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The purpose of this paper is to study the electronic transport performance of Ag-ZnO film under dark and UV light conditions.

Ag-doped ZnO thin films were prepared on fluorine thin oxide (FTO) substrates by sol-gel method. The crystal structure of ZnO and Ag-ZnO powders was tested by X-ray diffraction with Cu Kα radiation. The absorption spectra of ZnO and Ag-ZnO films were recorded by a UV–visible spectrophotometer. The micro electrical transport performance of Ag-ZnO thin films in dark and light state was investigated by photoassisted conductive atomic force microscope (PC-AFM).

The results show that the dark reverse current of Ag-ZnO films does not increase, but the reverse current increases significantly under illumination, indicating that the response of Ag-ZnO films to light is greatly improved, owing to the formation of Ohmic contact.

To the best of the author’s knowledge, the micro electrical transport performance of Ag-ZnO thin films in dark and light state was firstly investigated by PC-AFM.

Three-dimensional (3D) printing is popular for many applications including the production of photocatalysts. This paper aims to focus on developing of 3D-printed photocatalyst-nano composite lattice structure. Digital light processing (DLP) 3D printing of photocatalyst composites was performed using photosensitive resin mixed with 0.5% Wt. of TiO₂ powder and varying amounts (0.025% Wt. to 0.2% Wt.) of graphene nanoplatelet powder. The photocatalytic efficiency of DLP 3D-printed photocatalyst TiO₂ composite was investigated, and the effects of nano graphite powder incorporation on the photocatalytic activity, thermal and mechanical properties were investigated.

Methods involve 3D computer-aided design modeling, printing parameters and comprehensive characterization techniques such as structural equation modeling, X-ray diffraction, thermogravimetric analysis, Fourier-transform infrared (FTIR) and mechanical testing.

Results highlight successful dispersion and characteristics of TiO₂ and graphene nanoplatelet (GNP) powders, intricate designs of 3D-printed lattice structures, and the influence of GNPs on thermal behavior and mechanical properties.

The study suggests applicability in wastewater treatment and environmental remediation, showcasing the adaptability of 3 D printing in designing effective photocatalysts. Future research should focus on practical applications and the long-term durability of these 3D-printed composites.

The purpose of this study is to get benefits from manufacturing harmful wastes is by using them as a reinforcement with epoxy matrix composite materials to improve the damping characteristics in applications such as machine bases, rockets, satellites, missiles, navigation equipment and aircraft as large structures, and electronics as such small structures. Vibration causes damaging strains in these components.

By adding machining chips with weight percentages of 5, 10, 15 and 20 Wt.%, with three different chip lengths added for each percentage (0.6, 0.8 and 1.18 mm), the three-point bending and damping characteristics tests are utilized to examine how manufacturing waste impacts the mechanical properties. Following that, the optimal lengths and the chip-to-epoxy ratio are determined. The chip dispersion and homogeneity are assessed using a field emission scanning electron microscope.

Waste copper alloys can be used to enhance the vibration-dampening properties of epoxy resin. The interface and bonding between the resin and the chip are crucial for enhancing the damping capabilities of epoxy. Controlling the flexural modulus by altering the chip size and quantity can change the damping characteristics because the two variables are inversely related. The critical chip size is 0.8 mm, below which smaller chips cannot evenly transfer, and disperse the vibration force to the epoxy matrix and larger chips may shatter and fracture.

The main source of problems in machine tools, aircraft and vehicle manufacturing is vibrations generated in the structures. These components suffer harmful strains due to vibration. Damping can be added to these structures to get over these problems. The distribution of energy stored as a result of oscillatory mobility is known as damping. To optimize the serving lifetime of a dynamic suit, this is one of the most important design elements. The use of composites in construction is a modern method of improving a structure's damping capacity. Additionally, it has been demonstrated that composites offer better stiffness, strength, fatigue resistance and corrosion resistance. This research aims to reduce the vibration effect by using copper alloy wastes as dampers.

