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This paper aims to present a low-cost, edge-fed, windmill-shaped, notch-band eliminator, circular monopole antenna which is practically loaded with a complementary split ring resonator (CSRR) in the middle of the radiating conductor and also uses a partial ground to obtain wide-band performance.

To compensate for the reduced value of gain and reflection coefficient because of the full (complete) ground plane at the bottom of the substrate, the antenna is further loaded with a partial ground and a CSRR. The reduction in the length of ground near the feed line improves the impedance bandwidth, and introduced CSRR results in improved gain with an additional resonance spike. This results in a peak gain 3.895dBi at the designed frequency 2.45 GHz. The extending of three arms in the circular patch not only led to an increase of peak gain by 4.044dBi but also eliminated the notch band and improved the fractional bandwidth 1.65–2.92 GHz.

The work reports a –10dB bandwidth from 1.63 GHz to 2.91 GHz, which covers traditional coverage applications and new specific uses applications such as narrow LTE bands for future internet of things (NB-IoT) machine-to-machine communications 1.8/1.9/2.1/2.3/2.5/2.6 GHz, industry, automation and business-critical cases (2.1/2.3/2.6 GHz), industrial, society and medical applications such as Wi-MAX (3.5 GHz), Wi-Fi3 (2.45 GHz), GSM (1.9 GHz), public safety band, Bluetooth (2.40–2.485 GHz), Zigbee (2.40–2.48Ghz), industrial scientific medical (ISM) band (2.4–2.5 GHz), WCDMA (1.9, 2.1 GHz), 3 G (2.1 GHz), 4 G LTE (2.1–2.5 GHz) and other personal communication services applications. The estimated RLC electrical equivalent circuit is also presented at the end.

Because of full coverage of Bluetooth, Zigbee, WiFi3 and ISM band, the proposed fabricated antenna is suitable for low power, low data rate and wireless/wired short-range IoT-enabled medical applications.

The antenna is fabricated on a piece (66.4 mm × 66.4 mm × 1.6 mm) of low-cost low profile FR-4 epoxy substrate (0.54 λ_g × 0.54 λ_g) with a dielectric constant of 4.4, a loss tangent of 0.02 and a thickness of 1.6 mm. The antenna reflection coefficient, impedance and VSWR are tested on the Keysight technology (N9917A) vector network analyzer, and the radiation pattern is measured in an anechoic chamber.

The purpose of this paper is to illustrate the new technical demands and reliability challenges to printed circuit board (PCB) designs, materials and processes when the transmission frequency increases from Sub-6 GHz in previous generations to millimeter (mm) wave in fifth-generation (5G) communication technology.

The approach involves theoretical analysis and actual case study by various characterization techniques, such as a stereo microscope, metallographic microscope, scanning electron microscope, energy dispersive spectroscopy, focused ion beam, high-frequency structure simulator, stripline resonator and mechanical test.

To meet PCB signal integrity demands in mm-wave frequency bands, the improving proposals on copper profile, resin system, reinforcement fabric, filler, electromagnetic interference-reducing design, transmission line as well as via layout, surface treatment, drilling, desmear, laminating and electroplating were discussed. And the failure causes and effects of typical reliability issues, including complex permittivity fluctuation at different frequencies or environments, weakening of peel strength, conductive anodic filament, crack on microvias, the effect of solder joint void on signal transmission performance and soldering anomalies at ball grid array location on high-speed PCBs, were demonstrated.

The PCB reliability problem is the leading factor to cause failures of PCB assemblies concluded from statistical results on the failure cases sent to our laboratory. The PCB reliability level is very essential to guarantee the reliability of the entire equipment. In this paper, the summarized technical demands and reliability issues that are rarely reported in existing articles were discussed systematically with new perspectives, which will be very critical to identify potential reliability risks for PCB in 5G mm-wave applications and implement targeted improvements.

This paper aims to discuss the ethical aspects of hardware reverse engineering (HRE) and propose an ethical framework for HRE when used to mitigate cyber risks of the digital supply chain of critical infrastructure operators.

A thorough review and analysis of existing relevant literature was performed to establish the current state of knowledge in the field. Ethical frameworks proposed for other areas/disciplines and identified pertinent ethical principles have been used to inform the proposed framework’s development.

