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The purpose of this study is to investigate the changes in the performance of ink formulations caused by the addition of compounds that improve the ink’s physical properties to achieve an optimum formulation for inkjet printing, because of the importance and simplicity of this method.

Ink samples were formulated using Acid Red 14 as ink colorant, different percentages of polymeric compounds including polyvinyl alcohol (PVA), polyvinylpyrrolidone and Carboxy methyl cellulose (CMC) as viscosity modifier compounds and surfactant as the surface tension enhancer. Formulated samples were adjusted in terms of fluid physical properties e.g. viscosity, density and surface tension, and the effect of used compounds on the improvement of both physical and colorimetric properties such as viscosity, surface tension, colorimetric coordinates and lightfastness has been evaluated to achieve the optimum printing inks to be printed on three different substrates.

The experimental observations showed that CMC was the most compatible compound as the viscosity modifier as its viscosity value was in the printable range of 2–22 cP. Moreover, a flow-curve test was applied to the ink samples and their Newtonian behavior was approved. Based on the spectrophotometric test results of printed samples, the samples containing PVA provided acceptable lightfastness in comparison to other ink samples on every used substrate.

An optimum relation between colorimetric coordinates of the printed samples and ink formulation could be considered and achieved.

The purpose of this paper is to study the flexural behavior of additively manufacture Ultem 1010 parts. Fused deposition modeling (FDM) process has become one of most widely used additive manufacturing methods. The process provides the capability of fabricating complicated shapes through the extrusion of plastics onto a print surface in a layer-by-layer structure to build three-dimensional parts. The flexural behavior of FDM parts are critical for the evaluation and optimization of both material and process.

This study focuses on the performance of FDM solid and sparse-build Ultem 1010 specimens. Flexure tests (three-point bend) are performed on solid-build coupons with varying build orientation and raster angle. These parameters are investigated through a full-factorial design of experiments (DOE) to determine optimal build parameters. Air gap, raster width and contour width are held constant. A three-dimensional nonlinear finite element model is built to simulate the flexural behavior of the FDM parts.

Experimental results include flexure properties such as yield strength and modulus, as well as analysis of the effect of change in build parameters on material properties. The sparse-build FDM parts chosen from the experimental tests are simulated based on this developed model. Thermo-mechanical simulation results show that the finite element simulation and experimental tests are in good agreement. The simulation can be further extended to other complicated FDM parts.

From the DOE study, sparse-build coupons with specific build parameters are fabricated and tested for the validation of a finite element simulation.

As firms turn their innovation activities toward collaborating with external partners, they face additional challenges in managing their knowledge. While different modes of intellectual property right regimes are applied in closed innovation systems, there seems to be tension between the concepts of “open innovation” and “intellectual property rights”. The purpose of this paper is to investigate how firms best manage knowledge via intellectual property rights in open innovation processes.

Following a mixed methods approach, the authors review relevant literature at the intersection of knowledge management, intellectual property rights, strategic management of intellectual property rights and the open innovation process. The authors identify success drivers through the lenses of – but not limited to – intellectual property rights and classify them in five distinct groups. Expending the view on open innovation beyond its modus operandi, the authors develop the Open Innovation Life Cycle, covering three stages and three levels of the open innovation process. The authors apply their findings to a case study in the pharmaceutical industry.

The authors provide four key contributions. First, existing literature yields inconclusive results concerning the enabling or disabling function of intellectual property rights in open innovation processes, but the majority of scholars detect an ambivalent relation. Second, they identify and classify success drivers of successful knowledge management via intellectual property rights in open innovation processes. Third, they advance literature on open innovation beyond its modus operandi to include three stages and three levels. Fourth, they test their findings to a case study and show how management leverages knowledge by properly using intellectual property rights in open innovation.

The findings support firms in managing knowledge via intellectual property rights in open innovation processes. Management should account for the peculiarities of open innovation preparation and open innovation termination to prevent unintentional knowledge drain.

This is one of the first studies to view open innovation as a process beyond its modus operandi by considering the preparations for and termination of open innovation activities. It also addresses the levels involved in managing knowledge via intellectual property rights in open innovation from individual (personal) to project and firm level.

An overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot‐dipped, plated, and plated‐and‐fused 100Sn and Sn‐Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all‐around best options in terms of solderability protection and wire bondability. Nickel/Pd finishes offer a slightly reduced level of performance in these areas which is most likely due to variable Pd surface conditions. It is necessary to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that include thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non‐Pb bearing solders are discussed.

