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Testing has become one of the dominant costs in the process of bringing a product from initial conception to the market place. Because of this, it is now imperative that the impact of any technology change on the test process is considered at an early stage. In this light, the increasing trend towards the use of surface‐mounting techniques in the fabrication of electronic systems is examined, with particular emphasis on the consequences on product testing during design validation, manufacture and repair. The aim is to highlight areas in which new attitudes and replacements for traditional solutions will be needed if surface‐mounting techniques are to be as cost‐effective as possible.

The introduction of surface mount technology has changed the approach which is needed for successful rework of components. This has been brought about by the requirement of simultaneous reflow of all joints to remove the component from the board. To meet this need, manual soldering methods have been adapted, and subsequently complemented, with dedicated hot bar, hot gas and infra‐red systems. Each of these techniques with their respective applicability is considered, prior to a discussion of the parameters which need to be addressed before embarking on successful rework. All aspects of component, board and the joint itself are considered. The procedure for addressing rework is then laid out, providing a standard methodology to obtain rework joints which maintain the quality of the production joints.

The International Electronic Components Show in Paris in November, 1983, provided the occasion for a very successful meeting of ISHM‐France which attracted 170 attendees. The following presentations were given:

Laser soldering, as a viable technique for surface mounting assemblies, is reviewed. The criteria for selection of a CO2 or a Nd:YAG laser are discussed. New data are given that quantify the beneficial effects of laser soldering on the solder fillet microstructure, and how this relates to in‐service performance.

Soldering techniques for surface mount technology are still in their early stages. Therefore, a survey is given of the main soldering methods which are currently used in research and production as well as those which are expected to come into use, such as wave soldering, infra‐red soldering, vapour phase soldering and laser soldering. These techniques are influenced by both the component and board design. Even in soldering surface mount components, a number of rules must be observed in order to produce a good solder joint.

Solder has been the primary method of component attachment since the early days of radio. This tradition carries with it an overhead which becomes increasingly expensive as the degree of miniaturisation increases. Solderless interconnect methods, however, are often overlooked or unfairly discounted as unreliable. Surprisingly, solderless connections can be mechanically superior to and environmentally more robust than their soldered peers. This paper reviews various solderless interconnect techniques for surface mount applications and discusses their relative merits.

Alpha Metals Ltd (UK) have announced the appointment of David Crimp to the position of General Manager. Having served the company for four years as Sales Manager, Mr Crimp now assumes complete responsibility for Alpha's entire UK operation. Prior to his appointment with Alpha Metals, he was employed by AMAX in both the UK and France.

This paper describes how PCB designers must adjust their approach to take into account the new requirements for the production of high technology printed circuit boards using the latest plated‐through hole and surface mounting techniques. It also describes how the correct use of dry film solder masks is contributing towards the achievement of zero‐defect soldering.

Anicon, Inc. have recently appointed Friedrich Weiler as Managing Director, Anicon Europa, GmbH, and have announced the opening of Anicon's European headquarters facility in Munich.

I was an invited speaker to the ISHM‐Benelux meeting. As I arrived early, I also sat in on the committee meeting as an observer. Jos B. Peeters was the outgoing president and the incoming committee was widened to about 15 members compared with the previous 6. Following the unanimous election of all those nominated, the committee reconvened and elected Mr Kwikkers as the new president of ISHM‐Benelux. He is a professor at the Technische Hogeschole in Delft.