Designing for Zero‐defect Soldering
M. Weinhold
(Du Pont de Nemours International SA, Geneva, Switzerland)
53
Abstract
This paper describes how PCB designers must adjust their approach to take into account the new requirements for the production of high technology printed circuit boards using the latest plated‐through hole and surface mounting techniques. It also describes how the correct use of dry film solder masks is contributing towards the achievement of zero‐defect soldering.
Citation
Weinhold, M. (1986), "Designing for Zero‐defect Soldering", Circuit World, Vol. 12 No. 4, pp. 5-8. https://doi.org/10.1108/eb043829
Publisher
:MCB UP Ltd
Copyright © 1986, MCB UP Limited