed: overestimation for thickness transition specimens and underestimation for open-hole ones. Correlations between fatigue life, stress factors, nominal stress and temperature enhance predictions, deepening understanding of solder behavior.

The findings of this paper highlight the successful application of the SMLA in accurately estimating the LCF life of SAC305 solder across diverse structural components. The stacked ML model, trained iteratively, demonstrates its effectiveness by producing precise fatigue lifetime predictions with a RMSE of 2.41% and an “R²” value of 0.975. The study also identifies distinct outlier behaviors associated with different structural parts: overestimations for thickness transition specimens with extended fatigue lifetimes and underestimations for open-hole specimens. The research further establishes correlations between fatigue life, stress concentration factors, nominal stress and temperature, enriching the understanding of solder behavior prediction.

The authors confirm the originality of this paper.