The proposed framework provides actionable guidance to security professionals engaged with such activities to support them in assessing whether an HRE project conforms to ethical principles. Recommendations on action needed to complement the framework are also proposed. According to the proposed framework, reverse engineering is neither unethical nor illegal if performed honourably. Collaboration with vendors and suppliers at an industry-wide level is critical for appropriately endorsing the proposed framework.

To the best of the authors’ knowledge, no ethical framework currently guides cybersecurity research, far less of cybersecurity vulnerability research and reverse engineering.

Induction heating processes need to adapt to complex geometries or variable processes that require a high degree of flexibility in the induction heating setup. This is usually done using complex inductors or adaptable resonant tanks, which leads to costly and constrained implementations. This paper aims to propose a multi-level, versatile power supply able to adapt the output to the required induction heating process.

This paper proposes a versatile multilevel topology able to generate versatile output waveforms. The methodology followed includes simulation of the proposed architecture, design of the power electronics, control and magnetic elements and laboratory tests after building a 10-level prototype.

The proposed converter has been designed and tested using an experimental prototype. The designed generator is able to operate at 1 kVpp and 100 A at 250 kHz, proving the feasibility of the proposed approach.

The proposed converter enables versatile waveform generation, enabling advanced tests and processes on induction heating system. The proposed system allows for multifrequency generation using a single inductor and converter, or advanced tests for inductive and capacitive components used on induction heating systems. Unlike previous multifrequency proposals, the proposed generator enables a significantly improved versatility in terms of operational frequency and amplitude in a single converter.

The purpose of this study is to increase awareness of current supply chain (SC) security-related issues by providing an extensive analysis of existing SC security solutions and their limitations. The security of SCs has received increasing attention from researchers, due to the emerging risks associated with their distributed nature. The increase in risk in SCs comes from threats that are inherently similar regardless of the type of SC, thus, requiring similar defence mechanisms. Being able to identify the types of threats will help developers to build effective defences.

In this work, we provide an analysis of the threats, possible attacks and traceability solutions for SCs, and highlight outstanding problems. Through a comprehensive literature review (2015–2021), we analysed various SC security solutions, focussing on tracking solutions. In particular, we focus on three types of SCs: digital, food and pharmaceutical that are considered prime targets for cyberattacks. We introduce a systematic categorization of threats and discuss emerging solutions for prevention and mitigation.

Our study shows that the current traceability solutions for SC systems do not offer a broadened security analysis and fail to provide extensive protection against cyberattacks. Furthermore, global SCs face common challenges, as there are still unresolved issues, especially those related to the increasing SC complexity and interconnectivity, where cyberattacks are spread across suppliers.

This is the first time that a systematic categorization of general threats for SC is made based on an existing threat model for hardware SC.

Data represents a critical resource that enables construction companies’ success; thus, its management is very important. The purpose of this study is to assess the benefits of construction data risks management (DRM) in the construction industry (CI).

This study adopted a quantitative method and collected data from various South African construction professionals with the aid of an e-questionnaire. These professionals involve electrical engineers, quantity surveyors, architects and mechanical, as well as civil engineers involved under a firm, or organisation within the province of Gauteng, South Africa. Standard deviation, mean item score, non-parametric Kruskal–Wallis H test and exploratory factor analysis were used to analyse the retrieved data.

The findings revealed that DRM enhances project and company data availability, promotes confidentiality and enhances integrity, which are the primary benefits of DRM that enable the success of project delivery.

The research was carried out only in the province of Gauteng due to COVID-19 travel limitations.

The construction companies will have their data permanently in their possession and no interruption will be seen due to data unavailability, which, in turn, will allow long-term and overall pleasant project outcomes.

This study seeks to address the benefits of DRM in the CI to give additional knowledge on risk management within the built environment to promote success in every project.

Defining and validating a map of related technologies is critical for managers, investors and inventors. Because of the increase in the applications of and demand for semiconductor lasers, analyzing the technological position of developers has become increasingly critical. Therefore, the purpose of this study is to adopt the technological position analysis to identify mainstream technologies and developments relevant to semiconductor lasers.

