Search results

The paper provides an overview of research published in the innovation and operations management (IOM) literature on 15 methods for cost management in new product development, and it provides a comparison to an earlier review of the management accounting (MA) literature (Wouters & Morales, 2014).

This structured literature search covers papers published in 23 journals in IOM in the period 1990–2014.

The search yielded a sample of 208 unique papers with 275 results (one paper could refer to multiple cost management methods). The top 3 methods are modular design, component commonality, and product platforms, with 115 results (42%) together. In the MA literature, these three methods accounted for 29%, but target costing was the most researched cost management method by far (26%). Simulation is the most frequently used research method in the IOM literature, whereas this was averagely used in the MA literature; qualitative studies were the most frequently used research method in the MA literature, whereas this was averagely used in the IOM literature. We found a lot of papers presenting practical approaches or decision models as a further development of a particular cost management method, which is a clear difference from the MA literature.

This review focused on the same cost management methods, and future research could also consider other cost management methods which are likely to be more important in the IOM literature compared to the MA literature. Future research could also investigate innovative cost management practices in more detail through longitudinal case studies.

This review of research on methods for cost management published outside the MA literature provides an overview for MA researchers. It highlights key differences between both literatures in their research of the same cost management methods.

The purpose of this paper is to present the analysis of barriers affecting the adoption of lean concepts to electrical and electronics component manufacturing.

Lean concepts are being increasingly applied by electrical and electronics component manufacturers to enhance product value through streamlined process. To facilitate smooth adoption of lean concepts, barriers need to be analyzed and prioritized. In this context, a structural model of 24 barriers is developed through total interpretive structural modeling (TISM) approach.

‘Changing governmental policies,’ ‘poor selection of change agents and improvement teams,’ ‘lack of top management commitment understanding and support of the system,’ ‘lack of team autonomy,’ ‘lack of flexibility and versatility’ and ‘lack of customer focus/involvement’ are found to be the dominant barriers based on TISM study. Interpretation statements are being derived from TISM model. Cross-impact matrix multiplication applied to classification analysis is conducted.

In the present paper, 24 barriers are considered. In future, additional barriers could be considered to deal with managerial advancements.

The paper reports the practical case of analysis of barriers to lean adoption in electronics component manufacture. Hence, the inferences have practical relevance.

The development of structural model for the analysis of barriers to lean implementation in electronics component manufacturing small- and medium-sized enterprises is the original contribution of the authors.

Eliminating lead in electronics is an environmentally considerate approach that is made prior to manufacture. Recently enacted legislation encourages increased recycling of electrical and electronic products. However, recycling is typically an end‐of‐use action occurring just before final disposal. From an environmentally‐considerate perspective, lead elimination or replacement is a better approach. Short of having a definitive study to follow, industry, regulators, and consumers are proceeding with the change. Various lead‐free alloys have been tested and used for electronic components and assemblies. There are many replacements for eutectic tin‐lead solder, and alloys containing tin, silver, copper, and bismuth have been used successfully. Assessing how the electronics industry is addressing the change to lead‐free materials and processes requires answers to various questions. These questions regard the effects of changes to electronic products and their processes. What drives lead‐free migration, how processes can develop, and when products will be available are issues which define the assessment.

The purpose of this paper is to explore the effects of different dimensions of supply chain management practices (SCMP) on supply chain performance (SCP) in the electronics industry in Malaysia.

The study employed the quantitative method where convenience sampling and self‐administrated survey questionnaires were sent to 125 electronics firms in Malaysia. The research framework was tested using variance‐based structural equation model, the partial least squares (PLS) method.

The empirical results of PLS indicate that six of the seven dimensions of SCMP have a significant positive effect on SCP. Furthermore, agreed vision and goals shows a greater influence than other dimensions of SCMP.

This study took a narrow focus solely on the electronics manufacturing industry with a relatively small sample size of respondents. Also the data were only collected from single respondents in an organization. However, being the first study to explore the dimensions of SCMP and how those dimensions relate to SCP, the study shapes the pathway for future research.

The results offer insights to SCM practitioners and policy makers on the importance of SCMP to increase the competitiveness of manufacturing industry in terms of SCP.

This study employs a newly developed framework based on existing theoretical arguments to empirically examine the relationship between two important factors, the SCMP and SCP. This study is perhaps one of the first to address the effect of SCMP that includes combination of comprehensive practices and system approach towards the overall performance of the supply chain.

A new post, that of Export Manager, has been created at PMD Chemicals Ltd, Coventry.

For some years now the dominant techniques for coating thickness have been based on electronic instrumentation. As such they have been subject to the same rigid progress which has been seen in the electronics industry. Components have become smaller and more complex and the microprocessor is pushing into more and more areas of control and measurement. Development of the various techniques has increased the range of coating‐substrate combinations that are measurable and improvements to stability have extended the measurement range. Statistical evaluation of results has been added to all but the simplest instruments. Describes the principal instrument types and in conclusion sees their intelligent use and the implementation of statistical process control as making the life of the organic finisher easier and more profitable.

Examines five strategic human resource management (HRM) issues using a qualitative methodology. Two of these are related to the central organisational‐level constructs of structure and culture. The other three pertain to HR strategy, HR competencies, and HR outsourcing. The study employed the multiple‐case design method proposed by Yin, with a view to extending theory in strategic HRM research. Semi‐structured interviews were conducted with 35 managers (CEOs, line managers, and HR managers) of nine companies from two major industries in the manufacturing sector – electronic products and machinery/equipment. The research found that top management enlightenment and level of HR competencies together determine the role and status of the HR function in organisations, and that the companies studied pursue four types of HR strategies: informal and not communicated; informal and communicated; formal but not communicated; and formal and communicated. HR strategy was found to affect both vertical and horizontal fits of the HR function. Culture, HR strategy and HR competencies influenced organisational propensity to outsource HR activities.