Mechanical behavior investigation of fused deposition modeling joints by using different bonding geometry with variable adhesive thickness

Abstract

Purpose

Adhesively bonded joints are used in many fields, especially in the automotive, marine, aviation, defense and outdoor industries. Adhesive bonding offers advantages over traditional mechanical methods, including the ability to join diverse materials, even load distribution and efficient thermal-electrical insulation. This study aims to investigate the mechanical properties of adhesively bonded joints, focusing on adherends produced with auxetic and flat surfaces adhered with varying adhesive thicknesses.

Design/methodology/approach

The research uses three-dimensional (3D)-printed materials, polyethylene terephthalate glycol and polylactic acid, and two adhesive types with ductile and brittle properties for single lap joints, analyzing their mechanical performance through tensile testing. The adhesion region of one of these adherends was formed with a flat surface and the other with an auxetic surface. Adhesively bonded joints were produced with 0.2, 0.3 and 0.4 mm bonding thickness.

Findings

Results reveal that auxetic adherends exhibit higher strength compared to flat surfaces. Interestingly, the strength of ductile adhesives in auxetic bonded joints increases with adhesive thickness, while brittle adhesive strength decreases with thicker auxetic bonds. Moreover, the auxetic structure displays reduced elongation under comparable force.

Originality/value

The findings emphasize the intricate interplay between adhesive type, bonded surface configuration of adherend and bonding thickness, crucial for understanding the mechanical behavior of adhesively bonded joints in the context of 3D-printed materials.

Citation

Kemiklioğlu, U., Demir, S. and Yüksel, C. (2024), "Mechanical behavior investigation of fused deposition modeling joints by using different bonding geometry with variable adhesive thickness", Rapid Prototyping Journal, Vol. 30 No. 3, pp. 547-554. https://doi.org/10.1108/RPJ-10-2023-0358