The purpose of this paper was to investigate how variations in the geometry of silicon chips and the presence of surface defects affect their static bending properties. By comparing the bending radius and strength across differently sized and treated chips, the study sought to understand the underlying mechanics that contribute to the flexibility of silicon-based electronic devices. This understanding is crucial for the development of advanced, robust and adaptable electronic systems that can withstand the rigors of manufacturing and everyday use.

This study explores the impact of silicon chip geometry and surface defects on flexibility through a multifaceted experimental approach. The methodology included preparing silicon chips of three distinct dimensions and subjecting them to thinning processes to achieve a uniform thickness verified via scanning electron microscopy (SEM). Finite element method (FEM) simulations and a series of four-point bending tests were used to analyze the bending flexibility theoretically and experimentally. The approach was comprehensive, examining both the intrinsic geometric factors and the extrinsic influence of surface defects induced by manufacturing processes.

The findings revealed a significant deviation between the theoretical predictions from FEM simulations and the experimental outcomes from the four-point bending tests. Rectangular-shaped chips demonstrated superior flexibility, with smaller dimensions leading to an increased bending strength. Surface defects, identified as critical factors affecting flexibility, were analyzed through SEM and atomic force microscopy, showing that etching processes could reduce defect density and enhance flexibility. Notably, the study concluded that surface defects have a more pronounced impact on silicon chip flexibility than geometric factors, challenging initial assumptions and highlighting the need for defect minimization in chip manufacturing.

This research contributes valuable insights into the design and fabrication of flexible electronic devices, emphasizing the significant role of surface defects over geometric considerations in determining silicon chip flexibility. The originality of the work lies in its holistic approach to dissecting the factors influencing silicon chip flexibility, combining theoretical simulations with practical bending tests and surface defect analysis. The findings underscore the importance of optimizing manufacturing processes to reduce surface defects, thereby paving the way for the creation of more durable and flexible electronic devices for future technologies.

This paper aims to seek answers to the question: What are the relevant factors that allow not-for-profit innovation networks to successfully transition new technologies from proof-of-concept to commercialisation?

This question is examined using the knowledge-based view and network orchestration theory. Data are collected from 35 interviews with managers and engineers working within seven centres that comprise the High Value Manufacturing Catapult (HVMC). These centres constitute a not-for-profit innovation network where suppliers, customers and competitors collaborate to help transition new technologies across the “Valley of Death” (the gap between establishing a proof of concept and commercialisation).

Network orchestration theory suggests that a hub firm facilitates the exchange of knowledge amongst network members (knowledge mobility), to enable these members to profit from innovation (innovation appropriability). The hub firm ensures positive network growth, and also allows for the entry and exit of network members (network stability). This study of not-for-profit innovation networks suggests the role of a network orchestrator is to help ensure that intellectual property becomes a public resource that enhances the productivity of the domestic economy. The authors observed how network stability was achieved by the HVMC's seven centres employing a loosely-coupled hybrid network configuration. This configuration however ensured that new technology development teams, comprised of suppliers, customers and competitors, remained tightly-coupled to enable co-development of innovative technologies. Matching internal technical and sectoral expertise with complementary experience from network members allowed knowledge to flow across organisational boundaries and throughout the network. Matrix organisational structures and distributed decision-making authority created opportunities for knowledge integration to occur. Actively moving individuals and teams between centres also helped to diffuse knowledge to network members, while regular meetings between senior management ensured network coordination and removed resource redundancies.

The study contributes to knowledge-based theory by moving beyond existing understanding of knowledge integration in firms, and identified how knowledge is exchanged and aggregated within not-for-profit innovation networks. The findings contribute to network orchestration theory by challenging the notion that network orchestrators should enact and enforce appropriability regimes (patents, licences, copyrights) to allow members to profit from innovations. Instead, the authors find that not-for-profit innovation networks can overcome the frictions that appropriability regimes often create when exchanging knowledge during new technology development. This is achieved by pre-defining the terms of network membership/partnership and setting out clear pathways for innovation scaling, which embodies newly generated intellectual property as a public resource. The findings inform a framework that is useful for policy makers, academics and managers interested in using not-for-profit networks to transition new technologies across the Valley of Death.

