Benefits of Thermoplastic Conductive Adhesive in Advanced Electronics Packaging Applications

Abstract

Conductive adhesive alternatives to tin/lead soldering have mainly concentrated on isotropic silver‐filled epoxy resins. These thermosetting polymers do not offer a universally successful solution and this may be fundamental to the use of epoxy itself. Another route being developed in a joint programme between Multicore Solders Ltd and Diemat, Inc., is based on thermoplastic polymers and offers benefits in the areas of reworkability, low modulus, low joint stress and possibly environmental stability. The novel process for compounding with silver can produce an order of magnitude improvement in electrical and thermal conductivity compared with typical epoxy/silver formulations, and initial environmental reliability data demonstrate compatibility with tin/lead coated components and board finish. A current application is outlined where a Hi‐Rel silicon on silicon hybrid (MCM) is realised using the silver/thermoplastic adhesive for both semiconductor die and passive chip components.

Citation

Firmstone, M.G., Bartholomew, P.M., Paterson, G., Dietz, R. and Robinson, P. (1997), "Benefits of Thermoplastic Conductive Adhesive in Advanced Electronics Packaging Applications", Microelectronics International, Vol. 14 No. 2, pp. 16-21. https://doi.org/10.1108/13565369710800484