The use of vapour phase heating as a rapid and uniform method of heat transfer is widely established in the electronics industry for reflow soldering of surface mounted devices. This technique has been extended to the curing of polymer thick film inks, an important and growing technology within the electronics industry. The availability of perfluoropolyether vapour phase fluids with boiling points from 130°C to 265°C now enables this technique to be used with a variety of different substrate materials, e.g., thermoplastic, paper phenolic and glass epoxy. This paper will examine the general benefits to be gained by curing PTF inks by vapour phase with respect to speed of cure, conductivity, resistor stability and solderability. It will discuss in detail a specific application for vapour phase curing using thermoplastic 3‐D printed circuit board where temperature of cure was of paramount importance. An outline of the production process will be given together with the results of a series of comprehensive electrical and long‐term life testing on the cured conductors and resistors. These will be compared with conventional methods of cure and the benefits of using vapour phase will be highlighted.

The purpose of this paper is a comparable evaluation of the influence of a particular element (Bi and Sb) added to Sn‐Ag‐Cu and Sn‐Zn alloys on their surface and interfacial tensions, as well as the wetting properties on the Cu substrate expressed by the wetting angle.

The authors applied the L₈ orthogonal Taguchi array to carry out the experiments and discussed the results using analysis of variance (ANOVA).

It was expected, on the base of previous studies, the decrease of the surface and interfacial tensions and thus improving wettability after the Bi and Sb addition to Sn‐Ag‐Cu and Sn‐Zn alloys. Unfortunately, the obtained results on the quinary Sn‐Ag‐Cu‐Bi‐Sb alloys and the quaternary Sn‐Zn‐Bi‐Sb alloys do not confirm these trends. The performed analyses suggest that the compositions of the quinary Sn‐Ag‐Cu‐Bi‐Sb alloys, as well as the quaternary Sn‐Zn‐Bi‐Sb alloys, do not have optimal compositions for practical application. The Cu, Bi and Sb elements in the case of the Sn‐Ag‐Cu‐Bi‐Sb alloys and the Zn, Bi and Sb elements in the case of the Sn‐Zn‐Bi‐Sb alloys show mutual interaction and, in consequence, there is no correlation between the tendency of the surface and interfacial tensions changes and the wettings of the Cu substrate.

It is suggested that further studies are necessary for the purpose of the practical application, but they should be limited mainly to the Sn‐Ag‐Cu‐Bi and the Sn‐Zn‐Bi alloys with the optimal compositions.

The performed analysis suggests that none of the investigated compositions of the quinary Sn‐Ag‐Cu‐Bi‐Sb alloys, as well as the quaternary Sn‐Zn‐Bi‐Sb alloys, have the optimal compositions for practical application.

The quickest way to determine which element of the alloy composition influences the surface tension and the wetting properties, and how, is to apply orthogonal analysis. After choosing the orthogonal array, the experiments were performed and analysis of variance (ANOVA) was used to perform the quantifiable analysis of the measured and calculated results of surface and interfacial tensions, as well as the wetting properties on the Cu substrate.

The purpose of this paper is to study the effect of copper concentration in near‐eutectic liquid SAC solders on their thermophysical properties: viscosity, surface tension, density; as well as wetting behavior on copper substrates at 523 K.

Viscosity, surface tension, and density were studied over a broad range of temperatures with the recently developed Roach‐Henein method. The obtained results were compared with the data from modified capillary, maximum bubble pressure, wetting balance and dilatometric measurements. Wetting angles measured with wetting balance method were compared with the results of sessile drop measurements.

The results obtained indicate that increasing concentration of copper in the alloy results in higher density, surface tension and viscosity, but differences resulting from copper concentration on wettability are relatively small. At 523 K, the density is: 7.097, 7.186, 7.232 g cm⁻³, the surface tension is: 538.1, 553.5, 556.7 m Nm⁻¹, the viscosity is: 2.173, 2.227, 2.467 mPas, respectively, for alloys containing 0.41, 1.01 and 1.61 wt% of Cu. Wetting angles on copper substrates are similar within a margin of error for all compositions. The results of present study are compared with the available literature data and a relatively good agreement is observed.

This paper provides the data of thermophysical properties of widely‐used SAC solders including viscosity, of which there is little data in the literature. It is confirmed that the increased copper concentration increases viscosity, yet this effect is small and does not correlate with the wetting behavior.

