Fairchild Semiconductor’s Dual Cool™ package improves power density and performance in DC-DC power applications

Microelectronics International

ISSN: 1356-5362

Article publication date: 26 April 2013

57

Citation

(2013), "Fairchild Semiconductor’s Dual Cool™ package improves power density and performance in DC-DC power applications", Microelectronics International, Vol. 30 No. 2. https://doi.org/10.1108/mi.2013.21830baa.014

Publisher

:

Emerald Group Publishing Limited

Copyright © 2013, Emerald Group Publishing Limited


Fairchild Semiconductor’s Dual Cool™ package improves power density and performance in DC-DC power applications

Article Type: New products From: Microelectronics International, Volume 30, Issue 2

Designers of DC-DC conversion applications are challenged with improving power density while saving board space and reducing thermal resistance. Fairchild Semiconductor’s (NYSE: FCS) new mid-voltage PowerTrench® MOSFETs with Dual Cool™ packaging technology are well suited to help with these design challenges.

Fairchild has expanded and improved its Dual Cool packaging portfolio, an industry-standard pin-out package with top-side cooling, to include a 40-100 V mid-voltage series. Silicon technology advancements, paired with the Dual Cool technology, provide excellent switching performance as well as low junction-to-ambient thermal resistance that is four times less than the standard over-molded 5 mm×6 mm MLP.

Devices included in the mid-voltage series include the 40 V FDMS8320LDC, 60 V FDMS86500DC, 80 V FDMS86300DC and the 100 V FDMS86101DC. These devices are synchronous rectifying MOSFETs that are suitable for use in DC-DC converters, telecom secondary-side rectification and high-end server/workstation applications. For additional information on devices available in the Dual Cool package, please visit our website at: www.fairchildsemi.com/dualcool

Features and benefits

FDMS8320LDC (40 V):

  • Max RDS(ON)=1.1 mΩ at VGS=10 V, ID=44 A.

  • Max RDS(ON)=1.5 mΩ at VGS=4.5 V, ID=37 A.

FDMS86500DC (60 V):

  • Max RDS(ON)=2.3 mΩ at VGS=10 V, ID=29 A.

  • Max RDS(ON)=3.3 mΩ at VGS=8 V, ID=24 A.

FDMS86300DC (80 V):

  • Max RDS(ON)=3.1 mΩ at VGS=10 V, ID=24 A.

  • Max RDS(ON)=4.0 mΩ at VGS=8 V, ID=21 A.

  • Industry’s lowest RDS(ON) by approximately 35 percent as compared to competitive solution with same voltage rating.

FDMS86101DC (100 V):

  • Max RDS(ON)=7.5 mΩ at VGS=10 V, ID=14.5 A.

  • Max RDS(ON)=12 mΩ at VGS=6 V, ID=11.5 A.

Packing and pricing information (in US 1,000 quantity pieces)

Samples available upon request – delivery 8-12 weeks ARO

All devices in this product family are available in a PQFN 5x6 8L package and are priced at:

  • FDMS8320LDC (40 V): $1.09.

  • FDMS86500DC (60 V): $1.16.

  • FDMS86300DC (80 V): $1.16.

  • FDMS86101DC (100 V): $1.09.

Dual Cool packaged MOSFETs are part of Fairchild’s industry-leading MOSFET portfolio. By understanding the demands for higher current DC-DC power supplies in smaller footprints for space constrained applications, as well as our customers and the markets they serve, Fairchild can tailor its unique combination of functional, process and packaging innovation into solutions that make a difference in electronic designs.

To contact Fairchild Semiconductor about this product, please go to: www.fairchildsemi.com/cf/sales_contacts/

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