This study aims to investigate the behavior of the green biomass-derived copper (lignin/silica/fatty acids) complex, copper lignin/silica/fatty acids (Cu-LSF) complex, when incorporated into the nonpolar ethylene propylene diene (EPDFM) rubber matrix, focusing on its reinforcing and antioxidant effect on the resulting EPDM composites.

The structure of the prepared EPDM composites was confirmed by Fourier-transform infrared spectroscopy, and the dispersion of the additive fillers and antioxidants in the EPDM matrix was investigated using scanning electron microscopy. Also, the rheometric characteristics, mechanical properties, swelling behavior and thermal gravimetric analysis of all the prepared EPDM composites were explored as well.

Results revealed that the Cu-LSF complex dispersed well in the nonpolar EPDM rubber matrix, in thepresence of coupling system, with enhanced Cu-LSF-rubber interactions and increased cross-linking density, which reflected on the improved rheological and mechanical properties of the resulting EPDM composites. From the various investigations performed in the current study, the authors can suggest 7–11 phr is the optimal effective concentration of Cu-LSF complex loading. Interestingly, EPDM composites containing Cu-LSF complex showed better antiaging performance, thermal stability and fluid resistance, when compared with those containing the commercial antioxidants (2,2,4-trimethyl-1,2-dihydroquinoline and N-isopropyl-N’-phenyl-p-phenylenediamine). These findings are in good agreement with our previous study on polar nitrile butadiene rubber.

The current study suggests the green biomass-derived Cu-LSF complex to be a promising low-cost and environmentally safe alternative filler and antioxidant to the hazardous commercial ones.

The number of people with special needs, including citizens and military personnel, has increased as a result of terrorist attacks and challenging conditions in Iraq and other countries. With almost 80% of the world’s amputees having below-the-knee amputations, Iraq has become a global leader in the population of amputees. Important components found in lower limb prostheses include the socket, pylon (shank), prosthetic foot and connections.

There are two types of prosthetic feet: articulated and nonarticulated. The solid ankle cushion heel foot is the nonarticulated foot that is most frequently used. The goal of this study is to use a composite filament to create a revolutionary prosthetic foot that will last longer, have better dorsiflexion and be more stable and comfortable for the user. The current study, in addition to pure polylactic acid (PLA) filament, 3D prints test items using a variety of composite filaments, such as PLA/wood, PLA/carbon fiber and PLA/marble, to accomplish this goal. The experimental step entails mechanical testing of the samples, which includes tensile testing and hardness evaluation, and material characterization by scanning electron microscopy-energy dispersive spectrometer analysis. The study also presents a novel design for the nonarticulated foot that was produced with SOLIDWORKS and put through ANSYS analysis. Three types of feet are produced using PLA, PLA/marble and carbon-covered PLA/marble materials. Furthermore, the manufactured prosthetic foot undergoes testing for dorsiflexion and fatigue.

The findings reveal that the newly designed prosthetic foot using carbon fiber-covered PLA/marble material surpasses the PLA and PLA/marble foot in terms of performance, cost-effectiveness and weight.

To the best of the author’s knowledge, this is the first study to use composite filaments not previously used, such as PLA/wood, PLA/carbon fiber and PLA/marble, to design and produce a new prosthetic foot with a longer lifespan, improved dorsiflexion, greater stability and enhanced comfort for the patient. Beside the experimental work, a numerical technique specifically the finite element method, is used to assess the mechanical behavior of the newly designed foot structure.

