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In this paper, we evaluated the impact of the US “Chip Act” on the participation of the Chinese electronics industry in the global value chain based on the dynamic CGE model. This is a meaningful attempt to use the GTAP-VA model to analyze the electronics industry in China.

We employ a Dynamic GTAP-VA Model to quantitatively evaluate the economic repercussions of the “Chip Act” on the Chinese electronic industries' GVC participation from 2023 to 2040.

The findings depict a discernible contraction in China’s electronic sector by 2040, marked by a −2.95% change in output, a −3.50% alteration in exports and a 0.45% increment in imports. Concurrently, the U.S., EU and certain Asian economies exhibit expansions within the electronic sector, indicating a GVC realignment. The “Chip Act” implementation precipitates a significant divergence in GVC participation across different countries and industries, notably impacting the electronics sector.

Through a meticulous temporal analysis, this manuscript unveils the nuanced economic shifts within the GVC, substantially bridging the empirical void in existing literature. This narrative accentuates the profound implications of policy regulations on global trade dynamics, contributing to the discourse on international economic policy and industry evolution.

We evaluated the impact of the US “Chip Act” on the participation of the Chinese electronics industry in the global value chain based on the dynamic CGE model. This is a meaningful attempt to use the GTAP-VA model to analyze the electronics industry in China.

The interaction between policy regulations and global value chain (GVC) dynamics is pivotal in understanding the contemporary global trade framework, especially within technology-driven sectors. The US “Chips Act” represents a significant regulatory milestone with potential ramifications on the Chinese electronic industries' engagement in the GVC.

The significance of this paper is that it quantifies for the first time the impact of the US Chip Act on the GVC participation index of East Asian countries in the context of US-China decoupling. With careful consideration of strategic aspects, this paper substantially fills the empirical gap in the existing literature by presenting subtle economic changes within GVCs, highlighting the profound implications of policy regulation on global trade dynamics.

Recently, powerful instruments for biomedical engineering research studies, including disease modeling, drug designing and nano-drug delivering, have been extremely investigated by researchers. Particularly, investigation in various microfluidics techniques and novel biomedical approaches for microfluidic-based substrate have progressed in recent years, and therefore, various cell culture platforms have been manufactured for these types of approaches. These microinstruments, known as tissue chip platforms, mimic in vivo living tissue and exhibit more physiologically similar vitro models of human tissues. Using lab-on-a-chip technologies in vitro cell culturing quickly caused in optimized systems of tissues compared to static culture. These chipsets prepare cell culture media to mimic physiological reactions and behaviors.

The authors used the application of lab chip instruments as a versatile tool for point of health-care (PHC) applications, and the authors applied a current progress in various platforms toward biochip DNA sensors as an alternative to the general bio electrochemical sensors. Basically, optical sensing is related to the intercalation between glass surfaces containing biomolecules with fluorescence and, subsequently, its reflected light that arises from the characteristics of the chemical agents. Recently, various techniques using optical fiber have progressed significantly, and researchers apply highlighted remarks and future perspectives of these kinds of platforms for PHC applications.

The authors assembled several microfluidic chips through cell culture and immune-fluorescent, as well as using microscopy measurement and image analysis for RNA sequencing. By this work, several chip assemblies were fabricated, and the application of the fluidic routing mechanism enables us to provide chip-to-chip communication with a variety of tissue-on-a-chip. By lab-on-a-chip techniques, the authors exhibited that coating the cell membrane via poly-dopamine and collagen was the best cell membrane coating due to the monolayer growth and differentiation of the cell types during the differentiation period. The authors found the artificial membrane, through coating with Collagen-A, has improved the growth of mouse podocytes cells-5 compared with the fibronectin-coated membrane.

The authors could distinguish the differences across the patient cohort when they used a collagen-coated microfluidic chip. For instance, von Willebrand factor, a blood glycoprotein that promotes hemostasis, can be identified and measured through these type-coated microfluidic chips.

The ‘chip carrier’ or CC is an intermediate support, hermetically sealed or otherwise, (of alumina, beryllium oxide or plastic) requires to connect an integrated circuit chip with numerous output pins to the outside world. This carrier at present represents the best compromise in terms of technology and economy, because of the use of standard multi‐source chips and the simple testing it permits.

Increasing demand for integrated circuits has put emphasis on the need for flexibility and productivity in any system developed to assemble them into systems. Added problems are created by the IC's fragility, size variation and minuteness.

