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This study aims to address the problem of low-temperature wave soldering in industry production with Sn-9Zn-2.5 Bi-1.5In alloys and develop qualified process parameters. Sn–Zn eutectic alloys are lead-free solders applied in consumer electronics due to their low melting point, high strength, and low cost. In the electronic assembly industry, Sn–Zn eutectic alloys have great potential for use.

This paper explored developing and implementing process parameters for low-temperature wave soldering of Sn–Zn alloys (SN-9ZN-2.5BI-1.5 In). A two-factor, three-level design of the experiments experiment was designed to simulate various conditions parameters encountered in Sn–Zn soldering, developed the nitrogen protection device of waving soldering and proposed the optimal process parameters to realize mass production of low-temperature wave soldering on Sn–Zn alloys.

The Sn-9Zn-2.5 Bi-1.5In alloy can overcome the Zn oxidation problem, achieve low-temperature wave soldering and meet IPC standards, but requires the development of nitrogen protection devices and the optimization of a series of process parameters. The design experiment reveals that preheating temperature, soldering temperature and flux affect failure phenomena. Finally, combined with the process test results, an effective method to support mass production.

In term of overcome Zn’s oxidation characteristics, anti-oxidation wave welding device needs to be studied. Various process parameters need to be developed to achieve a welding process with lower temperature than that of lead solder(Sn–Pb) and lead-free SAC(Sn-0.3Ag-0.7Cu). The process window of Sn–Zn series alloy (Sn-9Zn-2.5 Bi-1.5In alloy) is narrow. A more stringent quality control chart is required to make mass production.

In this research, the soldering temperature of Sn-9Zn-2.5 Bi-1.5In is 5 °C and 25 °C lower than Sn–Pb and Sn-0.3Ag-0.7Cu(SAC0307). To the best of the authors’ knowledge, this work was the first time to apply Sn–Zn solder alloy under actual production conditions on wave soldering, which was of great significance for the study of wave soldering of the same kind of solder alloy.

Low-temperature wave soldering can supported green manufacturing widely, offering a new path to achieve carbon emissions for many factories and also combat to international climate change.

There are many research papers on Sn–Zn alloys, but methods of achieving low-temperature wave soldering to meet IPC standards are infrequent. Especially the process control method that can be mass-produced is more challenging. In addition, the metal storage is very high and the cost is relatively low, which is of great help to provide enterprise competitiveness and can also support the development of green manufacturing, which has a good role in promoting the broader development of the Sn–Zn series.

Porous implant surface is shown to facilitate bone in-growth and cell attachment, improving overall osteointegration, while providing adequate mechanical integrity. Recently, biodegradable material possessing such superior properties has been the focus with an aim of revolutionizing implant’s design, material and performance. This paper aims to present a comprehensive investigation into the design and development of low elastic modulus porous biodegradable Mg-3Si-5HA composite by mechanical alloying and spark plasma sintering (MA-SPS) technique.

This paper presents a comprehensive investigation into the design and development of low elastic modulus porous biodegradable Mg-3Si-5HA composite by MA-SPS technique. As the key alloying elements, HA powders with an appropriate proportion weight 5 and 10 are mixed with the base elemental magnesium (Mg) particles to form the composites of potentially variable porosity and mechanical property. The aim is to investigate the performance of the synthesized composites of Mg-3Si together with HA in terms of mechanical integrity hardness and Young’s moduli corrosion resistance and in-vitro bioactivity.

Mechanical and surface characterization results indicate that alloying of Si leads to the formation of fine Mg2 Si eutectic dense structure, hence increasing hardness while reducing the ductility of the composite. On the other hand, the allying of HA in Mg-3Si matrix leads to the formation of structural porosity (5-13 per cent), thus resulting in low Young’s moduli. It is hypothesized that biocompatible phases formed within the composite enhanced the corrosion performance and bio-mechanical integrity of the composite. The degradation rate of Mg-3Si composite was reduced from 2.05 mm/year to 1.19 mm/year by the alloying of HA elements. Moreover, the fabricated composites showed an excellent bioactivity and offered a channel/interface to MG-63 cells for attachment, proliferation and differentiation.

Overall, the findings suggest that the Mg-3Si-HA composite fabricated by MA and plasma sintering may be considered as a potential biodegradable material for orthopedic application.

As an advanced manufacturing method, additive manufacturing (AM) technology provides new possibilities for efficient production and design of parts. However, with the continuous expansion of the application of AM materials, subtractive processing has become one of the necessary steps to improve the accuracy and performance of parts. In this paper, the processing process of AM materials is discussed in depth, and the surface integrity problem caused by it is discussed.

