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The purpose of this paper is to comprehensively explore the effects of critical parameters on solder deposition and to establish a systematic approach for determining guidelines for solder paste inspection (SPI) workstations.

This study explored the effects of process parameters, stencil and printed circuit board designs on solder deposition and identified the major post‐reflow defect scenarios. Through the investigation of correlation between the results of SPI analysis and post‐reflow defective scenarios, SPI specifications are suggested for minimizing the total cost of poor quality.

The higher the printing pressure the lower the solder deposition. There was a significant difference in solder deposition between the front squeegee and the rear squeegee. Insufficient distance between the stencil aperture and the initial printing location resulted in irregular solder paste and variations in solder deposition. A stencil with a higher area ratio resulted in greater solder deposition and less variation. Stencil apertures parallel to the direction of printing were superior to a 45° vector print. Further, the nominal solder thickness should take into account the thicknesses of the solder mask and the legend ink. There was an offset in the results of SPI measurements between the solder mask defined (SMD) pads and non‐SMD pads. The specifications for solder deposition with irregular stencil apertures need to be adjusted.

To address the arbitrariness of existing industry practice, this study was a joint effort with a Taiwan‐based electronics manufacturing service company. Real data were taken from a mass production environment and inferences were then made based on a statistical analysis.

The purpose of this paper is to discuss the chemical characterization of failures and process materials for microelectronics assembly.

The analytical techniques used for chemical structures and compositions including Fourier transform infrared spectrometer (FTIR), scanning electron microscopy, and energy‐dispersive X‐ray spectroscopy are conducted.

The residues on the golden finger are identified to be the flux used in the assembly processes. Besides, the contaminants on the processed and incoming connector pins are verified to be polyamides (–CONH functional groups) from housing material's residue. Three liquid fluxes used in wave soldering are analyzed by their chemical structure. One flux showing the OH groups at 3430 cm⁻¹ indicates higher acid contents. This consists with the acidic values specified by the supplier. Also, the solder mask under study has ever appeared peeled‐off issue. The FTIR spectra results indicated 62.2 percent degree of curing while vendor's spec is above 70 percent.

The establishment of the Infrared spectra database for fluxes and process materials help determine the root cause of the contaminants to reduce re‐occurrence of similar problems and thus enhance the manufacturing capability. The infrared spectrophotometry technique can be used by professional original design manufacturing and/or electronics manufacturing service, providers to investigate board/component defects during product pilot run stage and volume production.