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Briefly defines national origin discrimination before covering the guidelines of the Equal Employment Opportunity Commission. Considers the range of National origin Discrimination including height and weight requirements, accent discrimination, English only rules, harassment, immigration‐related practices and occupation qualifications. Provides some statistics on the current position and gives some recommendations for employers. Concludes that this needs addressing and the demographics suggest that could bcome a growing problem.

The purpose of this paper is to research the influence of inflation and delay in payment on the inventory model on Weibull distribution and present a new method of inventory control model for fresh agricultural products.

The previous researches deal with the inventory problems. However, these researches are based on deteriorating industrial products, so that the method for inventory model of agricultural products should be employed. According to agricultural products characteristics, the model assumes that deterioration is defined as fixed and demand is taken as Weibull distribution. An optimal order quantity and the minimum inventory total cost are formulated and solved under inflation and delay in payment.

The minimum inventory total cost and the optimal ordering quantity are convex with the length of the period with positive stock. When the delay period is longer than the length of the period with positive stock, the minimum inventory total cost and the optimal ordering quantity increase with permissible delay in payment increase and decrease with inflation rate increase, changing steeply with inflation rate and increasing permissible delay.

The market demand of fresh agricultural products is on two‐parameter Weibull distribution.

The paper gives useful advice for agricultural supply chain managers.

The paper presents a new method of inventory control for fresh agricultural products.

The purpose of this paper is to explain how enterprise resource planning (ERP) implementation evolves by cloud computing in different industries with different delivery models of cloud ERP. This paper also investigates infrastructure as a service (IaaS) as a delivery approach for cloud ERP. Case research on IaaS is rarely found in the literature. In addition, this paper intends to reveal how this transformation from on-premises to the cloud would influence the ERP implementation process.

A multiple-case study is conducted to identify the different deployed models of cloud ERP systems in the implementation projects. The influences of emerging cloud computing technology on ERP implementation are investigated by interviewing consultants related to the projects.

The findings illustrate that not only software as a service (SaaS) but also IaaS and platform as a service cloud computing services are widely applied in cloud ERP implementation. This study also indicates that certain technical limitations of cloud ERP might have a positive effect on the outcome of ERP implementation.

This study investigates how cloud computing influences ERP implementation from different aspects. The result identifies both SaaS and IaaS as two different approaches widely adopted in cloud ERP implementation. Besides, this study has discussed in-depth and analyzed these two cloud ERP paradigms in five factors, including functionality, performance, portability, security, cost and customization. The classification and suggestions are original to the literature.

Many historical urban cultural landscapes are suffering the effect of rapid urban economic development. This paper integrally relates historical sites in dispersed and point-shape distributions in cities and proposes strategies and methods for constructing urban linear cultural landscapes. As such, our work aims to form urban cultural landscape communities with an organic and linear distribution. The urban linear cultural landscape is not only an important means for integrally protecting and utilizing historical sites in historical cities but is also a special type of urban cultural landscape. The urban linear cultural landscape’s extensive application can enrich the theory of cultural landscape and protection methods of urban cultural heritage.

Deep excavation in soft clay often causes additional deformations to surroundings. Then, if deformations cannot be predicted reasonably, the adjacent buildings may be threatened by the deep excavation. Based on the good field observations from ten deep excavations in Hangzhou, this paper aims to thoroughly investigate the characteristics of wall deflections and ground settlements induced by deep excavations.

On the basis of good field observation of ten deep excavations, the performances of excavations, supported by contiguous pile in Hangzhou, were studied, and also compared with other case histories.

The maximum wall deflections (dhm) rang mostly from 0.7 to 1.2 per cent H_e, where He is the final excavation depth, larger than those in Taipei and Shanghai. The observed maximum ground settlement in the Hangzhou cases generally ranges from 0.2 to 0.8 per cent H_e. Then, the settlement influence zone extends to a distance of 2.0-4.0 H_e from the excavation. The relatively large movements and influence zones in Hangzhou may be attributed to low stability numbers, large excavation widths and the creep effect. The excavation width is justified to have a significant influence on the wall deflection. Therefore, to establish a semi-empirical formula for predicting the maximum wall deflection, it is necessary to include the factor of excavation width.

The relevant literature concentrated on the characteristics of deep excavations supported by the contiguous pile wall in Hangzhou soft clay can rarely be found. Based on the ten deep excavations with good field observation in Hangzhou, the characteristics of wall deflection and ground settlements were comprehensively studied for the first time, which can provide some theoretical support for similar projects.

Polyetheretherketone (PEEK) is used to manufacture biomedical implants because it has a high strength-to-weight ratio and high strength and is biocompatible. However, the use of fused deposition modeling to print a PEEK results in low strength and crystallinity. This study aims to use the Taguchi method to optimize the printing factors to obtain the highest tensile strength of the printed PEEK object. The annealing effect on printed PEEK object and crystallinity are also investigated.

This study determines the printing factors including the printing speed, layer thickness, printing temperature and extrusion width. Taguchi experimental design with a L9 orthogonal array is used to print the tensile specimen and carried out the tensile test to compare the tensile strength and porosity. Analysis of variance (ANOVA) is used to determine the experimental error and to determine the optimization printing parameters to obtain the highest tensile strength. A multivariate linear regression analysis is used to obtain the linear regression equation for predicting the theoretical tensile strength. An X-ray analysis is achieved to evaluate the crystalline of printed object. The effect of annealing is investigated to improve the tensile strength of printed part. An intervertebral lumber device is printed to demonstrate the feasibility of the obtained optimization parameters for practical application.