Firstly, we listed and analyzed the characterization parameters of metal surface integrity and its influence on the performance of parts and then introduced the application of integrated processing of metal adding and subtracting materials and the influence of different processing forms on the surface integrity of parts. The surface of the trial-cut material is detected and analyzed, and the surface of the integrated processing of adding and subtracting materials is compared with that of the pure processing of reducing materials, so that the corresponding conclusions are obtained.

In this process, we also found some surface integrity problems, such as knife marks, residual stress and thermal effects. These problems may have a potential negative impact on the performance of the final parts. In processing, we can try to use other integrated processing technologies of adding and subtracting materials, try to combine various integrated processing technologies of adding and subtracting materials, or consider exploring more efficient AM technology to improve processing efficiency. We can also consider adopting production process optimization measures to reduce the processing cost of adding and subtracting materials.

With the gradual improvement of the requirements for the surface quality of parts in the production process and the in-depth implementation of sustainable manufacturing, the demand for integrated processing of metal addition and subtraction materials is likely to continue to grow in the future. By deeply understanding and studying the problems of material reduction and surface integrity of AM materials, we can better meet the challenges in the manufacturing process and improve the quality and performance of parts. This research is very important for promoting the development of manufacturing technology and achieving success in practical application.

This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free solder pastes.

The solder pastes investigated are of SAC305 type, Innolot type or they are especially formulated by the manufacturers on the base of (SnAgCu) alloys with addition of some alloying elements such as Bi, In, Sb and Ti to provide low-void contents. The SnPb solder paste – OM5100 – was used as a benchmark. The solder paste coverage of LED solder pads was chosen as a measure of void contents in solder joints because of common usage of this parameter in industry practice.

It was found that the highest coverage and, related to it, the least void contents are in solder joints formed with the pastes LMPA-Q and REL61, which are characterized by the coverage of mean value 93.13% [standard deviation (SD) = 2.72%] and 92.93% (SD = 2.77%), respectively. The void diameters reach the mean value equal to 0.061 mm (SD = 0.044 mm) for LMPA-Q and 0.074 mm (SD = 0.052 mm) for REL61. The results are presented in the form of histograms, plot boxes and X-ray images. Some selected solder joints were observed with 3D computer tomography.

The statistical analyses are carried out on the basis of 2D X-ray images with using Origin software. They enable to compare features of various solder pastes recommended by manufacturers as low voiding. The results might be useful for solder paste manufacturers or electronic manufacturing services.

Metal laser-powder-bed-fusion using laser-beam parts are particularly susceptible to contamination due to particles attached to the surface. This may compromise so-called technical cleanliness (e.g. in NASA RPTSTD-8070, ASTM G93, ISO 14952 or ISO 16232), which is important for many 3D-printed components, such as implants or liquid rocket engines. The purpose of the presented comparative study is to show how cleanliness is improved by design and different surface treatment methods.

Convex and concave test parts were designed, built and surface-treated by combinations of media blasting, electroless nickel plating and electrochemical polishing. After cleaning and analysing the technical cleanliness according to ASTM and ISO standards, effects on particle contamination, appearance, mass and dimensional accuracy are presented.

Contamination reduction factors are introduced for different particle sizes and surface treatment methods. Surface treatments were more effective for concave design features, however, the initial and resulting absolute particle contamination was higher. Results further indicate that there are trade-offs between cleanliness and other objectives in design. Design guidelines are introduced to solve conflicts in design when requirements for cleanliness exist.

This paper recommends designing parts and corresponding process chains for manufacturing simultaneously. Incorporating post-processing characteristics into the design phase is both feasible and essential. In the experimental study, electroless nickel plating in combination with prior glass bead blasting resulted in the lowest total remaining particle contamination. This process applied for cleanliness is a novelty, as well as a comparison between the different surface treatment methods.

This paper aims to investigate the wear behaviour of different materials for cylinder liners and piston rings in a linear reciprocating tribometer with special focus on the wear of the cylinder liner in the boundary lubrication regime.

Conventional nitrided steel, as well as diamond-like carbon and chromium nitride-coated piston rings, were tested against cast iron, AlSi and Fe-coated AlSi cylinder liners. The experiments were carried out with samples produced from original engine parts to have the original surface topography available. Radioactive tracer isotopes were used to measure cylinder liner wear continuously, enabling separation of running-in and steady-state wear.

A ranking of the material pairings with respect to wear behaviour of the cylinder liner was found. Post-test inspection of the cylinder samples by scanning electron microscopy (SEM) revealed differences in the wear mechanisms for the different material combinations. The results show that the running-in and steady-state wear of the liners can be reduced by choosing the appropriate material for the piston ring.

The use of original engine parts in a closely controlled tribometer environment under realistic loading conditions, in conjunction with continuous and highly sensitive wear measurement methods and a detailed SEM analysis of the wear mechanisms, forms an intermediate step between engine testing and laboratory environment testing.