The relentless drive towards greater complexity and interconnection density on silicon integrated circuit (SIC) devices is leading to a reappraisal of techniques for making electrical connections from the SIC to the next level of packaging. The techniques being examined include fine pitch Wire Bonding, Tape Automated Bonding (TAB) and Flip‐chip Solder Bonding. This latter technique forms the subject of this paper. The history of flip‐chip solder bonding technology is briefly reviewed and metallurgical, physical and mechanical aspects of the bonding process and of the resulting joints are discussed. The merits of the flip‐chip bonding process are indicated and applications examples presented. Particular attention is given to the fabrication of a novel pyroelectric‐SIC thermal imaging sensor using flip‐chip solder bonding.

The paper aims to investigate tool wear mechanism and tool geometry optimization of drilling PCB fixture hole.

An experimental study was carried out to investigate the chip formation and tool wear mechanism of drilling PCB fixture holes. Two types of drill with different types of chip-split groove were used in this study. The performances of these two types of drill bots were evaluated by tool wear and the shapes of chips.

The chips of drilling fixture holes contain aluminum chips from the cover board, copper chips from the copper foil, discontinuous glass fiber and resin from the CFRP. Feed rate and drilling speed have a great influence on the chip morphology. Abrasive wear of the drill lip is the main reason of the fixture drill bit in drilling PCB, and micro-chipping is observed on the tool nose and chisel edge. The influence of distance between the chip-split groove and drill point center on the axial force and torque is not obvious.

In this paper, hole wall roughness and drilling temperature were not analyzed in the optimization of drilling parameters. The future research work should consider them.

This paper investigated the mechanism of burr formation and tool wear in drilling of PCB fixture holes. Tool geometry was optimized by adding chip-split grooves.

3D chip stacking is a key technology for 3D integration in which two or more chips are stacked with vertical interconnections. In the case of multi chip stacking with fine pitch microbump connections, capillary dispensing presents big limitations in terms of cost and processability. The purpose of this paper is to describe the way in which wafer‐level underfill (WLUF) process development was carried out with particular emphasis on microbump height coplanarity, bonding pressure distribution and the alignment of the microbumps. A three factorial design of experiment (DOE) was also conducted to enhance the understanding of the factors impacting the WLUF process such as bonding pressure, temperature and time on reliability test.

B‐staged WLUF was laminated on an 8″ wafer with a 30 μm pitch bump structure of 8 μm Cu/5 μm Sn2.5Ag Pb‐free solder. After wafer dicing, the chip with the WLUF was assembled on a substrate chip with the same bump structure using a high accuracy bonder. The substrate chip had metalisation (wiring) to enable evaluation of the electrical characteristics of the bonded daisy chain chips as they varied with material bonding process conditions and reliability testing.

The WLUF bonding process development pertaining to the processability and reliability for the flip chip assembly using Cu/SnAg microbumps was successful in this work.

The development of a WLUF bonding process that offers reliability for flip chip assembly using Cu/SnAg microbumps has been presented in this work. The critical steps, such as alignment of the WLUF coated chip with the substrate chip and void elimination, which enable this technology to work were optimised.

Presents an overview of memory chip yield enhancement techniques by injection of fault tolerance. As memory chips are more prone to defects, the yield of good chips from a silicon wafer governs their production cost. As shown, most fault tolerance techniques assume a relatively large area overhead which results in additional costs in terms of the silicon used as well as the lower number of chips/wafers produced. Proper management of fault tolerance, as by the word redundancy approach, adds an almost negligible area overhead to the chip and leads to considerably higher yields.

Ultra-thin chip packaging (UTCP) is one of the flexible assembly technologies, by which thinned dies are encapsulated inside spin-coated dielectric films. For sake of higher density integration and bending stress suppression, two UTCPs can be stacked vertically. The purpose of this paper is to present an improved UTCP process flow to embed thinned chip in a symmetric dielectric sandwich for a flat topography. The UTCP flat top surface is suitable for metallization and further 3D stacking.

In the new process, a central photosensitive polyimide film is introduced, in which a cavity is made for the embedded chip. The cavity is defined by lithography using the chip itself as a photo-mask. In this way, the cavity size and position is self-aligned to the chip. The chip thickness is compensated by the surrounding central layer, and a UTCP with flat topography (flat UTCP) is realized after top dielectric deposition.

A batch of daisy chain test vehicles was produced. The feasibility of the process flow is verified by optical and electrical measurements. The result shows 100 percent yield, which is much better than previous work. A thermal humidity test showed no significant degradation of the flat UTCPs after 1,000 hours.

High yield fabrication of flat UTCP is first shown. An innovative self-alignment lithography step is introduced to make a cavity in dielectric for chip thickness compensation by using the chip itself as a photo-mask.