Correspondence analysis and k-means cluster analysis, which are data mining techniques, are used to reveal strategic groups of major competitors in the semiconductor laser market according to their Patent Cooperation Treaty (PCT) patent applications.

The results of this study reveal that PCT patent applications are generally obtained for masers, optical elements, semiconductor devices and methods for measuring and that technology developers have varying technological positions.

Through position analysis, this study identifies the technological focuses of different manufacturers to obtain information that can guide the allocation of research and development resources.

Plasma technology has become of great interest in a wide variety of industrial and domestic applications. Moreover, the application of plasma in the domestic field has increased in recent years due to its applications to surface treatment and disinfection. In this context, there is a significant need for versatile power generators able to generate a wide range of output voltage/current ranging from direct current (DC) to tens of kHz in the range of kVs. The purpose of this paper is to develop a highly versatile power converter for plasma generation based on a multilevel topology.

This paper proposes a versatile multilevel topology able to generate versatile output waveforms. The followed methodology includes simulation of the proposed architecture, design of the power electronics, control and magnetic elements and test laboratory tests after building an eight-level prototype.

The proposed converter has been designed and tested using an experimental prototype. The designed generator is able to operate at 10 kVpp output voltage and 10 kHz, proving the feasibility of the proposed approach.

The proposed converter enables versatile waveform generation, enabling advanced studies in plasma generation. Unlike previous proposals, the proposed converter features bidirectional operation, allowing to test complex reactive loads. Besides, complex waveforms can be generated, allowing testing complex patterns for optimized cold-plasma generation methods. Besides, unlike transformer- or resonant-network-based approaches, the proposed generator features very low output impedance regardless the operating point, exhibiting improved and reliable performance for different operating conditions.

Fused Filament Fabrication (FFF) is one of the growing technologies in additive manufacturing, that can be used in a number of applications. In this method, process parameters can be customized and their simultaneous variation has conflicting impacts on various properties of printed parts such as dimensional accuracy (DA) and surface finish. These properties could be improved by optimizing the values of these parameters.

In this paper, four process parameters, namely, print speed, build orientation, raster width, and layer height which are referred to as “input variables” were investigated. The conflicting influence of their simultaneous variations on the DA of printed parts was investigated and predicated. To achieve this goal, a hybrid Genetic Algorithm – Artificial Neural Network (GA-ANN) model, was developed in C#.net, and three geometries, namely, U-shape, cube and cylinder were selected. To investigate the DA of printed parts, samples were printed with a central through hole. Design of Experiments (DoE), specifically the Rotational Central Composite Design method was adopted to establish the number of parts to be printed (30 for each selected geometry) and also the value of each input process parameter. The dimensions of printed parts were accurately measured by a shadowgraph and were used as an input data set for the training phase of the developed ANN to predict the behavior of process parameters. Then the predicted values were used as input to the Desirability Function tool which resulted in a mathematical model that optimizes the input process variables for selected geometries. The mean square error of 0.0528 was achieved, which is indicative of the accuracy of the developed model.

The results showed that print speed is the most dominant input variable compared to others, and by increasing its value, considerable variations resulted in DA. The inaccuracy increased, especially with parts of circular cross section. In addition, if there is no need to print parts in vertical position, the build orientation should be set at 0° to achieve the highest DA. Finally, optimized values of raster width and layer height improved the DA especially when the print speed was set at a high value.

By using ANN, it is possible to investigate the impact of simultaneous variations of FFF machines’ input process parameters on the DA of printed parts. By their optimization, parts of highly accurate dimensions could be printed. These findings will be of significant value to those industries that need to produce parts of high DA on FFF machines.

This paper aims to compare and evaluate the influence of package designs and characteristics on the mechanical reliability of electronic assemblies when subjected to harmonic vibrations.

Using finite element analysis (FEA), the effect of package design-related parameters, including the interconnect array configuration, i.e. full vs perimeter, and package size, on solder mechanical stresses are fully addressed.

The results of FEA simulations revealed that the number of solder rows or columns available in the array, could significantly affect solder stresses. In addition, smaller packages result in lower solder stresses and differing distributions.

In literature, there are no papers that discuss the effect of solder array layout on electronic packages vibration reliability. In addition, general rules for designing electronic assemblies subjected to harmonic vibration loadings are proposed in this paper.