Preparation of water-resistant adhesives from soy flour with less water-soluble components for wood bonding
Article publication date: 3 July 2017
The purpose of this paper is to prepare a water-resistant adhesive (SA) from soy flour (SF) with less water-soluble components.
Defatted SF was suspended and stirred in water. Then, the pH of dispersion was adjusted to a predetermined value (i.e. 8, 9 or 10) by the addition of 2M sodium hydroxide (NaOH) solution. After stirring at a predetermined temperature (25°C, 35°C, 45°C) for different time (1 h, 2 h, 3 h), the 2M hydrochloric acid (HCl) solution was added in a dropwise manner into the dispersion until the pH value was adjusted to 4.5. Then, the dispersion was centrifuged at 6,000 rpm for 2 min. The obtained precipitate with less water-soluble components was used as an adhesive (SA) directly.
SA had a wet strength of 1.02 MPa when used for the fabrication of poplar plywood. Polyvinyl alcohol (PVA) solution was applied to improve the tack of SAs to wood surface and the viscosities of SAs were decreased from 10,200 cP to 4,100 cP at room temperature after the PVA addition. The soy proteins in SAs were not denatured to a large extent according to the differential scanning calorimetry and light microscopy. The remained multilevel structures of soy protein played a positive contribution to the water resistance of SAs, and the bond lines of cured SAs were much more stable than those of the cured SF and soy protein concentrate (SPC).
The fluidity and solid content of soy adhesives is much lower than formaldehyde adhesives. Further investigations are needed to improve the fluidity of soy adhesives with high solid contents.
Novel water-resistant soy adhesives were provided.
This work was funded by the National Promotion Project of Forestry Science and Technology (Grant Number 2016-2026) and the Technology Innovation Alliance of Wood & Bamboo Industry (Grant Number TIAWBI2015-01).
Gui, C., Zhu, J., Liu, X. and Zhang, Z. (2017), "Preparation of water-resistant adhesives from soy flour with less water-soluble components for wood bonding", Pigment & Resin Technology, Vol. 46 No. 4, pp. 253-258. https://doi.org/10.1108/PRT-04-2016-0042
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