For some years now the dominant techniques for coating thickness have been based on electronic instrumentation. As such they have been subject to the same rigid progress which has been seen in the electronics industry. Components have become smaller and more complex and the microprocessor is pushing into more and more areas of control and measurement. Development of the various techniques has increased the range of coating‐substrate combinations that are measurable and improvements to stability have extended the measurement range. Statistical evaluation of results has been added to all but the simplest instruments. Describes the principal instrument types and in conclusion sees their intelligent use and the implementation of statistical process control as making the life of the organic finisher easier and more profitable.
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