The main purpose of polymeric mixtures manufacturing is wish to eliminate or reduce drawbacks which polymers are characterised by and also to strive for reduction of the price of expensive polymers with particular very precious properties by mixing them with cheaper polymers but without significant deterioration of their properties. In the work some investigation results have been presented for PA6 which is miscible in viscoelastic state with polymer, with ability to create physical bounds with substances of inorganic as well as organic origins. For this purpose, polyvinylpyrrolidone (PVP) has been used with law molecular weight (10 ± 2,5 thousand). The functionalactive material was prepared with sharp tuning sorption ability across physical modification polycapramide mixed from bipolar polyvinylpyrrolidone in batch – free state, which characterises high ability complex. In the paper, some results of chosen properties of PA with the addition of polyvinylpyrrolidone (PVP) have been presented. In chance of mixing PA6 with PVP forms solution PVP in PA6, to which proper are large intermolecular influence, in this case hydrogen bond. It is possible to foresee that under the influences of large tangent stresses and intermolecular interaction colloidal solution PVP in PA forms with sure homogeneity, after cooling of it the inversion of winding phases is not noticeable In the mixtures on the basis of such polymers the intermolecular interactions occur, and they differently influence parameters of the modified materials. Conducted investigations have proved opportunity of physical modification of PA6 during mixing, in viscoelastic state, with polyvinylpyrrolidone. The modified polymer has dielectric properties and a reduced susceptibility to water absorption. It can be used as an insulation material, in all industrial sectors, including the energy sector.

For examinations, the following mixtures were made out: PA 99%/PVP 1%, PA 98%/PVP 2%, PA 90%/PVP 10%. Making mixtures out was begun with weighing elements out on numerical Sortorius AG GO TTINGEN scales and CAS MODEL: SW-1 (PA, PVP). Next elements of mixture were mixed with themselves mechanically. The process of drying was carried out in the ZELMET drier with the thermal kc-100/200 chamber in the temperature 80 °C for 12 h. The process of mixing up was carried out in the arrangement plasticising injections moulding machine of the voluted KRAUSS MAFFEI company KM 65-1600C1 (D screw = 30 mm and the L = 27D, the nozzle about d = 4 mm and the l = 2d) at the following parameters: is the nozzle temperature 230 °C, the speed of turnovers of the screw 210 obr/min. Granulated product of mixtures were get on the rotor grinder. Samples for examinations were made on the computer-operated injection moulding machine of type of KM 65-1600C1 of the KRAUSS MAFFEI company. The conditions which complement the homogeneity of a mixture – these include mixing processes with high shear stresses with the range of temperatures for viscoelastic state for the individual polymers. Such conditions are met by multiple mixing in the injection machine cylinder with extended perpetual screw length (L/D = 25 ÷ 42). Permanent conditions of injecting samples for the research on physical properties were the following: nozzle temperature – 230°C; worm area I temperature – 190°C; worm area II temperature – 210°C; worm area III temperature – 230-245°C, mould temperature 40°C, injection pressure – 60 MPa, clamping time – 5 s, cooling time – 30 s The research on chosen physical properties of getting polymer materials was carried out: hardnesses on hardness testing machine, impact resistance by Charpy’s method, mechanical properties while tension over the endurance machine the INSTON with tension speed of 90 mm/min, softening point by Vicat’s method was determined using testing machine type HAAKE N8, the investigation of DSC method and DMTA method using testing machine type Netzsch, water absorbing power test. The research on the structure was also carried out on the optical microscope type NIKON ECLIPSE E200.