Taguchi experiment designs nine sets of parameters to print the PEEK tensile specimen. The experimental results and the ANOVA present that the order in which the factors affect the tensile strength for printed PEEK parts is the layer thickness, the extrusion width, the printing speed and the printing temperature. The optimized printing parameters are a printing speed of 5 mm/s, a layer thickness of 0.1 mm, a printing temperature of 395 °C and an extrusion strand width of 0.44 mm. The average tensile strength of printed specimen with the optimized printing parameters is 91.48 MPa, which is slightly less than the theoretical predicted value of 94.34 MPa. After annealing, the tensile strength increases to 98.85 MPa, which is comparable to that for molded PEEK and the porosity decreases to 0.3 from 3.9%. X-ray diffraction results show that all printed and annealed specimens have a high degree of crystallinity. The printed intervertebral lumber device has ultimate compressive load of 13.42 kN.

The optimized printing parameters is suitable for low-price fused deposition modeling machine because it does not involve a table at high temperature and can print the PEEK object with high tensile strength and good crystalline. Annealing parameters offer a good solution for tensile strength improvement.

The purpose of this study is to present a simplified analytical method to estimate ground lateral displacement due to excavation. Excavations of foundation pit will inevitably lead to soil movements that may adversely impact surrounding facilities or structures. Thus, estimation of the ground displacement induced by excavation is essential in engineering practice.

Based on a theory of elastic mechanics, a simplified analytical method for predicting the ground lateral displacement resulting from foundation pit excavation is proposed.

As the distance from the soil to the supporting structure increases, the maximum ground lateral displacement decreases nonlinearly but at a reduced rate. Poisson’s ratio of soil has a mild influence on the ground lateral displacement, whereas the influence of the supporting structure’s deflection modes is significant.

The advantage of the proposed simplified analytical method lies in that it considers the supporting structure’s arbitrary deflections, giving it wider practical applicability than previous methods.

To realize the operation optimizing of today’s distribution power system (DPS), like economic dispatch, contingency analysis, and reliability and security assessment etc., it is beneficial and indispensable that a faster linear load flow method is adopted with a reasonable accuracy. Considering the high R/X branch ratios and unbalanced features of DPS, the purpose of this paper is to propose a faster and non-iterative linear load flow solution for DPS.

Based on complex function theory, the derivations of the injection current linear approximation have been proposed for the balanced and the single-, double- and three-phase unbalanced loads of DPS on complex plane. Then, a simple and direct linear load flow has been developed with loop-analysis theory and node-branch incidence matrix.

The methodology is appropriate for balanced and single-, double- and three-phase hybrid distribution system with different load models. It provides a fast and robust load flow method with a satisfactory accuracy to handle the problems of DPS whenever the load flow solutions are required.

The distributed generators (DGs) with unity or fixed power factors can be easily included. But the power and voltage nodes cannot be dealt with directly and need to be further studied.

By combining the current linear approximation with the loop theory-based method, a new linear load flow method for DPS has been proposed. The method is valid and acute enough for balanced and unbalanced systems and has no convergent problems.

Solder bumps for chip interconnections are downsizing from current approximately 100 µm to the expected 1 µm in future. As a result, the Cu-Ni cross-interaction in Cu/Solder/Ni solder joints will be more complicated and then strongly influence the growth of the intermetallic compounds (IMCs). Thus, it is critical to understand the fundamental aspects of interfacial reaction in micro solder joints. This paper aims to reveal the effect mechanism of reflow temperature and solder size on the interfacial reaction in Cu/Solder/Ni solder joints.

The Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints with 50 and 100 µm solder sizes at 250°C and 300°C were observed, respectively. The line-type interconnects were soaked in silicone oil, and the temperature of the line-type interconnects was 250 ± 3°C and 300 ± 3°C, which were monitored by a fine K-type thermocouple, and followed by an isothermal aging process at various times. After aging, the specimens were removed from the silicone oil and cooled in the air to room temperature.

The major interfacial reaction product on both interfaces was (Cu,Ni)₆Sn₅, and the asymmetric growth of (Cu,Ni)₆Sn₅, evidenced by the thickness of (Cu,Ni)₆Sn₅ IMCs at the Sn/Ni interface was always larger than that at the Sn/Cu interface, resulted from the directional migration of Cu atoms toward the Sn/Ni interface under Cu concentration gradient. The morphology of (Cu,Ni)₆Sn₅ IMC at Sn/Cu interface was columnlike at 250°C, and which changed from columnlike to scallop with large aspect ratio at 300°C, while that at Sn/Ni interface gradually evolved from needlelike to the mixture of needlelike and layered at 250°C, and which evolved from needlelike to scallop with large aspect ratio at 300°C. The evolution of morphology of (Cu,Ni)₆Sn₅ is attributed to the content of Ni. Furthermore, the results indicate that the Cu-Ni cross-interaction was stronger with small solder size and relatively low temperature in the Cu/Sn/Ni micro solder joints.

The asymmetric growth of (Cu,Ni)₆Sn₅ in the Cu/Sn/Ni micro solder joints, evidenced by the thickness of (Cu,Ni)₆Sn₅ IMCs at the Sn/Ni interface, was always larger than that at the Sn/Cu interface. The morphology evolution of (Cu,Ni)₆Sn₅ IMC at both interfaces was attributed to the content of Ni. The Cu-Ni cross-interaction was stronger with small solder size and relatively low temperature in the Cu/Sn/Ni micro solder joints.