This review provides an overview of recent advances in electrochemical sensors for analyte detection in saliva, highlighting their potential applications in diagnostics and health care. The purpose of this paper is to summarize the current state of the field, identify challenges and limitations and discuss future prospects for the development of saliva-based electrochemical sensors.

The paper reviews relevant literature and research articles to examine the latest developments in electrochemical sensing technologies for saliva analysis. It explores the use of various electrode materials, including carbon nanomaterial, metal nanoparticles and conducting polymers, as well as the integration of microfluidics, lab-on-a-chip (LOC) devices and wearable/implantable technologies. The design and fabrication methodologies used in these sensors are discussed, along with sample preparation techniques and biorecognition elements for enhancing sensor performance.

Electrochemical sensors for salivary analyte detection have demonstrated excellent potential for noninvasive, rapid and cost-effective diagnostics. Recent advancements have resulted in improved sensor selectivity, stability, sensitivity and compatibility with complex saliva samples. Integration with microfluidics and LOC technologies has shown promise in enhancing sensor efficiency and accuracy. In addition, wearable and implantable sensors enable continuous, real-time monitoring of salivary analytes, opening new avenues for personalized health care and disease management.

This review presents an up-to-date overview of electrochemical sensors for analyte detection in saliva, offering insights into their design, fabrication and performance. It highlights the originality and value of integrating electrochemical sensing with microfluidics, wearable/implantable technologies and point-of-care testing platforms. The review also identifies challenges and limitations, such as interference from other saliva components and the need for improved stability and reproducibility. Future prospects include the development of novel microfluidic devices, advanced materials and user-friendly diagnostic devices to unlock the full potential of saliva-based electrochemical sensing in clinical practice.

The purpose of this paper is to design a new trajectory error compensation method to improve the trajectory tracking performance and compliance of the knee exoskeleton in human–exoskeleton interaction motion.

A trajectory error compensation method based on admittance-extended Kalman filter (AEKF) error fusion for human–exoskeleton interaction control. The admittance controller is used to calculate the trajectory error adjustment through the feedback human–exoskeleton interaction force, and the actual trajectory error is obtained through the encoder feedback of exoskeleton and the designed trajectory. By using the fusion and prediction characteristics of EKF, the calculated trajectory error adjustment and the actual error are fused to obtain a new trajectory error compensation, which is feedback to the knee exoskeleton controller. This method is designed to be capable of improving the trajectory tracking performance of the knee exoskeleton and enhancing the compliance of knee exoskeleton interaction.

Six volunteers conducted comparative experiments on four different motion frequencies. The experimental results show that this method can effectively improve the trajectory tracking performance and compliance of the knee exoskeleton in human–exoskeleton interaction.

The AEKF method first uses the data fusion idea to fuse the estimated error with measurement errors, obtaining more accurate trajectory error compensation for the knee exoskeleton motion control. This work provides great benefits for the trajectory tracking performance and compliance of lower limb exoskeletons in human–exoskeleton interaction movements.

The purpose of the present work is to study the impacts of rapid cooling and Tb rare-earth additions on the structural, thermal and mechanical behavior of Bi–0.5Ag lead-free solder for high-temperature applications.

Effect of rapid solidification processing on structural, thermal and mechanical properties of Bi-Ag lead-free solder reinforced Tb rare-earth element.

The obtained results indicated that the microstructure consists of rhombohedral Bi-rich phase and Ag99.5Bi0.5 intermetallic compound (IMC). The addition of Tb could effectively reduce the onset and melting point. The elastic modulus of Tb-containing solders was enhanced to about 90% at 0.5 Tb. The higher elastic modulus may be attributed to solid solution strengthening effect, solubility extension, microstructure refinement and precipitation hardening of uniform distribution Ag99.5Bi0.5 IMC particles which can reasonably modify the microstructure, as well as inhibit the segregation and hinder the motion of dislocations.

It is recommended that the lead-free Bi-0.5Ag-0.5Tb solder be a candidate instead of common solder alloy (Sn-37Pb) for high temperature and high performance applications.