Numerical study of heat transfer in high voltage solid insulating materials using transmission line method
ISSN: 0332-1649
Article publication date: 17 June 2022
Issue publication date: 20 January 2023
Abstract
Purpose
The purpose of this study is to numerically examine the heat transfer and transport of space charges in the solid insulating materials [low density polyethylene (LDPE), flame retardant type 4 (FR4), Polytetrafluoroethylene (PTFE)] using the transmission line modeling (TLM) method. Besides, a comprehensive study is performed on the mutual influences of heat transfer and space charges transport within the solid dielectric bulk.
Design/methodology/approach
The obtained governing equations including continuity and circuit equations are coupled with heat transfer equations, and they are solved via fourth-order Runge–Kutta method.
Findings
The electric potential and field, current density and temperature distribution are calculated. It is shown that compared with FR4 and PTFE, the temperature increment rate in LDPE is much lower. Moreover, the heat transfer in the solid insulating materials bulk increases the homo-charges density and temperature in the vicinity of electrodes. Hence, the reduction in electric field is reflected in the potential deformations in the proximity of electrodes. Furthermore, where the electric field is maximized, the temperature is minimized.
Research limitations/implications
This study is restricted to two-dimensional problems.
Originality/value
Interestingly, because of the lower temperature in LDPE, the current density and their increment rates in LDPE are much lower than that in FR4 and PTFE dielectric materials.
Keywords
Citation
Shamsi, A., Ganjovi, A. and Shayegani Akmal, A.A. (2023), "Numerical study of heat transfer in high voltage solid insulating materials using transmission line method", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 42 No. 2, pp. 353-377. https://doi.org/10.1108/COMPEL-01-2022-0049
Publisher
:Emerald Publishing Limited
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