In the paper, for the physical modification of PA 6, the polyvinylpyrrolidone (PVP) – amorphous polymer which is capable of ionisation and creation of complexes with the transition of the charge with many electrophilic compounds and also proton donors have been used. PVP does not change into the viscoelastic state but it is easily soluble in organic and inorganic solvents and the best in water. Its characteristic is high sorption capacity. As a result of ionisation changes PVP preserve the conformation changes. In case of mixing of polar PA6 polymers with PVP, a PVP solution is being created in PA, to whom big intermolecular interactions are proper for, in it hydrogen bonds. Reducing of polarity occurs of both polymers as a result of hydrogen bonds in created macromolecules. Macromolecule so they are interfering easily in fused condition creating the mixture about reliable homogeneity. An effect is applying to mixing with PA6 in case of dissolving PVP in the PA6 stop under the influence of big adjacent tensions in screw extruder what is calling changes of the supermolecular structure and properties of the material after chilling of stop in the form during injecting. The resultant homogeneous mixture is marked by one reflex narrowed in comparison with output PA6 of melting visible on DSC thermogram with moving to the page of higher tmmax temperatures. PA6/PVP mixtures are also providing effects of examinations about the homogeneity with DMTA method which shows results that the mixture is marked by one reflex of mechanical losses on the plot from (T_g) from the maximum at bigger than PA6 T_g (about 10 ÷ 15°C), and it is possible at the same time to reason that the mixture has not very thick frictional network as a result of the exchange of intermolecular bonds what is displayed itself in the increase in T_g intensity. The results of investigations show that PA with PVP additions create more stable material with visible homogeneity (due to strong intermolecular interactions) which is characterised by satisfactory mechanical properties which insignificantly differ from PA6 properties, but which shows higher deformability and sorptive power.

The results of investigations show that PA with PVP additions create more stable material with visible homogeneity (due to strong intermolecular interactions) which is characterised by satisfactory mechanical properties which insignificantly differ from PA6 properties, but which shows higher deformability and sorptive power. The modified polymer has dielectric properties and a reduced susceptibility to water absorption. It can be used as an insulation material, in all industrial sectors, including the energy sector.

Presents the influence of rheological properties of a sewing thread on its dynamical loads in a stitch formation process, or on change of thread strength as a consequence of dynamical loads in the sewing process, respectively. Research work shows the change in thread strength, as a result of the stitch formation process forming dynamic loads of a thread, as a function of rheological properties of a thread.

The purpose of this paper is to investigate the influence of In additions on the wetting properties of the Sn2.86Ag0.40Cu (in wt%) eutectic‐based alloys, on a copper substrate, in the presence of a flux. The main goal was to find correlations between the results of the wetting balance (WB) and the sessile drop (SD) method, in relation to the contact angles.

The WB method was applied for the wetting measurements, at 250°C, in an air atmosphere and in the presence of a flux. The SD measurements were conducted at the same temperature, in the presence of the same flux, but in an Ar atmosphere, while the maximum bubble pressure (MBP) and dilatometric measurements were conducted in an Ar+H₂ atmosphere. The density data from the dilatometric method were used for the determination of the surface tension by means of MBP, and the WB method was used to determine the surface and interfacial tension. Next, the surface tension data from these two methods were compared. The WB data were used to calculate the contact angles and the obtained indirect data were compared with the results of the direct SD measurements of the contact angle.

A higher In content in the alloy resulted in a lower contact angle on the copper, and the WB results agreed well with the results of the SD experiments. It was confirmed that, in liquid In‐Sn and the alloys containing In and Sn (Ag‐In‐Sn, Sn‐Ag‐Cu‐In, Sn‐Zn‐In), the improvement of the wettability was indicated only by the increase of the contact angle with the increasing In content.

Further studies are necessary for the confirmation of practical application, but they should be directed to the soldering of high indium alloys on printed circuit boards, with different finishes and qualities of the solder joint performance.

Taking into account the contact angle data from the WB and SD methods, the best results of the SAC‐In alloy on copper were obtained for the alloy of the highest In content. It was found that the contact angles from SD after 4 s were higher (non‐equilibrium conditions) than the values calculated from WB after 3 s. In contrast, the contact angles from SD after 10 min (equilibrium conditions) were lower than those from WB after 3 s. The comparison suggests that the contact angles from WB are situated within the data from SD, showing the same lowering tendency with the increasing content of In, and they may be well accepted for practical purposes. On the other hand, the sample of the solder in the SD method, after a prolonged time – in order to get the equilibrium contact angle – may be used to study the interfacial phenomena with the Cu substrate. The differential thermal analysis results indicate that the melting temperature decreases with increasing tin concentration. Taking into account the results of this study and the available literature data, alloys containing 8‐10 wt% of In can be recommended for practical application.

The WB and SD methods were used for the contact angle determination of a wide range of solder compositions, in the same temperature and flux conditions. Also, the surface tensions for these alloys were determined with the use of two independent methods: the MBP and the WB methods. The results obtained made it possible to draw conclusions regarding the correlation between the output of different methods and the conditions in which a comparison of the results can be made. It is supposed that these observations apply to many other alloy systems.