From Soldering Iron to Laser A Review of Soldering Methods for Surface Mounting

Abstract

Soldering techniques for surface mount technology are still in their early stages. Therefore, a survey is given of the main soldering methods which are currently used in research and production as well as those which are expected to come into use, such as wave soldering, infra‐red soldering, vapour phase soldering and laser soldering. These techniques are influenced by both the component and board design. Even in soldering surface mount components, a number of rules must be observed in order to produce a good solder joint.

Citation

Becker, G. (1987), "From Soldering Iron to Laser A Review of Soldering Methods for Surface Mounting", Microelectronics International, Vol. 4 No. 1, pp. 22-27. https://doi.org/10.1108/eb044256